The XC2S200-6FGG543C is a high-performance Field Programmable Gate Array from AMD’s (formerly Xilinx) renowned Spartan-II FPGA family. This programmable logic device delivers exceptional flexibility and reliability for demanding digital design applications. Engineers seeking a cost-effective alternative to mask-programmed ASICs will find this Xilinx FPGA solution offers superior versatility with shorter development cycles.
Key Features of the XC2S200-6FGG543C Spartan-II FPGA
The XC2S200-6FGG543C combines robust architecture with advanced programmable capabilities. The XC2S200 device contains 5,292 logic cells and 200,000 system gates Mouser, providing substantial resources for complex digital implementations. This FPGA features a 28 x 42 CLB array with 1,176 total configurable logic blocks Mouser, enabling flexible hardware configurations.
Core Architecture Specifications
The device offers 75,264 bits of distributed RAM and 56K bits of dedicated block RAM Mouser. This dual-memory architecture allows designers to implement both shallow memory structures within CLBs and larger memory blocks for data-intensive applications. The -6 speed grade designation indicates this device operates at the fastest speed grade available in the Spartan-II family.
Package and Pin Configuration
The FGG543C package utilizes Fine-Pitch Ball Grid Array technology, ensuring reliable connections and excellent thermal performance. The XC2S200 supports up to 284 maximum available user I/O pins University of New Mexico, providing extensive connectivity options for complex system designs. The “G” in the part number indicates Pb-free (lead-free) packaging, making this device RoHS compliant.
Technical Specifications Table
| Parameter |
Specification |
| Device Family |
Spartan-II |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| CLB Array |
28 x 42 |
| Total CLBs |
1,176 |
| Distributed RAM |
75,264 bits |
| Block RAM |
56K bits |
| Maximum User I/O |
284 |
| Core Voltage |
2.5V |
| Maximum Clock Frequency |
263 MHz |
| Process Technology |
0.18μm |
| Speed Grade |
-6 (Fastest) |
| Temperature Range |
Commercial (0°C to 85°C) |
| Package Type |
Fine-Pitch BGA (Pb-free) |
Block RAM and Memory Architecture
Block RAM memory blocks are organized in columns, with two columns positioned along each vertical edge of the die extending the full height of the chip. University of New Mexico Each block RAM cell is a fully synchronous dual-ported 4096-bit RAM with independent control signals for each port, and the data widths of the two ports can be configured independently. University of New Mexico
Distributed RAM Capabilities
The distributed RAM complements the block RAM by providing smaller, faster memory structures embedded within the configurable logic blocks. This hierarchical memory architecture enables optimal resource utilization for various application requirements.
I/O Standards and Voltage Compatibility
The device supports multiple I/O standards with LVTTL, LVCMOS2, and PCI being 5V tolerant. University of New Mexico Advanced features include support for multiple I/O standards including LVTTL, LVCMOS, and PCI. RayPCB This broad I/O compatibility ensures seamless integration with existing system components and bus interfaces.
I/O Bank Configuration
Within a bank, output standards may be mixed only if they use the same VCCO voltage. University of New Mexico This banking structure provides flexibility while maintaining signal integrity across different voltage domains.
Clock Management with Delay-Locked Loops
The Spartan-II family features four DLLs (Delay-Locked Loops) Hillman Curtis, positioned at each corner of the die. The DLL also operates as a clock mirror, allowing the output from a DLL to drive off-chip and back on again to deskew board-level clocks among multiple Spartan-II devices. University of New Mexico
Clock Distribution Network
The primary global nets may only be driven by global buffers University of New Mexico, ensuring clean, low-skew clock distribution throughout the device. This architecture supports system performance up to 200 MHz for demanding timing-critical applications.
Applications for the XC2S200-6FGG543C FPGA
Spartan-II FPGAs are typically used in high-volume applications where the versatility of a fast programmable solution adds benefits. University of New Mexico This industrial-grade device combines high performance with low power consumption, making it ideal for telecommunications, automotive, industrial control, and consumer electronics projects. RayPCB
Industrial and Commercial Use Cases
The XC2S200-6FGG543C excels in applications requiring:
- Digital signal processing systems
- Communication protocol implementations
- Industrial automation controllers
- Embedded control systems
- Data acquisition equipment
- Video and image processing
- Interface bridging solutions
Configuration and Programming Options
The device features in-system programmability via JTAG interface RayPCB, enabling convenient field updates without hardware replacement. Built-in boundary scan supports testing and debugging RayPCB during development and production phases.
Configuration Modes
Multiple configuration options accommodate various system requirements:
- Serial configuration using platform flash memory
- Parallel configuration for faster loading
- JTAG-based programming for development
- Slave parallel mode for processor-controlled configuration
Development Tools and Design Software
The device is fully supported by Xilinx ISE Design Suite, providing complete design entry, synthesis, implementation, and verification capabilities. RayPCB VHDL and Verilog hardware description languages enable efficient design capture and simulation.
Design Resources Available
Engineers can access comprehensive documentation including:
- Complete datasheet with electrical specifications
- User guides with implementation guidelines
- Application notes for design best practices
- Reference designs for common applications
- IP cores for accelerated development
Why Choose the XC2S200-6FGG543C for Your Project
The Spartan-II device is a superior alternative to mask-programmed ASICs, avoiding the initial cost, lengthy development cycles, and inherent risk of conventional ASICs. FPGAkey The programmability permits design upgrades in the field with no hardware replacement necessary. FPGAkey
Cost-Effective Programmable Solution
The XC2S200-6FGG543C provides an excellent balance between performance, functionality, and cost. Its reprogrammable nature reduces time-to-market while allowing iterative design improvements throughout the product lifecycle.
Ordering Information and Availability
The part number XC2S200-6FGG543C follows AMD’s standard naming convention:
- XC2S200: Device type (Spartan-II, 200K gates)
- -6: Speed grade (fastest)
- FGG: Fine-pitch BGA, Pb-free
- 543: Pin count
- C: Commercial temperature range
