The AMD XC2S200-6FGG537C is a high-performance Field Programmable Gate Array (FPGA) from the renowned Spartan-II family. This programmable logic device delivers exceptional flexibility, reliability, and cost-effectiveness for demanding digital design applications. Engineers and designers seeking a powerful alternative to traditional ASICs will find the XC2S200-6FGG537C offers unmatched versatility with its 200,000 system gates and advanced architecture.

Key Features of the XC2S200-6FGG537C FPGA

The XC2S200-6FGG537C combines cutting-edge semiconductor technology with a robust feature set designed for high-performance applications. This Xilinx FPGA device operates on 0.18μm CMOS process technology, enabling superior speed and power efficiency.

Core Architecture Specifications

The XC2S200-6FGG537C features a comprehensive architecture built around Configurable Logic Blocks (CLBs) surrounded by programmable Input/Output Blocks (IOBs). The device includes:

• System Gates: 200,000 gates for complex digital implementations
• Logic Cells: 5,292 logic cells providing extensive design resources
• CLB Array: 28 × 42 array configuration with 1,176 total CLBs
• Speed Grade: -6 (fastest available for commercial temperature range)
• Package Type: FGG537 Fine-Pitch Ball Grid Array
• Core Voltage: 2.5V for optimal power consumption
• I/O Voltage Compatibility: 1.8V to 3.3V for flexible system integration

XC2S200-6FGG537C Technical Specifications

Memory Resources and Block RAM

The XC2S200-6FGG537C provides abundant memory resources essential for data-intensive applications:

• Distributed RAM: 75,264 bits available for small, fast memory implementations
• Block RAM: 56K bits organized in 14 dedicated RAM blocks
• Dual-Port RAM: Each block RAM supports fully synchronous dual-port operation with independent control signals
• Configurable Port Widths: Supports 1-bit × 4096, 2-bit × 2048, 4-bit × 1024, 8-bit × 512, and 16-bit × 256 configurations

Clock Management with Delay-Locked Loops

Four dedicated Delay-Locked Loops (DLLs) provide sophisticated clock management capabilities:

• Zero Propagation Delay: DLLs eliminate clock distribution delays
• Clock Deskewing: Minimizes clock skew across the device
• Clock Mirroring: Enables board-level clock synchronization between multiple FPGAs
• Duty Cycle Correction: Automatic 50/50 duty cycle adjustment
• Frequency Synthesis: Supports clock multiplication and division

User I/O Configuration

The XC2S200-6FGG537C delivers extensive I/O capabilities:

• Maximum User I/Os: Up to 284 user-configurable I/O pins
• I/O Standards Supported: LVTTL, LVCMOS2, LVCMOS18, PCI 33MHz/66MHz, GTL, GTL+, HSTL, and SSTL
• 5V Tolerance: LVTTL, LVCMOS2, and PCI inputs are 5V tolerant
• Eight Independent I/O Banks: Allows multiple voltage standards within single design
• Programmable Slew Rate: Fast and slow output slew rate control
• Pull-up/Pull-down Resistors: Programmable internal resistors on all I/O pins

Performance Characteristics of the Spartan-II XC2S200

Speed and Timing Parameters

The -6 speed grade designation indicates the XC2S200-6FGG537C operates at the highest performance level available for commercial applications:

• Maximum System Clock Rate: Up to 200 MHz operation
• Fast Carry Logic: Dedicated carry chain for high-speed arithmetic operations
• Predictable Interconnect: Consistent timing across design iterations
• Low-Skew Global Clock Networks: Four primary and four secondary global clock lines

Power Management

Efficient power consumption makes the XC2S200-6FGG537C suitable for power-sensitive designs:

• Low Static Power: 0.18μm process technology minimizes leakage current
• Dynamic Power Scaling: Power consumption scales with operating frequency and utilization
• Multiple Power Supply Rails: Separate VCCINT (2.5V) and VCCO (bank-specific) supplies
• Hot-Swap Compliance: Designed for safe insertion/removal in powered systems

FGG537 Package Information

Ball Grid Array Package Details

The FGG537 package offers optimal balance between I/O density and PCB design flexibility:

• Package Type: Fine-Pitch Ball Grid Array (FBGA)
• Total Ball Count: 537 balls
• Ball Pitch: 1.0mm fine pitch for high-density PCB layouts
• Package Dimensions: Compact form factor for space-constrained applications
• Pb-Free Option: “G” designation indicates RoHS-compliant lead-free packaging

Thermal Considerations

Proper thermal management ensures reliable XC2S200-6FGG537C operation:

• Commercial Temperature Range: 0°C to +85°C operating temperature
• Thermal Resistance: Package designed for efficient heat dissipation
• PCB Layout Guidelines: Four-layer or greater PCB recommended for optimal thermal performance

Configuration and Programming Options

Multiple Configuration Modes

The XC2S200-6FGG537C supports various configuration methods:

• Master Serial Mode: FPGA generates clock, reads from serial PROM
• Slave Serial Mode: External controller provides clock and data
• Slave Parallel Mode: 8-bit parallel data input for faster configuration
• Boundary-Scan (JTAG): IEEE 1149.1 compliant for in-system programming and testing

Configuration Memory

• Configuration Bits: 1,335,840 bits required for full device configuration
• In-System Reprogramming: Unlimited reprogramming cycles
• Readback Capability: Configuration data can be verified after loading
• Partial Reconfiguration: Supports dynamic logic modification

Application Areas for the XC2S200-6FGG537C

Industrial and Commercial Applications

The XC2S200-6FGG537C excels in numerous application domains:

• Digital Signal Processing: High-speed DSP implementations with dedicated multipliers
• Telecommunications Equipment: Protocol bridging, data encoding/decoding
• Networking Infrastructure: Packet processing, switching fabric implementation
• Industrial Automation: Motor control, sensor interfaces, PLC functions
• Medical Devices: Signal acquisition, data processing, display controllers
• Consumer Electronics: Video processing, audio enhancement, interface bridging

Prototyping and Development

Engineers frequently select the XC2S200-6FGG537C for:

• ASIC Prototyping: Validate custom silicon designs before tape-out
• Algorithm Development: Implement and test DSP algorithms in hardware
• System Integration: Glue logic and interface adaptation between components
• Legacy System Upgrades: Replace obsolete components with programmable solutions

Design Resources and Development Tools

Software Support

Complete design tool support accelerates XC2S200-6FGG537C development:

• ISE Design Suite: Full synthesis, implementation, and verification environment
• HDL Support: VHDL and Verilog design entry
• Schematic Capture: Graphical design entry option
• Simulation: Integrated behavioral and timing simulation
• Timing Analysis: Static timing analysis with detailed reports

Documentation and Technical Support

Comprehensive resources support XC2S200-6FGG537C implementation:

• Datasheet (DS001): Complete electrical and timing specifications
• User Guide: Detailed architectural information and design guidelines
• Application Notes: Best practices for specific applications
• Reference Designs: Proven design examples for common functions
• PCB Layout Guidelines: Signal integrity and thermal management recommendations

Advantages Over Traditional ASICs

Cost-Effective Development

The XC2S200-6FGG537C eliminates ASIC-related expenses:

• No NRE Costs: Zero non-recurring engineering charges
• Reduced Development Time: Weeks instead of months for design completion
• Lower Risk: Design changes possible throughout development cycle
• Inventory Flexibility: Single device type covers multiple applications

Field Upgradeability

Programmable architecture enables post-deployment modifications:

• Bug Fixes: Correct logic errors without hardware replacement
• Feature Additions: Implement new functionality via configuration updates
• Performance Optimization: Fine-tune designs based on real-world operation
• Standards Evolution: Update protocols and interfaces as standards change

Ordering Information and Part Number Decoder

Understanding the XC2S200-6FGG537C Part Number

• XC2S200: Spartan-II family, 200K system gate density
• -6: Speed grade (fastest commercial)
• FG: Fine-pitch Ball Grid Array base package
• G: Pb-free (lead-free) RoHS compliant
• 537: Total ball count
• C: Commercial temperature range (0°C to +85°C)

Related Part Numbers

Engineers may also consider these XC2S200 variants:

• XC2S200-6FGG256C: 256-ball package for reduced I/O requirements
• XC2S200-5FGG537C: -5 speed grade for cost-optimized applications
• XC2S200-5FGG537I: Industrial temperature range (-40°C to +100°C)

Conclusion

The AMD XC2S200-6FGG537C Spartan-II FPGA represents an excellent choice for engineers requiring high-performance programmable logic in a cost-effective package. With 200,000 system gates, 5,292 logic cells, 56K bits of block RAM, and comprehensive I/O flexibility, this device addresses a wide range of digital design challenges. The -6 speed grade ensures maximum performance, while the FGG537 package provides the I/O density and thermal characteristics needed for demanding applications.

Whether developing telecommunications equipment, industrial control systems, or prototyping custom ASICs, the XC2S200-6FGG537C delivers the flexibility, performance, and reliability that modern electronic designs demand.