Overview of XC3164A-3TQ144C FPGA
The XC3164A-3TQ144C is a powerful field programmable gate array (FPGA) from AMD Xilinx’s renowned XC3100A family. This programmable logic device delivers exceptional flexibility and performance for embedded systems, industrial automation, and digital signal processing applications. Designed with 224 configurable logic blocks (CLBs) and housed in a compact 144-pin TQFP package, this FPGA provides an ideal solution for designers seeking reliable, high-speed programmable logic functionality.
As a member of the XC3000A series, the XC3164A-3TQ144C represents proven technology trusted by engineers worldwide for over three decades. This Xilinx FPGA offers the perfect balance of gate density, performance, and cost-effectiveness for mid-range digital design projects.
Key Technical Specifications
Core FPGA Features
| Specification |
Value |
| Part Number |
XC3164A-3TQ144C |
| Manufacturer |
AMD Xilinx (formerly Xilinx Inc.) |
| Product Family |
XC3100A Series |
| Logic Blocks |
224 CLBs (Configurable Logic Blocks) |
| Equivalent Gates |
4,500 usable gates |
| Package Type |
144-pin TQFP (Thin Quad Flat Pack) |
| Mounting Style |
Surface Mount Technology (SMT) |
| Operating Temperature |
0°C to +85°C (Commercial Grade) |
| Supply Voltage |
5V ±5% |
Performance Characteristics
| Parameter |
Specification |
| Speed Grade |
-3 (Standard Speed) |
| Maximum Clock Frequency |
Up to 270 MHz |
| Total I/O Pins |
124 user-configurable I/O pins |
| RAM Bits |
5.6 KB internal memory |
| Programmable Interconnect |
Segmented routing architecture |
| Configuration Method |
SRAM-based programming |
Physical and Environmental Specifications
| Characteristic |
Details |
| Package Dimensions |
20mm x 20mm x 1.4mm |
| Pin Pitch |
0.5mm |
| Weight |
Approximately 0.5g |
| Moisture Sensitivity Level |
MSL 3 (per JEDEC J-STD-020) |
| RoHS Compliance |
Yes (Lead-free compatible) |
| Storage Temperature |
-65°C to +150°C |
Advanced Architecture and Technology
Configurable Logic Blocks (CLBs)
The XC3164A-3TQ144C features 224 configurable logic blocks arranged in a 16×14 array. Each CLB contains two 4-input look-up tables (LUTs), programmable flip-flops, and multiplexers that can implement any combinational or sequential logic function. This architecture provides exceptional flexibility for implementing complex digital circuits including state machines, counters, decoders, and arithmetic functions.
Programmable Interconnect Resources
The FPGA utilizes a hierarchical routing architecture with segmented interconnect lines that minimize signal propagation delays. The interconnect matrix provides connections between CLBs, I/O blocks, and global routing resources, enabling efficient implementation of both localized and distributed logic functions.
Input/Output Architecture
With 124 user-configurable I/O pins, the XC3164A-3TQ144C supports multiple I/O standards including TTL, CMOS, and various high-speed interfaces. Each I/O cell features programmable slew rate control, pull-up/pull-down resistors, and three-state output capability, making it compatible with a wide range of external devices and systems.
Primary Applications and Use Cases
Industrial Automation and Control Systems
The XC3164A-3TQ144C excels in industrial control applications where reliable, deterministic logic operations are essential. Engineers deploy this FPGA in programmable logic controllers (PLCs), motor control systems, and factory automation equipment where real-time processing and robust performance are required.
Communication Interface Controllers
This FPGA serves as an excellent solution for implementing custom communication protocols and interface bridges. Applications include UART, SPI, I2C controllers, and protocol converters that require flexible, high-speed data processing capabilities.
Signal Processing and Data Acquisition
The device’s 270 MHz performance and internal memory resources make it suitable for digital signal processing tasks including filtering, signal conditioning, and data acquisition systems. The programmable nature allows designers to implement custom algorithms optimized for specific applications.
Embedded System Development
Engineers utilize the XC3164A-3TQ144C as a co-processor or peripheral controller in embedded systems, handling specialized tasks such as video processing, sensor interfacing, or complex timing generation that would burden a microcontroller.
Design Advantages and Benefits
Proven Reliability
As part of the mature XC3000A family, the XC3164A-3TQ144C benefits from decades of field-proven reliability and extensive characterization. This makes it an excellent choice for applications requiring long-term availability and predictable performance.
Cost-Effective Solution
The device offers an optimal balance between functionality and cost, providing sufficient logic resources for mid-complexity designs without the expense of larger FPGAs. The widespread availability and mature toolchain support further reduce total system costs.
Flexible Reconfiguration
SRAM-based configuration technology allows unlimited reprogramming cycles, enabling rapid prototyping, in-field updates, and design iterations without hardware changes. This flexibility accelerates development cycles and reduces time-to-market.
Compact Footprint
The 144-pin TQFP package provides high pin density in a relatively small footprint (20mm x 20mm), making it suitable for space-constrained applications while maintaining accessibility for hand assembly and rework when necessary.
Development Tools and Support
Design Software
Xilinx ISE (Integrated Software Environment) provides comprehensive support for the XC3164A-3TQ144C, including:
- Schematic capture and HDL entry (VHDL/Verilog)
- Synthesis and optimization tools
- Place and route with timing analysis
- Simulation and verification capabilities
- Bitstream generation for device programming
Programming and Configuration
The FPGA supports multiple configuration modes including:
- Master Serial mode for standalone operation
- Slave Serial mode for system-controlled programming
- JTAG boundary scan for in-system programming and testing
- Master Parallel mode for fast configuration
Design Resources
Engineers have access to extensive documentation including detailed datasheets, application notes, reference designs, and a comprehensive technical support network. The large installed base ensures abundant community resources and proven design patterns.
Quality and Compliance Standards
Manufacturing Quality
The XC3164A-3TQ144C undergoes rigorous testing and quality control procedures including:
- 100% functional testing at multiple temperature points
- Burn-in testing for enhanced reliability
- Electrical parameter verification
- Package integrity inspection
Environmental Compliance
The device meets international environmental standards including RoHS (Restriction of Hazardous Substances) directives, making it suitable for global distribution and use in environmentally sensitive applications.
Industry Certifications
Compatible with industrial standards and guidelines for electronic components, the XC3164A-3TQ144C can be incorporated into systems requiring compliance with safety and quality certifications.
Comparison with Related Products
XC3164A Variants
The XC3164A family includes several speed grades and package options. The “-3” designation indicates standard speed performance, while “-4” and “-5” versions offer enhanced timing characteristics for applications requiring faster operation. Package alternatives include PLCC and PGA options for different mounting requirements.
Pin-Compatible Alternatives
The 144-pin TQFP footprint is shared with other XC3000A family members, allowing designers to migrate between devices (XC3142A, XC3190A) without board redesign, facilitating capacity scaling based on project requirements.
Procurement and Availability
Sourcing Information
The XC3164A-3TQ144C maintains good availability through authorized distributors and electronic component suppliers worldwide. AMD Xilinx provides long-term support for this established product line, ensuring continued availability for production designs.
Lead Time Considerations
Standard lead times typically range from immediate stock availability to 8-12 weeks for larger quantity orders. Engineers should consult with authorized distributors for current stock levels and delivery schedules specific to their project requirements.
Packaging Options
Available in standard industry packaging including:
- Tape and reel for automated assembly (2,500 units per reel)
- Tube packaging for lower volume orders
- Tray packaging for prototyping and engineering samples
Implementation Best Practices
Power Supply Design
Ensure clean, stable 5V supply with adequate decoupling capacitors (0.1µF ceramic) placed near each VCC pin. Power plane design should minimize impedance and provide low-noise distribution across the device.
Thermal Management
While the XC3164A-3TQ144C typically operates well within thermal limits for most applications, high-utilization designs may benefit from additional heatsinking or airflow to maintain optimal junction temperatures and maximize reliability.
PCB Layout Considerations
Follow standard practices for high-speed digital design including controlled impedance traces for critical signals, proper ground plane implementation, and attention to signal integrity for I/O connections operating above 50 MHz.
Configuration Circuit Design
Implement robust configuration circuitry with pull-up resistors on mode pins, proper decoupling of configuration supply pins, and protection against configuration data corruption during power-up sequencing.
Conclusion
The XC3164A-3TQ144C represents a mature, reliable FPGA solution for engineers requiring proven programmable logic technology in a mid-range gate density device. Its combination of 224 configurable logic blocks, 270 MHz performance, and 144-pin TQFP packaging makes it suitable for diverse applications across industrial, communication, and embedded system domains.
With extensive tool support, comprehensive documentation, and worldwide availability, the XC3164A-3TQ144C continues to serve as a trusted component in both legacy system maintenance and new design projects where its capabilities align with project requirements. The device’s cost-effectiveness and proven reliability make it an excellent choice for applications prioritizing stability and long-term supportability over cutting-edge performance specifications.
For detailed technical specifications, programming guidelines, and application examples, consult the official AMD Xilinx documentation and support resources.
