Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC7Z100-2FFG1156I: High-Performance Zynq-7000 SoC FPGA with Dual ARM Cortex-A9 Processor

Product Details

Product Overview: AMD Xilinx XC7Z100-2FFG1156I System on Chip

The XC7Z100-2FFG1156I represents AMD Xilinx’s flagship solution in the Zynq-7000 SoC family, integrating dual ARM Cortex-A9 MPCore processors with Kintex-7 FPGA fabric. This powerful System on Chip (SoC) delivers exceptional processing capabilities at 800MHz, making it ideal for demanding embedded applications requiring both software flexibility and hardware acceleration.

As part of the renowned Xilinx FPGA portfolio, this advanced device combines the best of both worlds: a feature-rich processing system alongside high-performance programmable logic, all manufactured using advanced 28nm technology.


Key Technical Specifications

Core Architecture and Processing Power

Specification Details
Processor Core Dual ARM Cortex-A9 MPCore with CoreSight
Operating Frequency 800MHz
FPGA Family Zynq-7000 / Kintex-7
Logic Cells 444,000 Cells
Manufacturing Process 28nm Technology
Package Type 1156-Pin FCBGA (35x35mm)
Operating Temperature -40°C to +100°C (TJ)
Speed Grade -2 (Commercial Grade)

Memory and Storage Features

Component Specification
RAM Size 256KB On-Chip Memory
Block RAM 36Kb True Dual-Port Configuration
Block RAM Width Up to 72 bits wide
Dual 18Kb Configuration Available

Programmable Logic Resources

Resource Details
Configurable Logic Blocks (CLB) Look-up tables (LUT), Flip-flops, Cascadeable adders
DSP Blocks 18 x 25 signed multiply, 48-bit adder/accumulator, 25-bit pre-adder
Programmable I/O Blocks LVCMOS, LVDS, SSTL support
I/O Voltage Range 1.2V to 3.3V
Advanced I/O Features Programmable I/O delay and SerDes

Connectivity and Interface Options

Rich Peripheral Connectivity

The XC7Z100-2FFG1156I provides comprehensive connectivity options for versatile system integration:

  • CANbus – Industrial communication protocol support
  • EBI/EMI – External bus interface
  • Ethernet – High-speed networking capability
  • I2C – Inter-integrated circuit communication
  • MMC/SD/SDIO – Memory card interface
  • SPI – Serial peripheral interface
  • UART/USART – Universal asynchronous receiver-transmitter
  • USB OTG – On-the-go USB connectivity
  • DMA – Direct memory access for efficient data transfer

Advanced Features and Benefits

Dual Processing Architecture

The XC7Z100-2FFG1156I employs a sophisticated dual-architecture approach:

  1. Processing System (PS) – Dual ARM Cortex-A9 cores running at 800MHz handle complex software tasks, operating systems, and control functions
  2. Programmable Logic (PL) – Kintex-7 FPGA fabric with 444K logic cells provides hardware acceleration for compute-intensive operations

Hardware Acceleration Capabilities

The integrated DSP blocks enable:

  • High-speed signal processing
  • Real-time data filtering
  • Complex mathematical operations
  • Video and image processing
  • Communications signal processing

Development and Design Support

Engineers working with this FPGA benefit from:

  • Vivado Design Suite – Industry-leading development environment
  • Comprehensive IP Library – Pre-verified intellectual property cores
  • System-level Design Tools – Integrated hardware-software co-design
  • Debug and Analysis – CoreSight debugging architecture

Target Applications

Industrial and Automotive Systems

  • Industrial automation and control
  • Machine vision systems
  • Motor control applications
  • Automotive infotainment
  • Advanced driver assistance systems (ADAS)

Communications and Networking

  • Software-defined radio (SDR)
  • 5G wireless infrastructure
  • Network security appliances
  • Protocol processing
  • Packet inspection systems

Medical and Scientific Equipment

  • Medical imaging devices
  • Diagnostic equipment
  • Laboratory instrumentation
  • Real-time data acquisition systems

Aerospace and Defense

  • Radar signal processing
  • Electronic warfare systems
  • Secure communications
  • Avionics applications

Package and Ordering Information

Physical Characteristics

Parameter Specification
Package Style Fine-Pitch Ball Grid Array (FCBGA)
Pin Count 1156 pins
Package Dimensions 35mm × 35mm
Case Style BBGA, FCBGA
RoHS Compliance Yes
Moisture Sensitivity Level Per JEDEC standards

Part Number Breakdown

XC7Z100-2FFG1156I

  • XC – Xilinx Commercial designation
  • 7Z – Zynq-7000 family
  • 100 – Device density (largest in Zynq-7000 family)
  • -2 – Speed grade (-2 commercial)
  • FFG – FineLine BGA package
  • 1156 – Pin count
  • I – Industrial temperature range

Performance Characteristics

Processing Performance Metrics

The XC7Z100-2FFG1156I delivers exceptional performance across multiple dimensions:

  1. CPU Performance: Dual 800MHz ARM Cortex-A9 cores provide up to 2.5 DMIPS/MHz per core
  2. FPGA Throughput: Kintex-7 fabric enables parallel processing of multiple data streams
  3. DSP Performance: Dedicated DSP48E1 slices optimize signal processing operations
  4. I/O Bandwidth: High-speed I/O banks support multi-gigabit serial interfaces

Power Efficiency

Advanced 28nm process technology ensures:

  • Lower static power consumption
  • Dynamic voltage and frequency scaling
  • Multiple power domains for optimized energy usage
  • Enhanced thermal management capabilities

Design Considerations

PCB Layout Recommendations

When designing with the XC7Z100-2FFG1156I:

  • Implement proper power supply decoupling
  • Plan for adequate thermal management
  • Consider signal integrity for high-speed interfaces
  • Allocate sufficient PCB layers for power distribution
  • Follow Xilinx reference designs for optimal results

System Integration

The device requires:

  • Multiple voltage rails (VCCINT, VCCAUX, VCCO)
  • Configuration memory (QSPI, SD card, or JTAG)
  • Clock sources for PS and PL domains
  • Reset and mode selection pins

Quality and Reliability

Manufacturing Standards

The XC7Z100-2FFG1156I is manufactured to the highest quality standards:

  • Full qualification to automotive and industrial specifications
  • Comprehensive reliability testing
  • Extended temperature range support
  • Long product lifecycle commitment

Product Status

  • Availability: Active production
  • Lead Time: Contact authorized distributors
  • Ordering Note: Non-Cancellable, Non-Returnable (NCNR)

Comparison with Other Zynq-7000 Devices

Feature XC7Z100 XC7Z045 XC7Z020
Logic Cells 444K 350K 85K
ARM Cores Dual A9 Dual A9 Dual A9
Max Frequency 800MHz 800MHz 667MHz
DSP Slices 2020 900 220
Block RAM 26.5Mb 19.1Mb 4.9Mb
Package Pins 1156 900 400-484

Getting Started Resources

Development Platforms

Popular development boards supporting similar Zynq devices:

  • ZedBoard evaluation platform
  • ZC706 evaluation kit
  • Custom carrier boards

Software Tools

Essential tools for XC7Z100-2FFG1156I development:

  • Vivado Design Suite (synthesis and implementation)
  • Vitis unified software platform
  • PetaLinux embedded Linux distribution
  • Bare-metal application templates

Frequently Asked Questions

Q: What is the difference between XC7Z100-2FFG1156I and XC7Z100-2FFG1156C? A: The “I” suffix indicates industrial temperature range (-40°C to +100°C), while “C” denotes commercial temperature range (0°C to +85°C).

Q: Can this device run Linux operating systems? A: Yes, the dual ARM Cortex-A9 processors fully support Linux, including PetaLinux and custom Linux distributions.

Q: What programming languages are supported? A: The PS supports C/C++, while the PL is programmed using HDL (Verilog/VHDL) or high-level synthesis (HLS) with C/C++.

Q: Is this pin-compatible with other Zynq-7000 devices? A: The XC7Z100 in FFG1156 package shares pin compatibility with other high-end Zynq-7000 devices in the same package.


Conclusion: Industry-Leading SoC FPGA Performance

The XC7Z100-2FFG1156I stands as AMD Xilinx’s premier offering in the Zynq-7000 family, delivering unmatched processing power and programmable logic resources. With 444K logic cells, dual 800MHz ARM Cortex-A9 processors, and comprehensive connectivity options, this device enables next-generation embedded systems across industrial, automotive, communications, and aerospace applications.

For engineers seeking maximum performance in a single-chip solution combining software programmability with hardware acceleration, the XC7Z100-2FFG1156I represents the optimal choice. Its advanced 28nm technology, extensive I/O capabilities, and robust development ecosystem ensure successful project implementation from prototype to production.

Contact authorized distributors for pricing, availability, and technical support for your XC7Z100-2FFG1156I design requirements.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.