The AMD XC2S200-6FGG529C is a high-performance Field-Programmable Gate Array (FPGA) from the renowned Spartan-II family. This advanced programmable logic device delivers exceptional value for engineers seeking cost-effective solutions without compromising on performance or features. Whether you’re designing telecommunications equipment, industrial control systems, or embedded applications, the XC2S200-6FGG529C offers the flexibility and power you need.
Key Features of the XC2S200-6FGG529C Spartan-II FPGA
The XC2S200-6FGG529C belongs to AMD’s legacy Xilinx FPGA product line, combining proven technology with reliable performance. This device stands out as a superior alternative to mask-programmed ASICs, eliminating lengthy development cycles and reducing project risk.
XC2S200-6FGG529C Specifications Overview
| Parameter |
Specification |
| Family |
Spartan-II |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| CLB Array |
28 × 42 |
| Total CLBs |
1,176 |
| Maximum User I/O |
284 |
| Distributed RAM Bits |
75,264 |
| Block RAM Bits |
56K (14 blocks) |
| Package Type |
FGG529 (Fine-pitch BGA) |
| Pin Count |
529 |
| Speed Grade |
-6 |
| Core Voltage |
2.5V |
| Process Technology |
0.18µm |
| Maximum Frequency |
200+ MHz |
Understanding the XC2S200-6FGG529C Part Number
The part number XC2S200-6FGG529C follows AMD’s standard naming convention:
- XC2S – Spartan-II FPGA family identifier
- 200 – 200,000 system gates capacity
- -6 – Speed grade (highest performance grade, Commercial only)
- FGG – Fine-pitch Ball Grid Array package with Pb-free option
- 529 – 529-pin package
- C – Commercial temperature range (0°C to +85°C)
XC2S200-6FGG529C Architecture and Logic Resources
Configurable Logic Blocks (CLBs)
The XC2S200-6FGG529C features a robust CLB architecture organized in a 28 × 42 array, providing 1,176 total CLBs. Each CLB contains four Logic Cells (LCs), making this device ideal for implementing complex digital designs.
Each Logic Cell includes:
- One 4-input Look-Up Table (LUT)
- One dedicated storage element (flip-flop or latch)
- Fast carry logic for arithmetic operations
- Dedicated routing for high-performance designs
On-Chip Memory Architecture
The XC2S200-6FGG529C provides two types of on-chip memory:
Distributed RAM (75,264 bits)
- Implemented using LUT resources
- Single-port and dual-port configurations
- Synchronous write operation
- Ideal for small, fast memory structures
Block RAM (56 Kbits)
- 14 dedicated memory blocks
- True dual-port capability
- Configurable aspect ratios (16×256 to 1×4096)
- Independent read/write clocks per port
- Synchronous operation for reliable data handling
Advanced Clock Management with Delay-Locked Loops
The XC2S200-6FGG529C incorporates four fully digital Delay-Locked Loop (DLL) circuits positioned at each corner of the die. These DLLs provide:
- Zero propagation delay clock distribution
- Minimal clock skew across the device
- Clock multiplication (2×) and division (up to 16×)
- Phase-shifted clock outputs (90°, 180°, 270°)
- Board-level clock deskewing capability
- Configuration delay until lock achieved
Flexible I/O Standards Support
Multi-Voltage I/O Capabilities
The XC2S200-6FGG529C supports multiple I/O signaling standards through its SelectI/O technology:
- LVTTL – 3.3V Low-Voltage TTL
- LVCMOS – Low-Voltage CMOS (2.5V, 3.3V)
- PCI – 3.3V PCI Local Bus compliant
- GTL – Gunning Transceiver Logic
- GTL+ – Enhanced GTL
- HSTL – High-Speed Transceiver Logic
- SSTL – Stub Series Terminated Logic
- CTT – Center-Tap Terminated
I/O Banking Architecture
The device organizes I/Os into eight banks, allowing designers to mix different I/O standards within a single design while maintaining proper voltage isolation.
XC2S200-6FGG529C Package Information
FGG529 Package Characteristics
The 529-pin Fine-pitch Ball Grid Array (FBGA) package offers:
- Compact board footprint
- Excellent thermal characteristics
- Lead-free (Pb-free) construction
- High pin density for complex designs
- Reliable solder joint connections
- Standard BGA assembly compatibility
Configuration and Programming Options
The XC2S200-6FGG529C supports multiple configuration modes:
- Master Serial Mode – Internal clock generation
- Slave Serial Mode – External clock input
- Master Parallel Mode – 8-bit parallel interface
- Slave Parallel Mode – External control
- Boundary Scan (JTAG) – IEEE 1149.1 compliant
Configuration Features
- In-system programmability
- Unlimited reconfiguration cycles
- SRAM-based architecture
- Configuration readback capability
- Partial reconfiguration support
Typical Applications for XC2S200-6FGG529C
Telecommunications Equipment
- Network routers and switches
- Base station controllers
- Protocol converters
- DSP co-processors
Industrial Control Systems
- Motor drive controllers
- PLC implementations
- Sensor interface designs
- Process automation
Consumer Electronics
- Video processing systems
- Audio equipment
- Gaming peripherals
- Display controllers
Automotive Electronics
- Infotainment systems
- Driver assistance modules
- Vehicle networking interfaces
- Sensor fusion applications
Embedded Systems
- Custom microcontroller peripherals
- Hardware accelerators
- Interface bridging
- Prototyping platforms
Development Tools and Software Support
The XC2S200-6FGG529C is supported by AMD’s ISE Design Suite, which provides:
- HDL synthesis (VHDL, Verilog)
- Schematic capture
- Timing analysis
- Power analysis
- Programming utilities
- Simulation integration
XC2S200-6FGG529C Ordering Information
When ordering this device, specify the complete part number XC2S200-6FGG529C to ensure you receive the correct configuration:
- Spartan-II 200K gates
- Speed grade -6 (highest performance)
- 529-pin FBGA package
- Pb-free option available
- Commercial temperature range
Advantages Over ASIC Solutions
The XC2S200-6FGG529C offers significant advantages compared to traditional ASIC implementations:
- Reduced Development Risk – No mask charges or NRE costs
- Faster Time-to-Market – Eliminate ASIC fabrication delays
- Field Upgradability – Update designs post-deployment
- Design Flexibility – Make changes without hardware replacement
- Lower Initial Investment – No minimum order quantities
- Proven Technology – Established reliability track record
Technical Support and Documentation
Comprehensive documentation is available including:
- Complete datasheet (DS001)
- Application notes
- Package drawings
- Pinout tables
- Development board guides
- Reference designs
Conclusion
The AMD XC2S200-6FGG529C represents an excellent choice for designers requiring a reliable, cost-effective FPGA solution with substantial logic resources. With 200,000 system gates, 5,292 logic cells, 56K of block RAM, and support for 16 different I/O standards, this Spartan-II device delivers the performance and flexibility needed for a wide range of applications from telecommunications to industrial control.
The -6 speed grade ensures maximum performance for demanding applications, while the 529-pin FBGA package provides ample I/O resources for complex system implementations. Whether you’re replacing an existing ASIC design or starting a new project, the XC2S200-6FGG529C offers a proven, programmable solution backed by AMD’s extensive FPGA expertise.
