The AMD XC2S200-6FGG527C is a high-performance programmable logic device from the acclaimed Spartan-II FPGA family. This Xilinx FPGA delivers exceptional value for engineers seeking reliable, cost-effective solutions for digital design applications. With 200,000 system gates and advanced clock management capabilities, the XC2S200-6FGG527C stands as a superior alternative to traditional mask-programmed ASICs.
XC2S200-6FGG527C Key Features and Benefits
The XC2S200-6FGG527C combines robust architecture with versatile I/O capabilities, making it ideal for telecommunications, industrial automation, and embedded system applications. Engineers choosing this Spartan-II FPGA benefit from reduced development cycles, lower initial costs, and the flexibility of in-field programmability.
Why Choose the XC2S200-6FGG527C for Your Design
Unlike conventional ASICs, the XC2S200-6FGG527C eliminates lengthy development cycles and inherent manufacturing risks. Its programmable architecture permits design upgrades in the field without hardware replacement, providing significant cost savings throughout the product lifecycle.
XC2S200-6FGG527C Technical Specifications
Core Architecture Specifications
| Parameter |
Specification |
| Device Family |
Spartan-II |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| CLB Array |
28 x 42 |
| Number of CLBs |
1,176 |
| Maximum Frequency |
263 MHz |
| Process Technology |
0.18µm |
Memory Resources
| Memory Type |
Capacity |
| Distributed RAM |
75,264 bits |
| Block RAM |
56K bits (14 blocks) |
| Total RAM Bits |
57,344 |
| Block RAM Configuration |
Dual-port 4096-bit per block |
XC2S200-6FGG527C Package Information
| Specification |
Value |
| Package Type |
FGG527 (Fine-Pitch Ball Grid Array) |
| Pin Count |
527 pins |
| Maximum User I/O |
284 |
| Speed Grade |
-6 (Fastest) |
| Temperature Range |
Commercial (0°C to +85°C) |
| Lead-Free (Pb-Free) |
Yes (indicated by “G” in part number) |
XC2S200-6FGG527C Power Supply Requirements
Voltage Specifications
| Supply |
Voltage Range |
Typical |
| Core Voltage (VCCINT) |
2.375V to 2.625V |
2.5V |
| I/O Voltage (VCCO) |
1.4V to 3.6V |
3.3V |
The XC2S200-6FGG527C operates with a 2.5V core supply voltage while supporting multiple I/O voltage standards for maximum interface flexibility.
Advanced Clock Management with Delay-Locked Loops
Four On-Chip DLLs
The XC2S200-6FGG527C integrates four Delay-Locked Loops (DLLs), one at each corner of the die. These DLLs provide:
- Clock deskew and distribution
- Phase shifting capabilities
- Clock mirroring for board-level synchronization
- Frequency synthesis and multiplication
- Support for system frequencies up to 200 MHz
DLL Application Benefits
The integrated DLLs eliminate clock distribution delays, ensuring predictable timing across all logic elements. Engineers can achieve zero-delay clock distribution, reducing timing uncertainty in high-speed designs.
Supported I/O Standards for XC2S200-6FGG527C
Compatible Interface Standards
The XC2S200-6FGG527C supports 16 different I/O standards, enabling seamless integration with diverse system components:
| Standard Type |
Standards Supported |
| Single-Ended |
LVTTL, LVCMOS (3.3V, 2.5V, 1.8V) |
| PCI Compatible |
PCI 3.3V (5V tolerant) |
| High-Speed |
GTL, GTL+ |
| Differential |
LVDS, LVPECL |
| Memory Interface |
HSTL, SSTL |
5V Tolerance Feature
LVTTL, LVCMOS2, and PCI interfaces are 5V tolerant, allowing direct connection to legacy 5V systems without external level shifters.
Configurable Logic Block (CLB) Architecture
Logic Cell Structure
Each CLB in the XC2S200-6FGG527C contains four Logic Cells (LCs), providing:
- 4-input function generators (Look-Up Tables)
- Dedicated carry logic for arithmetic operations
- Storage elements configurable as flip-flops or latches
- Direct feedthrough paths for routing efficiency
Distributed RAM Implementation
The LUTs within CLBs can function as distributed RAM, creating:
- 16 x 2-bit synchronous RAM per slice
- 32 x 1-bit synchronous RAM configurations
- Fast, local memory for register files and FIFOs
Block RAM Features in XC2S200-6FGG527C
Dual-Port Memory Architecture
The 14 dedicated block RAM modules provide:
| Feature |
Specification |
| Total Block RAM |
56K bits |
| Blocks per Column |
2 columns × 7 blocks |
| Port Configuration |
Fully synchronous dual-port |
| Bits per Block |
4,096 |
| Independent Port Width |
Configurable per port |
Block RAM Applications
The dual-port architecture supports simultaneous read/write operations from independent clocks, ideal for:
- FIFO buffers
- Frame buffers
- Coefficient storage
- Data buffering between clock domains
XC2S200-6FGG527C Ordering Information
Part Number Breakdown
XC2S200-6FGG527C decodes as:
| Code |
Meaning |
| XC2S |
Spartan-II Family |
| 200 |
200,000 System Gates |
| -6 |
Speed Grade (Fastest) |
| FG |
Fine-pitch BGA Package |
| G |
Pb-Free (RoHS Compliant) |
| 527 |
527-Pin Package |
| C |
Commercial Temperature (0°C to +85°C) |
Speed Grade Availability
The -6 speed grade offers the fastest performance within the Spartan-II family and is exclusively available for commercial temperature range applications.
Configuration Options for XC2S200-6FGG527C
Supported Configuration Modes
| Mode |
Description |
| Master Serial |
FPGA controls external PROM |
| Slave Serial |
External controller drives configuration |
| Master SelectMAP |
8-bit parallel from PROM |
| Slave SelectMAP |
8-bit parallel from controller |
| JTAG/Boundary Scan |
IEEE 1149.1 compliant |
In-System Programmability
The XC2S200-6FGG527C supports full in-system reconfiguration via JTAG interface, enabling:
- Field firmware updates
- Design debugging and verification
- Boundary scan testing per IEEE 1149.1
Target Applications for Spartan-II XC2S200-6FGG527C
Industrial and Commercial Applications
The XC2S200-6FGG527C excels in numerous application domains:
- Telecommunications: Protocol conversion, data encryption, signal processing
- Industrial Automation: Motor control, sensor interfaces, PLC implementations
- Consumer Electronics: Video processing, audio encoding, display controllers
- Networking Equipment: Packet processing, bridge/router implementations
- Medical Devices: Signal acquisition, data processing, control systems
- Test and Measurement: Data acquisition, waveform generation
Development Tools and Software Support
Compatible Design Software
The XC2S200-6FGG527C is fully supported by Xilinx ISE Design Suite, providing:
- Design entry (schematic and HDL)
- Synthesis and implementation
- Simulation and timing analysis
- Bitstream generation and device programming
HDL Language Support
Engineers can develop designs using:
- VHDL
- Verilog
- Mixed-language designs
- IP core integration
XC2S200-6FGG527C vs. ASIC Comparison
Cost and Development Advantages
| Factor |
XC2S200-6FGG527C FPGA |
Mask-Programmed ASIC |
| Initial NRE Cost |
Low |
Very High |
| Development Time |
Weeks |
Months |
| Design Risk |
Low (reprogrammable) |
High (fixed) |
| Field Updates |
Yes |
No |
| Minimum Order |
Single units |
High volume |
Quality and Compliance Information
Environmental Compliance
The XC2S200-6FGG527C meets stringent environmental and quality standards:
- RoHS Compliant (Pb-Free packaging)
- ISO 9001 manufacturing processes
- Extensive qualification testing
Reliability Data
AMD (formerly Xilinx) provides comprehensive reliability data including:
- MTBF calculations
- Failure rate data
- Qualification reports
Summary: XC2S200-6FGG527C Spartan-II FPGA
The AMD XC2S200-6FGG527C represents an optimal choice for engineers requiring a balance of performance, flexibility, and cost-effectiveness. With 200,000 system gates, 56K bits of block RAM, four DLLs, and support for 16 I/O standards, this Spartan-II FPGA delivers the resources needed for complex digital designs.
The -6 speed grade ensures maximum performance, while the 527-pin FGG package provides extensive I/O connectivity for demanding applications. Combined with comprehensive development tool support and in-field programmability, the XC2S200-6FGG527C continues to serve as a reliable solution for production applications worldwide.
