Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

AMD XC2S200-6FGG517C Spartan-II FPGA: Complete Technical Specifications and Features

Product Details

The AMD XC2S200-6FGG517C is a high-performance Field Programmable Gate Array from the renowned Spartan-II FPGA family. This versatile programmable logic device delivers exceptional processing capabilities with 200,000 system gates, making it an ideal solution for digital signal processing, telecommunications, and embedded system applications. With its -6 speed grade rating, this FPGA offers the fastest commercial performance available in the Spartan-II series.

Key Features of the XC2S200-6FGG517C FPGA

The AMD XC2S200-6FGG517C stands out as a cost-effective alternative to traditional mask-programmed ASICs. This Xilinx FPGA eliminates lengthy development cycles and reduces initial costs while providing unlimited reprogrammability for field upgrades without hardware replacement.

Advanced Logic Architecture

The XC2S200-6FGG517C incorporates a sophisticated logic architecture based on the proven Virtex FPGA design principles. The device features 5,292 logic cells organized into 1,176 Configurable Logic Blocks (CLBs), providing substantial resources for implementing complex digital designs. Each CLB contains four logic cells with 4-input function generators, storage elements, and dedicated carry logic for high-speed arithmetic operations.

Memory Configuration and SelectRAM Technology

This Spartan-II FPGA integrates a hierarchical memory system that combines both block RAM and distributed RAM capabilities:

Memory Type Capacity Configuration
Block RAM 56 Kbits Configurable 4K bit blocks
Distributed RAM 75,264 bits 16 bits per LUT
Total RAM Bits 57,344 bits Dual-port capability

The SelectRAM technology enables designers to implement various memory configurations including single-port RAM, dual-port RAM, and ROM structures to meet specific application requirements.

XC2S200-6FGG517C Technical Specifications

Core Specifications

Understanding the complete technical specifications helps engineers determine whether the XC2S200-6FGG517C meets their design requirements:

Parameter Specification
Device Family Spartan-II
System Gates 200,000
Logic Cells 5,292
CLBs 1,176
Maximum Frequency 263 MHz
Process Technology 0.18 μm CMOS
Core Voltage 2.5V
Speed Grade -6 (Fastest Commercial)

Package and I/O Characteristics

The XC2S200-6FGG517C utilizes a Fine-pitch Ball Grid Array (FBGA) package that optimizes board space while maintaining excellent thermal performance and signal integrity:

I/O Parameter Value
Package Type FBGA (Fine-pitch BGA)
Total Pins 517
User I/O Pins 284
I/O Banks 4
Supported I/O Standards 16

Supported I/O Standards

The XC2S200-6FGG517C provides comprehensive I/O compatibility for seamless integration with various system components:

Standard Category Supported Standards
LVTTL/LVCMOS LVTTL, LVCMOS2, LVCMOS33
GTL GTL, GTL+
HSTL HSTL I, HSTL III, HSTL IV
SSTL SSTL2 I, SSTL2 II, SSTL3 I, SSTL3 II
Differential LVDS, BLVDS, LVPECL
Other PCI33, PCI66, AGP-2X

Clock Management and DLL Features

Delay-Locked Loop Technology

The XC2S200-6FGG517C incorporates four dedicated Delay-Locked Loops positioned at each corner of the die. These DLLs provide advanced clock management capabilities essential for high-performance digital systems:

DLL Feature Capability
Number of DLLs 4
Clock Multiplication 2x
Clock Division 1.5x, 2x, 2.5x, 3x, 4x, 5x, 8x, 16x
Phase Shifting 90°, 180°, 270°
Duty Cycle Correction Yes
Clock Mirroring Supported

The DLL architecture enables designers to eliminate clock distribution delays, multiply or divide clock frequencies, and achieve precise phase relationships between clock signals—critical requirements for high-speed data processing applications.

Global Clock Distribution Network

Four primary low-skew global clock distribution networks ensure uniform clock delivery across the entire device. This architecture minimizes clock skew and jitter, enabling reliable operation at maximum frequencies.

Applications for the XC2S200-6FGG517C FPGA

Telecommunications and Networking

The XC2S200-6FGG517C excels in telecommunications infrastructure where its high-speed processing capabilities and flexible I/O standards support:

Application Key Benefits
Protocol Conversion Multiple I/O standard support
Data Multiplexing High-bandwidth processing
Signal Processing Dedicated DSP resources
Network Interface PCI compliance

Industrial Control Systems

Industrial automation systems benefit from the FPGA’s reliable performance across commercial temperature ranges (0°C to 85°C):

Industrial Application Advantage
Motor Control Fast arithmetic operations
Process Automation Real-time processing
Data Acquisition Multiple I/O interfaces
PLC Implementation Flexible logic resources

Consumer Electronics

The cost-effective nature of the XC2S200-6FGG517C makes it suitable for high-volume consumer applications:

Consumer Application Implementation
Video Processing Block RAM buffering
Audio Systems DSP algorithms
Display Controllers High-speed interfaces
Gaming Hardware Parallel processing

Development Tools and Software Support

Xilinx ISE Design Suite

The XC2S200-6FGG517C is fully supported by Xilinx ISE Design Suite, providing comprehensive design entry, synthesis, implementation, and verification capabilities. Engineers can develop designs using industry-standard Hardware Description Languages including VHDL and Verilog.

Configuration Options

Configuration Mode Description
Master Serial FPGA generates configuration clock
Slave Serial External clock source
Master Parallel 8-bit parallel configuration
Slave Parallel External processor control
JTAG/Boundary Scan IEEE 1149.1 compliant

XC2S200-6FGG517C vs. ASIC Solutions

Advantages Over Mask-Programmed ASICs

The Spartan-II FPGA architecture offers compelling advantages compared to traditional ASIC implementations:

Factor XC2S200-6FGG517C Mask-Programmed ASIC
Initial Cost Low High NRE charges
Development Time Weeks Months
Design Risk Minimal Significant
Field Upgrades Unlimited Impossible
Prototyping Immediate Extended cycle
Time-to-Market Fast Slow

Cost-Effectiveness Analysis

The 0.18 μm CMOS process technology enables the XC2S200-6FGG517C to deliver excellent price-performance ratios. Combined with streamlined features derived from the higher-end Virtex architecture, this FPGA provides more system gates, I/Os, and features per dollar than competing solutions.

Electrical Characteristics and Operating Conditions

Power Supply Requirements

Supply Parameter Minimum Typical Maximum
VCCINT (Core) 2.375V 2.5V 2.625V
VCCO (I/O) Bank-dependent Standard-dependent See I/O standard

Operating Temperature Ranges

Grade Temperature Range
Commercial 0°C to +85°C

The -6 speed grade designation indicates the fastest timing specifications available for commercial temperature operation, making this device optimal for performance-critical applications.

Design Considerations for XC2S200-6FGG517C Implementation

PCB Layout Guidelines

Successful implementation of the XC2S200-6FGG517C requires attention to proper PCB design practices:

Design Aspect Recommendation
Power Planes Separate VCCINT and VCCO planes
Decoupling 0.1μF capacitors per power pin group
Signal Integrity Controlled impedance routing
Thermal Management Adequate copper area for heat dissipation

Configuration Storage

The XC2S200-6FGG517C requires external configuration storage, as FPGA designs are volatile. Compatible options include dedicated configuration PROMs, flash memory devices, or processor-controlled configuration schemes.

Quality and Compliance Information

Environmental Compliance

Standard Status
RoHS Compliant options available
REACH Compliant
WEEE Compliant

Quality Standards

The XC2S200-6FGG517C is manufactured under strict quality control procedures ensuring consistent performance and reliability for production applications.

Ordering Information and Part Number Breakdown

The AMD XC2S200-6FGG517C part number follows a standardized naming convention:

Code Segment Meaning
XC2S Spartan-II family identifier
200 200,000 system gates
-6 Speed grade (fastest commercial)
FGG Fine-pitch BGA package
517 Pin count
C Commercial temperature range

Summary: Why Choose the XC2S200-6FGG517C

The AMD XC2S200-6FGG517C Spartan-II FPGA represents an optimal balance of performance, features, and cost-effectiveness for medium-complexity digital designs. With 200,000 system gates, 5,292 logic cells, comprehensive memory resources, and support for 16 I/O standards, this FPGA addresses diverse application requirements from telecommunications to industrial control systems.

The -6 speed grade ensures maximum performance for timing-critical designs, while the FBGA package provides excellent signal integrity and thermal characteristics. Combined with full support from Xilinx ISE Design Suite and unlimited reprogrammability, the XC2S200-6FGG517C delivers a compelling solution for engineers seeking a flexible, cost-effective programmable logic platform.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.