The AMD XC2S200-6FGG517C is a high-performance Field Programmable Gate Array from the renowned Spartan-II FPGA family. This versatile programmable logic device delivers exceptional processing capabilities with 200,000 system gates, making it an ideal solution for digital signal processing, telecommunications, and embedded system applications. With its -6 speed grade rating, this FPGA offers the fastest commercial performance available in the Spartan-II series.
Key Features of the XC2S200-6FGG517C FPGA
The AMD XC2S200-6FGG517C stands out as a cost-effective alternative to traditional mask-programmed ASICs. This Xilinx FPGA eliminates lengthy development cycles and reduces initial costs while providing unlimited reprogrammability for field upgrades without hardware replacement.
Advanced Logic Architecture
The XC2S200-6FGG517C incorporates a sophisticated logic architecture based on the proven Virtex FPGA design principles. The device features 5,292 logic cells organized into 1,176 Configurable Logic Blocks (CLBs), providing substantial resources for implementing complex digital designs. Each CLB contains four logic cells with 4-input function generators, storage elements, and dedicated carry logic for high-speed arithmetic operations.
Memory Configuration and SelectRAM Technology
This Spartan-II FPGA integrates a hierarchical memory system that combines both block RAM and distributed RAM capabilities:
| Memory Type |
Capacity |
Configuration |
| Block RAM |
56 Kbits |
Configurable 4K bit blocks |
| Distributed RAM |
75,264 bits |
16 bits per LUT |
| Total RAM Bits |
57,344 bits |
Dual-port capability |
The SelectRAM technology enables designers to implement various memory configurations including single-port RAM, dual-port RAM, and ROM structures to meet specific application requirements.
XC2S200-6FGG517C Technical Specifications
Core Specifications
Understanding the complete technical specifications helps engineers determine whether the XC2S200-6FGG517C meets their design requirements:
| Parameter |
Specification |
| Device Family |
Spartan-II |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| CLBs |
1,176 |
| Maximum Frequency |
263 MHz |
| Process Technology |
0.18 μm CMOS |
| Core Voltage |
2.5V |
| Speed Grade |
-6 (Fastest Commercial) |
Package and I/O Characteristics
The XC2S200-6FGG517C utilizes a Fine-pitch Ball Grid Array (FBGA) package that optimizes board space while maintaining excellent thermal performance and signal integrity:
| I/O Parameter |
Value |
| Package Type |
FBGA (Fine-pitch BGA) |
| Total Pins |
517 |
| User I/O Pins |
284 |
| I/O Banks |
4 |
| Supported I/O Standards |
16 |
Supported I/O Standards
The XC2S200-6FGG517C provides comprehensive I/O compatibility for seamless integration with various system components:
| Standard Category |
Supported Standards |
| LVTTL/LVCMOS |
LVTTL, LVCMOS2, LVCMOS33 |
| GTL |
GTL, GTL+ |
| HSTL |
HSTL I, HSTL III, HSTL IV |
| SSTL |
SSTL2 I, SSTL2 II, SSTL3 I, SSTL3 II |
| Differential |
LVDS, BLVDS, LVPECL |
| Other |
PCI33, PCI66, AGP-2X |
Clock Management and DLL Features
Delay-Locked Loop Technology
The XC2S200-6FGG517C incorporates four dedicated Delay-Locked Loops positioned at each corner of the die. These DLLs provide advanced clock management capabilities essential for high-performance digital systems:
| DLL Feature |
Capability |
| Number of DLLs |
4 |
| Clock Multiplication |
2x |
| Clock Division |
1.5x, 2x, 2.5x, 3x, 4x, 5x, 8x, 16x |
| Phase Shifting |
90°, 180°, 270° |
| Duty Cycle Correction |
Yes |
| Clock Mirroring |
Supported |
The DLL architecture enables designers to eliminate clock distribution delays, multiply or divide clock frequencies, and achieve precise phase relationships between clock signals—critical requirements for high-speed data processing applications.
Global Clock Distribution Network
Four primary low-skew global clock distribution networks ensure uniform clock delivery across the entire device. This architecture minimizes clock skew and jitter, enabling reliable operation at maximum frequencies.
Applications for the XC2S200-6FGG517C FPGA
Telecommunications and Networking
The XC2S200-6FGG517C excels in telecommunications infrastructure where its high-speed processing capabilities and flexible I/O standards support:
| Application |
Key Benefits |
| Protocol Conversion |
Multiple I/O standard support |
| Data Multiplexing |
High-bandwidth processing |
| Signal Processing |
Dedicated DSP resources |
| Network Interface |
PCI compliance |
Industrial Control Systems
Industrial automation systems benefit from the FPGA’s reliable performance across commercial temperature ranges (0°C to 85°C):
| Industrial Application |
Advantage |
| Motor Control |
Fast arithmetic operations |
| Process Automation |
Real-time processing |
| Data Acquisition |
Multiple I/O interfaces |
| PLC Implementation |
Flexible logic resources |
Consumer Electronics
The cost-effective nature of the XC2S200-6FGG517C makes it suitable for high-volume consumer applications:
| Consumer Application |
Implementation |
| Video Processing |
Block RAM buffering |
| Audio Systems |
DSP algorithms |
| Display Controllers |
High-speed interfaces |
| Gaming Hardware |
Parallel processing |
Development Tools and Software Support
Xilinx ISE Design Suite
The XC2S200-6FGG517C is fully supported by Xilinx ISE Design Suite, providing comprehensive design entry, synthesis, implementation, and verification capabilities. Engineers can develop designs using industry-standard Hardware Description Languages including VHDL and Verilog.
Configuration Options
| Configuration Mode |
Description |
| Master Serial |
FPGA generates configuration clock |
| Slave Serial |
External clock source |
| Master Parallel |
8-bit parallel configuration |
| Slave Parallel |
External processor control |
| JTAG/Boundary Scan |
IEEE 1149.1 compliant |
XC2S200-6FGG517C vs. ASIC Solutions
Advantages Over Mask-Programmed ASICs
The Spartan-II FPGA architecture offers compelling advantages compared to traditional ASIC implementations:
| Factor |
XC2S200-6FGG517C |
Mask-Programmed ASIC |
| Initial Cost |
Low |
High NRE charges |
| Development Time |
Weeks |
Months |
| Design Risk |
Minimal |
Significant |
| Field Upgrades |
Unlimited |
Impossible |
| Prototyping |
Immediate |
Extended cycle |
| Time-to-Market |
Fast |
Slow |
Cost-Effectiveness Analysis
The 0.18 μm CMOS process technology enables the XC2S200-6FGG517C to deliver excellent price-performance ratios. Combined with streamlined features derived from the higher-end Virtex architecture, this FPGA provides more system gates, I/Os, and features per dollar than competing solutions.
Electrical Characteristics and Operating Conditions
Power Supply Requirements
| Supply Parameter |
Minimum |
Typical |
Maximum |
| VCCINT (Core) |
2.375V |
2.5V |
2.625V |
| VCCO (I/O) |
Bank-dependent |
Standard-dependent |
See I/O standard |
Operating Temperature Ranges
| Grade |
Temperature Range |
| Commercial |
0°C to +85°C |
The -6 speed grade designation indicates the fastest timing specifications available for commercial temperature operation, making this device optimal for performance-critical applications.
Design Considerations for XC2S200-6FGG517C Implementation
PCB Layout Guidelines
Successful implementation of the XC2S200-6FGG517C requires attention to proper PCB design practices:
| Design Aspect |
Recommendation |
| Power Planes |
Separate VCCINT and VCCO planes |
| Decoupling |
0.1μF capacitors per power pin group |
| Signal Integrity |
Controlled impedance routing |
| Thermal Management |
Adequate copper area for heat dissipation |
Configuration Storage
The XC2S200-6FGG517C requires external configuration storage, as FPGA designs are volatile. Compatible options include dedicated configuration PROMs, flash memory devices, or processor-controlled configuration schemes.
Quality and Compliance Information
Environmental Compliance
| Standard |
Status |
| RoHS |
Compliant options available |
| REACH |
Compliant |
| WEEE |
Compliant |
Quality Standards
The XC2S200-6FGG517C is manufactured under strict quality control procedures ensuring consistent performance and reliability for production applications.
Ordering Information and Part Number Breakdown
The AMD XC2S200-6FGG517C part number follows a standardized naming convention:
| Code Segment |
Meaning |
| XC2S |
Spartan-II family identifier |
| 200 |
200,000 system gates |
| -6 |
Speed grade (fastest commercial) |
| FGG |
Fine-pitch BGA package |
| 517 |
Pin count |
| C |
Commercial temperature range |
Summary: Why Choose the XC2S200-6FGG517C
The AMD XC2S200-6FGG517C Spartan-II FPGA represents an optimal balance of performance, features, and cost-effectiveness for medium-complexity digital designs. With 200,000 system gates, 5,292 logic cells, comprehensive memory resources, and support for 16 I/O standards, this FPGA addresses diverse application requirements from telecommunications to industrial control systems.
The -6 speed grade ensures maximum performance for timing-critical designs, while the FBGA package provides excellent signal integrity and thermal characteristics. Combined with full support from Xilinx ISE Design Suite and unlimited reprogrammability, the XC2S200-6FGG517C delivers a compelling solution for engineers seeking a flexible, cost-effective programmable logic platform.