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Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

IPC-7711/7721 Explained: Complete Guide to PCB Rework, Repair & Modification

Every electronics manufacturer faces the same question when an assembly fails inspection or a board comes back from the field with a defect: do we scrap it or fix it? For a $50 consumer product, scrapping might make sense. For a $15,000 aerospace assembly or a prototype with an 8-week lead time, that’s rarely an option.

IPC-7711/7721 exists precisely for these situations. This standard provides the industry-accepted procedures for reworking defective assemblies, repairing damaged boards, and modifying products to meet new requirements. It’s the document that separates professional repair work from improvised fixes that may or may not hold up in service.

Whether you’re a technician performing daily rework, an engineer establishing repair procedures, or a quality manager defining acceptance criteria, understanding IPC-7711/7721 is essential. This guide covers everything you need to know about the standard, from basic concepts to certification options.

What Is IPC-7711/7721?

IPC-7711/7721, officially titled Rework, Modification and Repair of Electronic Assemblies, is a comprehensive procedural guide developed by the IPC (Association Connecting Electronics Industries). The standard provides detailed, step-by-step procedures for restoring electronic assemblies to conforming condition or modifying them to meet new requirements.

The standard is actually two documents combined into one:

DocumentFocus AreaPurpose
IPC-7711ReworkProcedures for removing and replacing components, correcting defects without changing original design
IPC-7721Repair & ModificationProcedures for restoring damaged boards and altering assemblies to meet new requirements

Why Two Standards in One?

Historically, IPC-7711 and IPC-7721 were separate documents. IPC recognized that technicians performing rework often need to perform repairs as well—a lifted pad during component removal requires repair before the new component can be installed. Combining them into a single reference makes practical sense for the people actually doing the work.

The combined document also superseded IPC-R-700, an older repair standard that many aerospace and defense contractors referenced for decades.

Current Version and Revision History

RevisionRelease DateKey Changes
Original1998First combined release, based on IPC-R-700
Revision AOctober 2003Expanded procedures
Revision BNovember 2007Lead-free coverage, BGA reballing procedures
Revision CJanuary 2017Updated procedures, color illustrations
Revision DJanuary 2024Current version, expanded cable/wire harness procedures

Revision D is the current version as of 2024. It includes all previously published change pages and amendments, updated general information, and expanded coverage for cable and wire harness assemblies in addition to printed board assemblies.

Understanding Rework vs Repair vs Modification

IPC-7711/7721 makes clear distinctions between these three activities. The differences matter because they affect approval requirements, documentation, and quality expectations.

Definitions

TermDefinitionExample
ReworkReprocessing non-complying product through original or equivalent processes to achieve full compliance with original requirementsRemoving a misaligned component and reinstalling it correctly
RepairRestoring a non-complying product to a condition where it can fulfill its intended use, even if it doesn’t fully meet original requirementsReplacing a damaged pad with a repair circuit frame
ModificationRevising a conforming product’s functional capability to satisfy new acceptance criteriaAdding a jumper wire to implement an engineering change

Why the Distinction Matters

ActivityTypical Approval RequiredResult
ReworkOften pre-authorized during manufacturingProduct meets original specifications
RepairUsually requires customer/engineering approvalProduct functional but may not meet all original specs
ModificationRequires engineering change orderProduct meets new specifications

The standard explicitly states that it does not limit the maximum number of rework, modification, or repair actions to a printed circuit assembly. However, your customer contracts or internal quality systems may impose such limits.

IPC Product Class System

Like other IPC standards, IPC-7711/7721 uses the three-class system to establish different levels of requirements based on end-use application.

Class Definitions

ClassNameDescriptionExamples
Class 1General Electronic ProductsProducts where function is the primary requirementConsumer electronics, toys, some industrial equipment
Class 2Dedicated Service Electronic ProductsProducts requiring continued performance and extended lifeTelecommunications, industrial controls, computers
Class 3High Performance Electronic ProductsProducts where continued performance or performance-on-demand is criticalMedical life support, military, aerospace, automotive safety

How Class Affects Procedures

The product class determines which procedures are acceptable and what conformance level is required. A repair technique acceptable for Class 1 may not meet Class 3 requirements. Throughout IPC-7711/7721, each procedure indicates which product classes it applies to using codes:

CodeMeaning
RRigid printed boards
FFlexible circuits
WWires and wire harnesses
CCables

IPC-7711: Rework Procedures

IPC-7711 covers all aspects of component rework—the controlled removal and replacement of electronic components on assembled boards.

Through-Hole Component Rework

Procedure NumberDescriptionSkill Level
3.1.1Through-Hole Desoldering — Continuous Vacuum MethodIntermediate
3.1.2Through-Hole Desoldering — Continuous Vacuum, Partial ClinchIntermediate
3.1.3Through-Hole Desoldering — Continuous Vacuum, Full ClinchIntermediate
3.1.4Through-Hole Desoldering — Full Clinch StraighteningIntermediate
3.1.5Through-Hole Desoldering — Full Clinch Wicking MethodIntermediate
3.2.xPGA and Connector Removal — Various MethodsAdvanced

Through-hole rework seems straightforward, but the devil is in the details. Full-clinched leads require different approaches than partial clinches. Heavy multilayer boards with internal ground planes need preheating to achieve proper solder reflow. The standard provides specific guidance for each situation.

Surface Mount Component Rework

Surface mount rework is where IPC-7711 really shines. The standard covers every common package type:

Component TypeRemoval MethodInstallation MethodTypical Skill Level
Chip components (0201-2512)Hot air, conductionSoldering iron, hot airIntermediate
MELFHot air, conductionSoldering ironIntermediate
SOT/SOICHot airHot air, soldering ironIntermediate
QFPHot air, focused IRHot air, focused IRAdvanced
J-Lead (PLCC)Hot airHot airAdvanced
BGA/CSPFocused IR with preheaterFocused IR with preheaterExpert
QFN/LGAHot air, focused IRHot air, focused IRExpert

BGA Rework Procedures

BGA rework deserves special attention because it’s technically demanding and increasingly common as more designs use area array packages. IPC-7711 includes comprehensive BGA coverage:

ProcedureDescription
BGA RemovalUsing focused IR reflow with bottom-side preheater
Site PreparationSolder removal, pad cleaning, inspection
BGA Reballing — Fixture MethodUsing reballing fixtures for new solder balls
BGA Reballing — Paper Carrier MethodAlternative for various ball sizes
BGA Reballing — Polyimide Stencil MethodPrecision reballing
BGA InstallationPlacement and reflow with profile control

For lead-free BGA rework, the standard recommends maintaining peak temperatures not exceeding 245°C while ensuring all solder joints reach liquidus. This requires careful profile development and often nitrogen atmosphere to prevent oxidation.

Conformal Coating Procedures

Before any rework can begin, conformal coating must be removed from the work area. After rework, coating must be replaced. IPC-7711 covers both:

ProcedureMethods Covered
Coating IdentificationVisual, solvent response, burn tests
Coating RemovalSolvent, peeling, thermal, mechanical, micro-abrasion, laser
Coating ReplacementBrush, spray for localized areas

Different coating types require different removal approaches:

Coating TypeRecommended Removal Method
AcrylicSolvent (most responsive)
EpoxyMechanical, micro-abrasion
SiliconePeeling, mechanical
UrethaneSolvent, mechanical
ParyleneMicro-abrasion, laser (solvent ineffective)

Read more IPC Standards:

IPC-7721: Repair and Modification Procedures

IPC-7721 addresses situations where the board itself is damaged or needs to be modified. These procedures often require advanced skills and specialized materials.

Laminate and Base Material Repairs

Procedure NumberDescriptionSkill Level
2.1Delamination/Blister Repair — Injection MethodAdvanced
2.2Bow and Twist RepairAdvanced
2.3Hole Repair — Epoxy MethodAdvanced
2.4Hole Repair — Transplant MethodAdvanced
2.5Key and Slot Repair — Epoxy MethodAdvanced
2.6Key and Slot Repair — Transplant MethodAdvanced
2.7Base Material Repair (burns, damage)Advanced

Laminate repairs are some of the most challenging procedures in the standard. Delamination injection requires drilling access holes, injecting low-viscosity epoxy, and curing under controlled conditions. When done correctly, the repair restores structural integrity. When done poorly, it creates additional problems.

Conductor and Pad Repairs

Damaged traces and pads are common repair targets. IPC-7721 provides multiple methods for each situation:

Repair TypeAvailable MethodsConformance Level
Lifted LandEpoxy method, Film adhesive methodMedium to High
Land ReplacementEpoxy method, Film adhesive methodMedium to High
Surface Conductor RepairEpoxy method, Film adhesive method, Solder methodMedium to High
Inner Layer ConductorCut and cap method, Drill through methodHigh
Edge ConnectorEpoxy method, Film adhesive method, Plating methodMedium to High
Plated Through HoleEyelet method, Epoxy method, Solder methodLow to High

Circuit Modifications

When engineering changes require circuit modifications, IPC-7721 provides procedures for:

Modification TypeProcedureSkill Level
Cutting TracesMechanical severing of surface conductorsIntermediate
Adding Jumper WiresInstalling point-to-point connectionsAdvanced
BGA Jumper WiresFoil jumper method, Through board methodExpert
Component AdditionsAdding components to existing circuitsAdvanced

The jumper wire procedures specify wire gauges, routing requirements, strain relief, and attachment methods. For high-reliability applications, even jumper wires must meet rigorous workmanship standards.

Wire Splicing Procedures

IPC-7721 includes four approved methods for splicing wires:

Splice TypeDescriptionConformance Level
Mesh SpliceWires meshed together and solderedLow
Wrap SpliceOne wire wrapped around anotherLow
Hook SpliceWires hooked togetherLow
Lap SpliceWires overlapped parallelLow

While these splicing methods have low conformance levels, they’re appropriate for field repairs and modifications where proper tooling isn’t available.

Skill Levels and Conformance Levels

IPC-7711/7721 assigns both skill level and conformance level ratings to each procedure. Understanding these ratings helps organizations assign work appropriately and assess risk.

Skill Level Definitions

LevelCodeDescription
IntermediateIBasic soldering/assembly knowledge, still developing experience with most procedures
AdvancedAProficient with most procedures, building deeper experience
ExpertEExtensive knowledge, strong experience, excellent manual skills

Skill levels aren’t just suggestions. Assigning a BGA rework task to an intermediate-level technician risks damaging expensive assemblies. The standard provides guidance for matching personnel capabilities to task requirements.

Conformance Level Definitions

LevelCodeMeaning
HighHProcedure produces results equivalent to original manufacturing
MediumMProcedure produces acceptable results but may not equal original manufacturing
LowLProcedure produces functional results but with visible differences from original

For Class 3 products, customers typically require High conformance level procedures. Class 1 products may accept Low conformance procedures when appropriate for the application.

Tools, Materials, and Equipment

IPC-7711/7721 specifies the tools and materials needed for each procedure. While it doesn’t mandate specific brands, it establishes functional requirements.

Essential Rework Equipment

Equipment CategoryPurposeKey Requirements
Soldering StationHand soldering operationsTemperature control, ESD safe
Hot Air Rework SystemSMD removal/installationTemperature and airflow control
Focused IR SystemBGA reworkTop and bottom heating, profile capability
PreheaterBoard-level heatingUniform heating, temperature control
Desoldering StationThrough-hole workVacuum extraction, temperature control
Microscope/MagnificationInspection, fine workAppropriate magnification for component size

Critical Materials

MaterialApplicationConsiderations
FluxSoldering operationsMust match solder alloy, cleaning requirements
Solder WireHand solderingDiameter, alloy, flux core type
Solder PasteSMD reworkAlloy, mesh size, flux type
Cleaning AgentsFlux removalCompatibility with materials, residue requirements
Epoxy (2-part)RepairsElectrical properties, cure requirements
Repair Circuit FramesPad replacementPre-made repair lands

Lead-Free Considerations

The standard addresses both tin-lead (SnPb) and lead-free soldering throughout. Key differences:

ParameterSnPb (Sn63/Pb37)Lead-Free (SAC305 typical)
Melting Point183°C217-220°C
Typical Peak Temp225-235°C240-250°C
WettingExcellentGood (slower)
OxidationModerateHigher (nitrogen helps)
Tip Temperature315-345°C345-400°C

Mixing lead-free components with tin-lead solder (or vice versa) requires understanding the metallurgical implications. IPC-7711/7721 addresses backward compatibility considerations.

IPC-7711/7721 Training and Certification

IPC offers a comprehensive training and certification program for IPC-7711/7721. For organizations performing rework and repair, certification demonstrates competence and provides standardized skills.

Certification Levels

LevelAbbreviationDurationTarget Audience
Certified IPC SpecialistCIS4 daysOperators, technicians performing rework/repair
Certified Standards ExpertCSE5 daysQuality engineers, process engineers, subject matter experts
Certified IPC TrainerCIT5 daysIndividuals who will train others internally

Training Modules

The IPC-7711/7721 training program is modular, allowing organizations to certify personnel in specific areas relevant to their work:

ModuleContent
Module 1General requirements, common procedures (mandatory)
Module 2Wire splicing procedures
Module 3Conformal coating removal and replacement
Module 4Through-hole component rework
Module 5Chip and MELF component rework
Module 6Gull wing (SOIC, QFP) component rework
Module 7J-lead component rework
Module 8BGA rework (lecture only in basic program)
Module 9Laminate repair
Module 10Circuit repair (conductor, pad)

Certification Benefits

BenefitDescription
Standardized SkillsAll certified personnel trained to same criteria
Industry RecognitionCertification recognized worldwide
Customer RequirementsMany contracts require IPC-certified personnel
Reduced DefectsProper training reduces rework of rework
DocumentationTraceable certification records

Certifications are valid for two years and require recertification to maintain.

Related Standards

IPC-7711/7721 references and works alongside several other IPC and industry standards:

StandardTitleRelationship
J-STD-001Requirements for Soldered Electrical and Electronic AssembliesQuality requirements for soldering during rework
IPC-A-610Acceptability of Electronic AssembliesAcceptance criteria after rework/repair
IPC-A-620Requirements for Cable and Wire Harness AssembliesCriteria for wire/cable work
IPC-HDBK-001Handbook for J-STD-001Additional guidance for soldering
ESD S20.20ESD Control ProgramESD protection during handling
ASTM StandardsVarious test methodsMaterial property testing

When performing rework, the completed work must meet J-STD-001 requirements and pass IPC-A-610 acceptance criteria. IPC-7711/7721 tells you how to do the work; J-STD-001 and IPC-A-610 tell you whether the results are acceptable.

Resources and Where to Purchase

Official IPC Sources

ResourceLink
Purchase IPC-7711/7721D StandardIPC Store
IPC-7711/7721D Table of ContentsIPC TOC PDF
IPC Training CentersIPC Training Locator
IPC Document Revision TableRevision History

Training Providers

Authorized IPC training centers worldwide offer IPC-7711/7721 certification:

Provider TypeExamples
IPC-Authorized CentersBEST Inc., EPTAC, STI Electronics, A.R.T., PIEK
In-House ProgramsMany large manufacturers maintain CIT trainers
Regional CentersAvailable in Americas, Europe, Asia

Supplementary Materials

MaterialPurpose
Training workmanship kitsPractice boards for certification
Visual aidsInstructor presentation materials
Repair circuit framesPre-made repair lands for pad replacement

Frequently Asked Questions About IPC-7711/7721

What is the difference between IPC-7711 and IPC-7721?

IPC-7711 covers rework procedures—removing and replacing components, preparing sites for new components, and correcting assembly defects without changing the original design. IPC-7721 covers repair and modification—restoring damaged boards (traces, pads, laminate) and making changes to implement engineering modifications. They’re published as a combined document because technicians often need both during the same job. For example, if a pad lifts during component removal (IPC-7711 procedure), you need a pad repair procedure (IPC-7721) before installing the replacement component.

How often is IPC-7711/7721 updated?

The standard is typically revised every 5-7 years, though change pages may be released between major revisions. The most recent major revision is Revision D, released in January 2024. This revision expanded coverage for cable and wire harness assemblies and incorporated all previous change pages from Revision C. Organizations should verify they’re using the current revision, especially when certification or customer contracts reference the standard.

Does IPC-7711/7721 limit how many times a board can be reworked?

No. The standard explicitly states that it “does not limit the maximum number of rework, modification or repair actions to a printed circuit assembly.” However, customer specifications, contract requirements, or internal quality systems may impose limits. Repeated thermal cycles from multiple reworks can affect board and component reliability, so engineering judgment should be applied. Some high-reliability programs limit the number of rework cycles on specific component types, particularly BGAs.

What skill level is required for BGA rework?

IPC-7711/7721 classifies BGA rework procedures as Expert level, the highest skill classification. This reflects the technical difficulty of the process—maintaining proper thermal profiles, preventing damage to adjacent components, and achieving reliable solder joints on area array packages requires extensive experience and specialized equipment. Organizations should ensure technicians have demonstrated proficiency before assigning BGA rework tasks. Most CIS certification programs cover BGA only in lecture format; hands-on BGA certification typically requires additional training.

Is IPC-7711/7721 certification required by law?

IPC-7711/7721 certification is not legally required, but it may be contractually required by customers. Many aerospace, defense, and medical device manufacturers require suppliers to have IPC-certified rework personnel. Even without explicit requirements, certification demonstrates competence and provides standardized training that reduces quality issues. For organizations performing rework as a business, certification can be a competitive advantage and may be required for certain industry sectors.

Implementing IPC-7711/7721 in Your Organization

Adopting IPC-7711/7721 requires more than purchasing the document. Successful implementation involves several steps.

Assess Your Current State

Before implementing the standard, understand your current rework and repair practices:

  • What types of rework/repair do you perform?
  • What training do technicians currently have?
  • What equipment and materials are available?
  • What documentation exists for procedures?
  • What are customer requirements?

Establish Training Requirements

Based on your assessment, determine training needs:

RoleTypical Training Need
Rework techniciansCIS certification in relevant modules
Process engineersCSE certification or equivalent knowledge
Quality engineersCSE certification for procedure approval
Internal trainersCIT certification to train CIS

Develop Internal Procedures

IPC-7711/7721 provides generic procedures. Many organizations develop internal work instructions that:

  • Reference specific IPC-7711/7721 procedure numbers
  • Specify equipment and materials used
  • Add organization-specific requirements
  • Include inspection checkpoints
  • Document approval workflows

Equip Your Facility

Ensure you have appropriate equipment for the procedures you’ll perform. Under-equipped facilities lead to poor results and frustrated technicians. Over-equipped facilities waste capital on capabilities you don’t need.

Document and Control

Establish documentation systems that:

  • Track certification status of personnel
  • Record rework/repair activities
  • Maintain material traceability
  • Support audit and compliance requirements

IPC-7711/7721 is fundamentally a procedures guide—it tells you how to do things correctly. But having the procedures is only the beginning. Having trained people who follow them consistently, with proper equipment and materials, under appropriate quality controls—that’s what produces reliable rework and repair results.


This article provides an overview of IPC-7711/7721 principles and procedures. For complete procedural details, illustrations, and requirements, purchase the standard directly from IPC at shop.ipc.org.

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Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.