Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

AMD XC2S200-6FGG515C: High-Performance Spartan-II FPGA for Advanced Digital Applications

Product Details

The AMD XC2S200-6FGG515C is a powerful field-programmable gate array (FPGA) from the proven Spartan-II family, engineered to deliver exceptional performance for demanding industrial, telecommunications, and embedded system applications. This versatile programmable logic device combines high-speed processing capabilities with cost-effective implementation, making it an ideal solution for engineers seeking reliable digital signal processing and control system solutions.

As a Xilinx FPGA device now under the AMD umbrella, the XC2S200-6FGG515C represents the legacy of excellence in programmable logic technology that has made this product line a preferred choice among hardware designers worldwide.


XC2S200-6FGG515C Technical Specifications Overview

The XC2S200-6FGG515C delivers comprehensive technical specifications that make it suitable for a wide range of digital design requirements. This FPGA offers substantial programmable resources with proven reliability for both prototyping and production environments.

Core Architecture Specifications

Parameter Specification
Device Family Spartan-II
System Gates 200,000
Logic Cells 5,292
CLB Array 14 × 28
Maximum Frequency 263 MHz
Process Technology 0.18 µm CMOS
Core Voltage 2.5V

Memory Configuration Details

Memory Type Capacity
Distributed RAM 56 Kbits
Block RAM 56 Kbits (14 × 4,096-bit blocks)
Total RAM Bits 57,344 bits

Package and I/O Specifications

Feature Value
Package Type FBGA (Fine-pitch Ball Grid Array)
Total Pins 515
User I/O Pins 284
I/O Banks 8 Independent VCCO Supplies
Delay-Locked Loops (DLLs) 4

XC2S200-6FGG515C Speed Grade and Temperature Range

The “-6” speed grade designation indicates this is the fastest speed option available in the Spartan-II XC2S200 series. This premium speed grade delivers optimized timing performance for applications requiring maximum clock frequencies and minimal propagation delays.

Operating Conditions

Parameter Specification
Speed Grade -6 (Fastest Available)
Temperature Range Commercial (0°C to +85°C)
Core Voltage Range 2.375V to 2.625V
I/O Voltage Standards 1.5V to 3.3V LVTTL/LVCMOS

XC2S200-6FGG515C Key Features and Benefits

Configurable Logic Block (CLB) Architecture

The XC2S200-6FGG515C incorporates a robust CLB architecture organized in a 14×28 array configuration. Each CLB contains four logic cells (LCs) with dedicated carry logic and direct feedthrough paths. This architecture enables efficient implementation of complex combinational and sequential logic functions with minimal routing overhead.

Versatile I/O Standards Support

This FPGA supports multiple I/O voltage standards for seamless integration with diverse system components:

  • LVTTL (3.3V Low-Voltage TTL)
  • LVCMOS (1.5V, 2.5V, 3.3V)
  • PCI 3.3V compliant
  • GTL and GTL+
  • SSTL2 and SSTL3 (DDR memory interfaces)
  • HSTL (High-Speed Transceiver Logic)

Integrated Delay-Locked Loops

Four on-chip DLLs positioned at each corner of the die provide zero-delay clock buffering, clock multiplication, and clock phase shifting capabilities. These DLLs enable precise clock management with features including:

  • Clock deskewing for board-level synchronization
  • Frequency synthesis (1.5×, 2×, 2.5×, 3×, 4×, 5× multiplication)
  • Phase shifting in 90° increments
  • Duty cycle correction

Block RAM Configuration Options

The dual-port block RAM supports flexible width configurations for various memory applications:

Port Width Depth Configuration
1-bit 4,096 4K × 1
2-bit 2,048 2K × 2
4-bit 1,024 1K × 4
8-bit 512 512 × 8
16-bit 256 256 × 16

XC2S200-6FGG515C Ordering Information

Understanding the part number structure helps engineers select the correct device variant:

Code Segment Meaning
XC2S Spartan-II Device Family
200 200K System Gates
-6 Speed Grade (Fastest)
FGG Fine-pitch BGA, Pb-Free (RoHS Compliant)
515 515-Pin Package
C Commercial Temperature Range

The “G” designation in FGG indicates Pb-free (lead-free) packaging, ensuring compliance with RoHS (Restriction of Hazardous Substances) environmental regulations.


XC2S200-6FGG515C Application Areas

The XC2S200-6FGG515C excels in numerous application domains where reliable programmable logic is essential:

Industrial Automation Systems

This FPGA provides the processing capability required for industrial control applications, including programmable logic controllers (PLCs), motor drive systems, and factory automation equipment. The robust operating temperature range ensures reliable performance in harsh industrial environments.

Telecommunications Equipment

High-speed data processing capabilities make this device suitable for telecommunications infrastructure, including base station controllers, network switches, and protocol conversion equipment.

Digital Signal Processing

With substantial logic resources and integrated block RAM, the XC2S200-6FGG515C supports complex DSP algorithms for audio processing, video encoding, and sensor signal conditioning applications.

Embedded Control Systems

The comprehensive I/O options and flexible configuration capabilities enable integration into embedded systems for automotive, aerospace, and consumer electronics applications.

Prototyping and Development

Engineers frequently select this FPGA for rapid prototyping of ASIC designs, allowing functional verification before committing to expensive mask-programmed alternatives.


XC2S200-6FGG515C Development Tools and Resources

Design Software Compatibility

The XC2S200-6FGG515C is fully supported by Xilinx ISE Design Suite, providing a comprehensive development environment that includes:

  • HDL synthesis and simulation tools
  • Timing analysis and constraint management
  • Floor planning and placement optimization
  • Configuration bitstream generation
  • JTAG-based device programming

Configuration Options

Multiple configuration modes accommodate various system requirements:

Mode Description
Master Serial FPGA generates configuration clock
Slave Serial External clock source
Master Parallel 8-bit parallel interface with internal clock
Slave Parallel 8-bit parallel with external clock
JTAG/Boundary Scan IEEE 1149.1 compliant programming

XC2S200-6FGG515C Competitive Advantages

Cost-Effective ASIC Alternative

The XC2S200-6FGG515C eliminates the high non-recurring engineering (NRE) costs associated with mask-programmed ASICs. Field programmability allows design modifications without hardware replacement, reducing time-to-market and development risk.

Proven Reliability

Built on mature 0.18 µm CMOS process technology, this FPGA delivers consistent performance with established reliability metrics. The Spartan-II architecture has been validated across millions of deployed units in demanding applications worldwide.

Comprehensive Ecosystem Support

Extensive third-party IP cores, reference designs, and development boards accelerate project development. The established user community provides valuable resources for troubleshooting and design optimization.


XC2S200-6FGG515C Package Dimensions and Mounting

The FBGA package provides optimal balance between I/O density and PCB assembly requirements:

Dimension Specification
Package Body 27mm × 27mm
Ball Pitch 1.0mm
Ball Count 515
Mounting Type Surface Mount (SMD)
Moisture Sensitivity Level MSL-3

PCB Design Considerations

Proper PCB layout practices ensure reliable operation:

  • Dedicated power planes for VCCINT (2.5V core) and VCCO (I/O voltage)
  • Decoupling capacitors placed close to power pins
  • Controlled impedance routing for high-speed signals
  • Adequate thermal relief for heat dissipation

XC2S200-6FGG515C Quality and Compliance

Environmental Compliance

Standard Status
RoHS Compliant (Pb-Free)
REACH Compliant
Conflict Minerals Compliant

Quality Certifications

AMD (formerly Xilinx) maintains rigorous quality standards throughout the manufacturing process, ensuring consistent device performance and reliability across production lots.


Summary

The AMD XC2S200-6FGG515C represents a proven solution for engineers requiring reliable, high-performance FPGA capabilities in a comprehensive package. With 200,000 system gates, 5,292 logic cells, 284 user I/O pins, and maximum operating frequency of 263 MHz, this Spartan-II device delivers the processing power needed for demanding digital applications.

The -6 speed grade ensures optimal timing performance, while the Pb-free FBGA package meets modern environmental regulations. Backed by comprehensive development tools, extensive documentation, and global support infrastructure, the XC2S200-6FGG515C continues to serve as a dependable choice for industrial, telecommunications, and embedded system designs.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.