The AMD XC2S200-6FGG512C is a high-performance field-programmable gate array from the renowned Spartan-II FPGA family. This versatile programmable logic device delivers exceptional performance for digital signal processing, industrial control systems, and embedded applications. With 200,000 system gates and advanced on-chip memory resources, the XC2S200-6FGG512C offers engineers a cost-effective alternative to mask-programmed ASICs.
XC2S200-6FGG512C Key Features and Benefits
The XC2S200-6FGG512C combines proven Spartan-II architecture with industrial-grade reliability. This Xilinx FPGA solution eliminates lengthy development cycles while enabling field-upgradable designs that adapt to evolving requirements.
Why Choose the XC2S200-6FGG512C FPGA?
Engineers select the XC2S200-6FGG512C for applications requiring high logic density, flexible I/O configurations, and rapid time-to-market. The device’s programmability permits design upgrades without hardware replacement, providing significant advantages over traditional ASIC implementations.
XC2S200-6FGG512C Technical Specifications
Core Architecture Specifications
| Parameter |
Specification |
| Device Family |
Spartan-II FPGA |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| Configurable Logic Blocks (CLBs) |
1,176 |
| CLB Array Configuration |
28 × 42 |
| Maximum User I/O |
284 |
| Process Technology |
0.18μm |
| Core Supply Voltage |
2.5V |
XC2S200-6FGG512C Memory Resources
| Memory Type |
Capacity |
| Distributed RAM |
75,264 bits |
| Block RAM |
56 Kbits |
| Block RAM Modules |
14 blocks |
| Total On-Chip Memory |
131 Kbits |
Each block RAM cell functions as a fully synchronous dual-ported 4096-bit RAM with independent control signals for each port. The distributed RAM resources enable flexible memory configurations throughout the device fabric.
Clock Management and Timing
| Parameter |
Value |
| Maximum Operating Frequency |
263 MHz |
| Speed Grade |
-6 |
| Delay-Locked Loops (DLLs) |
4 |
| Global Clock Networks |
4 Primary |
The four DLLs positioned at each die corner provide advanced clock management capabilities, including clock deskewing, phase shifting, and frequency synthesis for optimal system timing.
XC2S200-6FGG512C Package Information
FGG512 Package Specifications
| Parameter |
Specification |
| Package Type |
Fine-pitch Ball Grid Array (FBGA) |
| Pin Count |
512 |
| Ball Pitch |
1.0 mm |
| Mounting Type |
Surface Mount |
| Lead-Free Option |
Available (Pb-free) |
The FGG512 package provides optimal board space utilization while maintaining excellent thermal performance and signal integrity characteristics essential for high-speed digital designs.
Operating Conditions
| Parameter |
Commercial Grade |
| Junction Temperature |
0°C to +85°C |
| Core Voltage (VCCINT) |
2.375V to 2.625V |
| I/O Voltage (VCCO) |
1.4V to 3.6V |
XC2S200-6FGG512C I/O Capabilities
Supported I/O Standards
The XC2S200-6FGG512C supports multiple single-ended and differential I/O standards for seamless integration with various system interfaces:
- LVTTL (Low-Voltage TTL)
- LVCMOS (Low-Voltage CMOS) at 3.3V, 2.5V, and 1.8V
- PCI 3.3V and PCI-X compliant
- GTL and GTL+
- SSTL2 and SSTL3
- HSTL Class I, II, III, and IV
- CTT (Center-Tapped Termination)
I/O Block Features
Each Input/Output Block (IOB) includes programmable input and output delays, optional pull-up and pull-down resistors, and support for slew rate control. The IOBs enable direct interfacing with standard memory devices, processors, and communication interfaces.
XC2S200-6FGG512C Applications
Industrial Control Systems
The XC2S200-6FGG512C excels in programmable logic controller (PLC) implementations, motor control systems, and process automation equipment. The high I/O count and flexible logic resources enable complex control algorithms with real-time response requirements.
Digital Signal Processing
With substantial distributed and block RAM resources, the XC2S200-6FGG512C handles DSP-intensive applications including audio processing, video filtering, and communication signal conditioning. The 263 MHz operating frequency supports demanding computational workloads.
Communication Systems
Engineers deploy the XC2S200-6FGG512C in network interface cards, protocol converters, and telecommunications equipment. The multiple I/O standards support ensures compatibility with diverse communication protocols and physical layer interfaces.
Embedded Systems
The device serves as an ideal co-processor or peripheral controller in embedded designs, offloading computation-intensive tasks from main processors while providing hardware acceleration for custom algorithms.
XC2S200-6FGG512C Design Resources
Development Tools
The XC2S200-6FGG512C is fully supported by Xilinx ISE Design Suite, providing comprehensive design entry, synthesis, implementation, and verification capabilities. Engineers can develop using industry-standard HDL languages including VHDL and Verilog.
Configuration Options
The device supports multiple configuration modes:
- Master Serial Mode
- Slave Serial Mode
- Master Parallel Mode
- Slave Parallel Mode (SelectMAP)
- JTAG/Boundary Scan Mode
Configuration data can be stored in serial or parallel PROMs, flash memory, or loaded dynamically from system processors for maximum design flexibility.
XC2S200-6FGG512C Part Number Decoder
Understanding the complete part number helps identify exact device specifications:
- XC2S200: Spartan-II family, 200K system gates
- -6: Speed grade (fastest commercial grade)
- FGG: Fine-pitch Ball Grid Array, Pb-free package
- 512: Pin count
- C: Commercial temperature range (0°C to +85°C)
XC2S200-6FGG512C Ordering Information
When ordering the XC2S200-6FGG512C, verify the following parameters match your application requirements:
- Speed grade compatibility with design timing requirements
- Package footprint alignment with PCB design
- Temperature range suitability for operating environment
- Lead-free (Pb-free) or standard packaging based on assembly requirements
Summary
The AMD XC2S200-6FGG512C Spartan-II FPGA delivers proven performance, comprehensive I/O flexibility, and robust design resources for diverse programmable logic applications. With 200,000 system gates, 5,292 logic cells, and 131 Kbits of on-chip memory in the FGG512 package, this device provides the optimal balance of capability and cost-effectiveness for industrial, communication, and embedded system designs.
