The XC2S200-6FGG504C is a high-performance field-programmable gate array (FPGA) from AMD’s renowned Spartan-II family. This versatile programmable logic device delivers exceptional value for engineers seeking cost-effective solutions without sacrificing performance. With 200,000 system gates and the fastest -6 speed grade, the XC2S200-6FGG504C serves as a superior alternative to traditional mask-programmed ASICs.

XC2S200-6FGG504C Key Features and Benefits

The XC2S200-6FGG504C combines advanced programmable logic capabilities with industry-leading flexibility. This Xilinx FPGA eliminates the initial cost, lengthy development cycles, and inherent risks associated with conventional ASICs. Field-programmable design updates are possible without hardware replacement, making it ideal for prototyping and production environments alike.

Advanced Spartan-II Architecture

The Spartan-II architecture featured in the XC2S200-6FGG504C consists of five fundamental programmable elements that work together to deliver outstanding performance:

• Configurable Logic Blocks (CLBs): 1,176 total CLBs arranged in a 28 × 42 array provide the main logic resources
• Input/Output Blocks (IOBs): Up to 284 user I/O pins with 16 I/O standard support
• Block RAM: 14 dedicated memory blocks totaling 56 Kilobits
• Delay-Locked Loops (DLLs): Four DLLs positioned at each die corner for precise clock management
• Programmable Routing Matrix: Optimized interconnect architecture for minimal signal delays

XC2S200-6FGG504C Technical Specifications

XC2S200-6FGG504C Logic Cell Architecture

Each logic cell within the XC2S200-6FGG504C represents the fundamental building block of the CLB structure. The logic cell architecture comprises three essential components that enable efficient digital design implementation.

Four-Input Function Generator

The XC2S200-6FGG504C utilizes look-up tables (LUTs) as four-input function generators capable of implementing any Boolean function of four variables. These LUTs also function as distributed RAM when additional on-chip memory is required, providing 75,264 bits of distributed RAM capacity.

Storage Elements and Carry Logic

Each logic cell includes a dedicated storage element configurable as either an edge-triggered D-type flip-flop or a level-sensitive latch. The integrated carry logic enables high-speed arithmetic operations essential for digital signal processing and mathematical computations.

XC2S200-6FGG504C Block RAM Capabilities

The 56 Kilobits of block RAM in the XC2S200-6FGG504C offer significant advantages over distributed memory solutions for larger data storage requirements.

Dual-Port RAM Architecture

Each of the 14 block RAM cells functions as a fully synchronous dual-ported 4,096-bit RAM with independent control signals for each port. This architecture supports simultaneous read and write operations from both ports, enabling efficient data buffering and FIFO implementations.

Flexible Port Configuration

The block RAM ports support configurable data widths, allowing engineers to optimize memory utilization based on application requirements:

XC2S200-6FGG504C Clock Distribution System

Reliable clock management is critical for high-performance digital designs. The XC2S200-6FGG504C incorporates four Delay-Locked Loops positioned at each corner of the die for comprehensive clock distribution.

DLL Features and Functions

The DLLs in the XC2S200-6FGG504C provide several clock management capabilities:

• Clock Deskewing: Eliminates clock distribution delays to ensure simultaneous clock arrival across the device
• Clock Mirroring: Enables board-level clock deskewing by driving DLL outputs off-chip and back
• Frequency Synthesis: Generates multiple clock frequencies from a single input source
• Phase Shifting: Provides programmable phase adjustments for timing optimization

XC2S200-6FGG504C I/O Capabilities

The input/output system of the XC2S200-6FGG504C supports up to 284 user-configurable I/O pins with comprehensive signaling standard support.

Supported I/O Standards

The XC2S200-6FGG504C provides native support for 16 different I/O signaling standards:

• Single-Ended Standards: LVTTL, LVCMOS2, LVCMOS18, PCI 3.3V, PCI-X, GTL, GTL+
• Differential Standards: LVDS, BLVDS, LVPECL
• Memory Interface Standards: SSTL3 (Class I/II), SSTL2 (Class I/II), HSTL (Class I/III/IV)

IOB Register Architecture

Each IOB contains three registers functioning as D-type edge-triggered flip-flops or level-sensitive latches. Individual clock enable signals provide granular control over I/O timing, ensuring optimal interface performance with external devices.

XC2S200-6FGG504C Package Information

The FGG504C designation indicates a fine-pitch ball grid array package with Pb-free (lead-free) construction, complying with RoHS environmental directives.

Package Characteristics

XC2S200-6FGG504C Application Areas

The exceptional balance of performance, features, and cost-effectiveness makes the XC2S200-6FGG504C suitable for diverse application domains.

Industrial and Commercial Applications

• Digital Signal Processing: Audio, video, and communications signal processing
• Control Systems: Industrial automation and motor control implementations
• Communication Systems: Protocol conversion and interface bridging
• Test and Measurement: Data acquisition and instrument control
• Consumer Electronics: Display controllers and multimedia processing

Development and Prototyping

The XC2S200-6FGG504C programmability enables rapid prototyping with in-system reconfiguration capabilities. Engineers can iterate designs quickly without hardware changes, significantly reducing time-to-market for new products.

XC2S200-6FGG504C Design Resources

Comprehensive development tool support simplifies XC2S200-6FGG504C implementation in new designs.

Software Tools

The Xilinx ISE Design Suite provides complete synthesis, implementation, and verification capabilities for Spartan-II devices. Design entry options include HDL (Verilog/VHDL) and schematic capture methodologies.

Configuration Options

The XC2S200-6FGG504C supports multiple configuration modes:

• Serial configuration via Platform Flash PROMs
• Parallel configuration using SelectMAP interface
• JTAG boundary scan for development and testing
• In-system reconfiguration for field updates

XC2S200-6FGG504C Ordering Information

Part Number Breakdown

Related Part Numbers

Engineers may also consider these alternative configurations based on project requirements:

• Different Speed Grades: -5 speed grade for reduced power consumption
• Temperature Variants: Industrial (-40°C to +100°C) versions available
• Package Options: PQ208, FG256 packages for different board layouts

Why Choose XC2S200-6FGG504C for Your Project

The XC2S200-6FGG504C delivers compelling advantages for embedded system designers:

Cost-Effective ASIC Alternative

Eliminate non-recurring engineering costs while maintaining production flexibility. The programmable architecture allows design modifications throughout the product lifecycle without expensive mask revisions.

Fastest Speed Grade Performance

The -6 speed grade designation indicates the highest performance tier within the Spartan-II family, ensuring optimal timing margins for demanding applications operating at speeds up to 263 MHz.

Environmental Compliance

Pb-free packaging meets worldwide environmental regulations including RoHS and WEEE directives, simplifying product compliance certification.

Proven Reliability

The Spartan-II architecture has demonstrated exceptional reliability across millions of deployed units in industrial, commercial, and consumer applications worldwide.

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