Overview of XQVR600-3CB228V Radiation-Hardened FPGA

The XQVR600-3CB228V is a high-performance, radiation-hardened field-programmable gate array (FPGA) manufactured by Xilinx (now AMD). This QPro Virtex 2.5V device delivers exceptional programmable logic capabilities specifically engineered for demanding aerospace, satellite, and space exploration missions where radiation tolerance is critical.

As part of the legendary Xilinx FPGA QPro Virtex family, the XQVR600-3CB228V represents proven technology trusted by NASA, JPL, and defense organizations worldwide for mission-critical applications.

Key Technical Specifications of XQVR600-3CB228V

Core Architecture Parameters

Radiation Hardness Characteristics

Product Features and Capabilities

Advanced Programmable Logic Architecture

The XQVR600-3CB228V FPGA incorporates sophisticated design features that make it ideal for space applications:

Configurable Logic Blocks (CLBs)

• 16-bit LUTs configurable as shift registers
• Dual-ported 16-bit RAM capability
• 32-bit RAM configuration options
• Abundant flip-flops with synchronous/asynchronous controls

Interconnect Resources

• Hierarchical routing architecture
• Optimized place-and-route efficiency
• Fast, flexible global routing matrix
• Predictable timing performance

Memory System

• Distributed RAM throughout fabric
• Hierarchical memory architecture
• Multiple configuration options for performance optimization

Radiation-Hardened Design Excellence

The XQVR600-3CB228V employs advanced manufacturing processes to achieve exceptional radiation tolerance:

• Epitaxial layer technology for latch-up immunity
• Specialized CMOS process optimized for space environments
• Extensive qualification testing in heavy ion environments
• SEU mitigation techniques built into architecture

Package Configuration: CB228 Ceramic Quad Flat Pack

Physical Specifications

Standard Microcircuit Drawing (SMD) Information

The XQVR600-3CB228V is available with SMD qualification:

• SMD Number: 5962R9957301QYC (Base) / 5962R9957301QZC (Lid)
• Manufacturing Class: Q (Space-grade)
• Package Markings: Per MIL-STD-1835 requirements

Target Applications for XQVR600-3CB228V

Space and Satellite Systems

The XQVR600-3CB228V has been deployed in numerous critical space missions:

Proven Space Heritage

• NASA Mars Exploration Rover missions
• Commercial satellite programs (Raytheon OPTUS)
• Deep space exploration platforms
• Earth observation satellites

Application Areas

• Command and data handling systems
• Payload processing units
• Attitude determination and control
• Communication subsystems
• Science instrument interfaces

Defense and Aerospace Applications

• Avionics systems for harsh environments
• Military satellite communications
• Missile guidance systems
• Reconnaissance platforms
• Nuclear-hardened electronics

High-Reliability Industrial Uses

• Nuclear power plant monitoring
• Medical radiation therapy equipment
• Particle accelerator control systems
• High-energy physics experiments

Performance Specifications

Electrical Characteristics

Timing Performance

The -3 speed grade of the XQVR600-3CB228V provides balanced performance for space applications where power consumption and reliability are equally important as raw speed. The device supports:

• Clock frequencies suitable for space-qualified designs
• Predictable propagation delays across temperature ranges
• Stable performance under radiation exposure
• Low-power operation modes for extended missions

Development and Design Support

Software Tools Compatibility

The XQVR600-3CB228V is supported by industry-standard FPGA development tools:

Xilinx ISE Design Suite

• Comprehensive synthesis and implementation
• Radiation-aware place and route
• Timing analysis with derating factors
• Configuration bitstream generation

Design Flow Features

• IP core integration (PCI, memory controllers, DSP blocks)
• Simulation and verification tools
• Power analysis utilities
• Constraint-driven optimization

Design Considerations for Space Applications

When implementing designs with the XQVR600-3CB228V, engineers should consider:

1. Triple Modular Redundancy (TMR) for critical logic paths
2. SEU scrubbing techniques for configuration memory
3. Clock management strategies for radiation environments
4. Power supply filtering and regulation requirements
5. Thermal management in vacuum conditions

Quality and Reliability Standards

Manufacturing Quality Control

The XQVR600-3CB228V undergoes rigorous qualification processes:

Class V / QML-V Compliance

• Particle Impact Noise Detection (PIND)
• X-ray inspection of internal structure
• Destructive Physical Analysis (DPA)
• Extended burn-in testing (1000+ hours)
• Serialization and traceability

Radiation Testing and Characterization

Each device lot receives comprehensive radiation qualification:

• Total dose testing per MIL-STD-750 Method 1019
• Heavy ion characterization for SEU rates
• Proton exposure testing
• Neutron testing for terrestrial applications
• Temperature-dependent radiation response verification

Competitive Advantages

Why Choose XQVR600-3CB228V?

Heritage and Proven Performance

• Decades of successful space missions
• Extensive flight history and reliability data
• Trusted by major space agencies worldwide

Technical Superiority

• High logic density for complex designs
• Flexible architecture for diverse applications
• Excellent radiation tolerance specifications
• Comprehensive development tool support

Cost-Effectiveness

• Off-the-shelf availability eliminates ASIC development costs
• Reprogrammability allows design updates and corrections
• Reduced development time with IP core reuse
• Lower total cost of ownership for space programs

Ordering Information and Availability

Part Number Breakdown

XQVR600-3CB228V

• XQ: QPro space-grade designation
• VR600: Virtex Radiation-Hardened, 600K system gates
• -3: Speed grade
• CB: Ceramic Quad Flat Pack
• 228: Pin count
• V: Class V screening level

Procurement Considerations

When ordering XQVR600-3CB228V devices:

1. Lead Times: Allow 12-20 weeks for Class V devices
2. Minimum Order Quantities: Typically negotiable based on program requirements
3. Documentation: Request Certificate of Conformance (C of C) and test data
4. Lot Date Codes: Specify recent manufacturing if critical
5. SMD Requirements: Indicate if Standard Microcircuit Drawing compliance needed

Comparison with Similar Devices

XQVR600 Family Variants

Alternative QPro Virtex Options

Lower Density: XQVR300-3CB228V (300K gates)

• Suitable for less complex applications
• Lower power consumption
• Reduced cost

Higher Density: XQVR1000-3CG560V (1M gates)

• Maximum logic resources
• 560-pin ceramic column grid array
• Premium performance tier

Technical Support and Resources

Available Documentation

Engineers working with the XQVR600-3CB228V should reference:

• DS028: QPro Virtex 2.5V Radiation-Hardened FPGAs Product Specification
• Application Notes: SEU mitigation techniques for Virtex FPGAs
• Package Specifications: Mechanical drawings and thermal data
• Reliability Reports: Radiation test results from XRTC
• User Guides: ISE tools for radiation-hardened designs

Design Assistance

Xilinx (AMD) provides comprehensive technical support for space programs:

• Field Application Engineers (FAEs) with space expertise
• Radiation effects consultation
• Design review services
• Custom screening options for specific mission profiles

Frequently Asked Questions

Q: What is the expected lifetime of XQVR600-3CB228V in orbit? A: With proper SEU mitigation, devices typically exceed 15-year mission lifetimes, depending on orbit and shielding.

Q: Can the XQVR600-3CB228V be reprogrammed in-flight? A: Yes, the device supports in-system reconfiguration, enabling firmware updates during missions.

Q: What is the difference between -3 and -4 speed grades? A: The -4 speed grade offers faster performance but may have different power characteristics. The -3 grade provides optimal balance for most space applications.

Q: Are there plastic package options available? A: The XQVR600 series is primarily offered in ceramic packages for hermetic sealing required in space environments.

Q: How does radiation affect FPGA performance? A: Total dose causes gradual performance degradation, while SEUs cause transient errors. Both are manageable with proper design techniques and the device’s inherent radiation tolerance.

Conclusion

The XQVR600-3CB228V represents a proven, reliable solution for space and aerospace applications requiring radiation-hardened programmable logic. With its combination of substantial logic capacity, exceptional radiation tolerance, and flexible architecture, this device continues to be specified in critical missions worldwide.

For engineers developing next-generation space systems, the XQVR600-3CB228V offers the perfect balance of performance, reliability, and cost-effectiveness. Its extensive flight heritage and comprehensive support ecosystem make it an ideal choice for both new designs and technology refreshes of existing platforms.

Whether you’re designing satellite payloads, spacecraft avionics, or ground-based radiation-tolerant systems, the XQVR600-3CB228V provides the programmable logic foundation your mission demands.