The AMD XC2S200-6FGG499C is a high-density field-programmable gate array (FPGA) from the renowned Spartan-II family. This advanced programmable logic device delivers exceptional performance with 200,000 system gates, making it an ideal solution for engineers and designers seeking reliable, cost-effective digital logic implementation. Whether you’re developing telecommunications infrastructure, industrial control systems, or consumer electronics, the XC2S200-6FGG499C provides the flexibility and processing power required for demanding applications.
XC2S200-6FGG499C Key Features and Technical Specifications
The XC2S200-6FGG499C combines substantial logic resources with advanced memory capabilities, all manufactured using proven 0.18-micron CMOS technology. This device offers an outstanding balance between performance, power consumption, and cost-effectiveness for volume production applications.
Logic and Gate Specifications
| Parameter |
Specification |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| CLB Array |
28 × 42 (1,176 CLBs) |
| Maximum User I/O |
284 |
| Speed Grade |
-6 (Higher Performance) |
Memory Architecture
The XC2S200-6FGG499C features a robust dual-memory architecture that provides designers with flexible data storage options:
- Block RAM: 56K bits organized in fourteen 4096-bit blocks, supporting configurable port widths and dual-port operation
- Distributed RAM: 75,264 bits available through LUT-based implementation for fast, local storage requirements
Package and Electrical Characteristics
| Characteristic |
Value |
| Package Type |
499-Pin Fine-Pitch BGA (FGG499) |
| Core Voltage (VCCINT) |
2.5V |
| I/O Voltage (VCCO) |
1.5V / 2.5V / 3.3V Selectable |
| Operating Temperature |
0°C to +85°C (Commercial) |
| Process Technology |
0.18 Micron CMOS |
| Maximum Frequency |
Up to 200 MHz System Clock |
| RoHS Compliance |
Pb-Free (Lead-Free) |
Advanced I/O Standards and Interface Support
The XC2S200-6FGG499C supports 16 different I/O signaling standards, enabling seamless integration with diverse system architectures. This comprehensive I/O flexibility eliminates the need for external level shifters in many applications.
Supported I/O Standards
- LVTTL: 3.3V Low-Voltage TTL (2-24 mA drive strength)
- LVCMOS2: 2.5V Low-Voltage CMOS
- PCI: 3.3V/5V at 33MHz/66MHz compliant
- GTL/GTL+: Gunning Transceiver Logic for high-speed buses
- HSTL: High-Speed Transceiver Logic (Class I, III, IV)
- SSTL2/SSTL3: Stub Series Terminated Logic for DDR interfaces
- CTT: Center Tap Terminated
- AGP-2X: Accelerated Graphics Port compatibility
Spartan-II FPGA Architecture Overview
The XC2S200-6FGG499C is built on the proven Spartan-II architecture, which incorporates several key structural elements designed for optimal performance and design flexibility.
Configurable Logic Blocks (CLBs)
Each CLB contains four logic cells organized in two slices. The logic cells feature 4-input look-up tables (LUTs) that can implement any Boolean function, along with dedicated carry logic for high-speed arithmetic operations and D-type flip-flops with comprehensive clock enable and reset capabilities.
Clock Management with Delay-Locked Loops
Four dedicated Delay-Locked Loop (DLL) circuits provide advanced clock management capabilities:
- Zero propagation delay clock distribution
- Clock multiplication (2×) and division (up to 16×)
- Four-phase clock output generation (0°, 90°, 180°, 270°)
- Board-level clock deskewing for multi-device synchronization
IEEE 1149.1 Boundary Scan Support
Full JTAG boundary scan compliance enables comprehensive in-system testing and debugging. The dedicated Test Access Port (TAP) supports EXTEST, SAMPLE/PRELOAD, BYPASS, and configuration operations without requiring additional device pins.
Target Applications for XC2S200-6FGG499C
The versatile XC2S200-6FGG499C FPGA serves diverse market segments requiring high-performance programmable logic:
Telecommunications and Networking
Deploy the XC2S200-6FGG499C in routers, switches, protocol converters, and base station equipment where real-time signal processing and flexible interface adaptation are essential.
Industrial Automation and Control
Implement sophisticated motion control algorithms, sensor interfaces, and real-time process controllers with deterministic timing guaranteed by dedicated hardware logic.
Consumer Electronics
Accelerate time-to-market for display controllers, audio/video processing systems, and smart appliance interfaces with field-updatable logic that adapts to evolving requirements.
Medical and Scientific Instrumentation
Build high-reliability data acquisition systems, image processing pipelines, and precision measurement equipment requiring guaranteed timing and signal integrity.
Why Choose the XC2S200-6FGG499C Over Mask-Programmed ASICs
The XC2S200-6FGG499C offers compelling advantages compared to traditional Application-Specific Integrated Circuits (ASICs):
- Zero NRE Costs: Eliminate expensive mask tooling and engineering charges
- Rapid Development: Reduce design cycles from months to weeks
- Field Upgradability: Update functionality without hardware replacement
- Design Risk Mitigation: Prototype and verify before volume commitment
- Unlimited Reprogrammability: SRAM-based configuration supports infinite design iterations
Configuration Modes and Programming Options
The XC2S200-6FGG499C supports multiple configuration modes to accommodate various system architectures:
Serial Configuration
- Master Serial: FPGA generates CCLK (4-60 MHz programmable) to drive external PROM
- Slave Serial: External controller provides CCLK and configuration data
Parallel Configuration
- Slave Parallel: 8-bit wide data path for fastest configuration (up to 66 MHz)
JTAG Configuration
- Boundary Scan: Configure through IEEE 1149.1 TAP interface without dedicated configuration pins
Development Tools and Design Support
The XC2S200-6FGG499C is fully supported by comprehensive development environments that streamline the design process from concept to production.
Design Entry and Synthesis
Use industry-standard HDL languages (Verilog, VHDL) or schematic capture with automatic mapping to the Spartan-II architecture. The unified library contains over 400 primitives and macros for rapid design implementation.
Implementation and Verification
Timing-driven place-and-route tools automatically optimize designs for performance targets. Static timing analysis and comprehensive simulation support ensure design correctness before hardware deployment.
Ordering Information for XC2S200-6FGG499C
The XC2S200-6FGG499C part number decodes as follows:
- XC2S200: Spartan-II device with 200K system gates
- -6: Higher performance speed grade (commercial temperature only)
- FGG: Fine-pitch BGA package, Pb-free (lead-free)
- 499: 499-pin package
- C: Commercial temperature range (0°C to +85°C)
Related Spartan-II FPGA Family Devices
Consider these alternative Spartan-II devices based on your specific application requirements:
| Device |
System Gates |
Logic Cells |
Block RAM |
Max I/O |
| XC2S150 |
150,000 |
3,888 |
48K bits |
260 |
| XC2S200 |
200,000 |
5,292 |
56K bits |
284 |
| XC2S100 |
100,000 |
2,700 |
40K bits |
176 |
Technical Documentation and Resources
For complete technical specifications, pinout diagrams, and application notes, refer to the official AMD (formerly Xilinx) Spartan-II FPGA Family Data Sheet (DS001). This comprehensive document provides detailed electrical characteristics, timing parameters, and design guidelines.
Engineers seeking additional FPGA solutions can explore our complete selection of Xilinx FPGA products for various performance and density requirements.
Conclusion
The AMD XC2S200-6FGG499C represents an excellent choice for designers requiring substantial programmable logic resources in a cost-effective, production-ready package. With 200,000 system gates, 56K bits of block RAM, comprehensive I/O standard support, and proven 0.18-micron technology, this Spartan-II FPGA delivers the performance and flexibility needed for modern embedded system designs. Its field-programmable nature, combined with extensive development tool support, enables rapid prototyping and seamless transition to volume manufacturing.