Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

AMD XC2S200-6FGG498C Spartan-II FPGA: Complete Technical Guide and Specifications

Product Details

The AMD XC2S200-6FGG498C is a high-performance Field Programmable Gate Array (FPGA) from the renowned Spartan-II family. This versatile programmable logic device delivers exceptional processing capabilities with 200,000 system gates, making it an ideal solution for complex digital design applications across telecommunications, industrial automation, and embedded systems.

XC2S200-6FGG498C Key Features and Benefits

The XC2S200-6FGG498C combines advanced programmable logic architecture with cost-effective implementation. Engineers and designers choose this FPGA for its reliable performance and comprehensive feature set that includes:

  • 200,000 System Gates for implementing complex digital circuits
  • 5,292 Logic Cells providing extensive design flexibility
  • 1,176 Configurable Logic Blocks (CLBs) arranged in a 28 x 42 array
  • -6 Speed Grade offering higher performance for commercial applications
  • FGG498 Fine-Pitch BGA Package ensuring compact PCB mounting
  • Lead-Free (Pb-Free) Construction for RoHS compliance

XC2S200-6FGG498C Technical Specifications

Core Architecture Specifications

Parameter Value
Device Family Spartan-II
System Gates 200,000
Logic Cells 5,292
CLB Array 28 x 42
Total CLBs 1,176
Maximum User I/O 284
Process Technology 0.18µm CMOS
Core Voltage 2.5V

Memory Resources

The XC2S200-6FGG498C provides substantial on-chip memory options for data-intensive applications:

Memory Type Capacity
Total Block RAM 56 Kbits
Block RAM Blocks 14
Distributed RAM 75,264 bits
RAM Configuration Single/Dual-Port

Clock Management and Distribution

This Xilinx FPGA features advanced clock management capabilities essential for high-speed digital designs:

  • Four Delay-Locked Loops (DLLs) for precise clock control
  • Four Global Clock Networks with low-skew distribution
  • System Performance up to 200 MHz
  • Clock Multiplication and Division capabilities
  • Zero Delay Clock Distribution throughout the device

XC2S200-6FGG498C Package Information

FGG498 Fine-Pitch Ball Grid Array Details

The FGG498 package option delivers optimal board-level integration:

Package Characteristic Specification
Package Type Fine-Pitch BGA
Total Balls 498
Ball Pitch 1.0mm
Package Dimensions Compact form factor
Lead-Free Yes (Pb-Free/RoHS)

I/O Capabilities and Interface Standards

The XC2S200-6FGG498C supports 16 different I/O standards for maximum design flexibility:

  • LVTTL (2-24 mA drive strength)
  • LVCMOS (2.5V)
  • PCI (3.3V/5V, 33MHz/66MHz compliant)
  • GTL and GTL+
  • HSTL (Class I, III, IV)
  • SSTL2 and SSTL3 (Class I and II)
  • CTT
  • AGP-2X

XC2S200-6FGG498C Speed Grade Explanation

The -6 speed grade designation indicates this device offers enhanced performance characteristics. Important considerations include:

  • Higher internal switching speeds
  • Optimized for demanding commercial applications
  • Operating temperature range: 0°C to +85°C (Commercial)
  • The -6 speed grade is exclusively available in Commercial temperature range

XC2S200-6FGG498C Part Number Breakdown

Understanding the part number helps identify exact device specifications:

Code Meaning
XC2S200 Spartan-II 200K gate device
-6 Speed grade (higher performance)
FGG Fine-pitch BGA with Pb-free balls
498 Number of package pins
C Commercial temperature range

Applications for XC2S200-6FGG498C FPGA

Industrial and Commercial Applications

The XC2S200-6FGG498C excels in numerous application areas:

Telecommunications Equipment

  • Network routers and switches
  • Protocol conversion systems
  • Base station infrastructure
  • Data encryption modules

Industrial Automation

  • Motor control systems
  • Process automation controllers
  • Machine vision processing
  • PLC implementations

Consumer Electronics

  • Set-top boxes
  • Digital displays
  • Audio/video processing
  • Gaming peripherals

Automotive Systems

  • Advanced driver assistance systems (ADAS)
  • Infotainment controllers
  • Body electronics modules
  • Diagnostic interfaces

XC2S200-6FGG498C Design Resources

Development Tools and Software

Engineers working with the XC2S200-6FGG498C can access comprehensive development resources:

  • ISE Design Suite for complete FPGA design flow
  • Schematic and HDL entry support
  • Automatic place and route tools
  • Timing analysis and verification
  • In-system debugging capabilities

Configuration Options

The device supports multiple configuration modes for flexible system integration:

Configuration Mode Description
Master Serial FPGA controls PROM configuration
Slave Serial External controller drives configuration
Slave Parallel 8-bit parallel configuration interface
Boundary Scan (JTAG) IEEE 1149.1 compliant configuration

XC2S200-6FGG498C vs. Alternative Solutions

Advantages Over Mask-Programmed ASICs

The XC2S200-6FGG498C provides significant benefits compared to traditional ASIC solutions:

  • No NRE Costs – Eliminate expensive mask tooling
  • Rapid Development – Shorten time-to-market significantly
  • Field Upgradability – Update designs without hardware changes
  • Reduced Risk – Iterate designs without manufacturing delays
  • Unlimited Reprogrammability – Modify functionality as requirements evolve

Spartan-II Family Comparison

Device System Gates Logic Cells Block RAM Max I/O
XC2S15 15,000 432 16K 86
XC2S30 30,000 972 24K 92
XC2S50 50,000 1,728 32K 176
XC2S100 100,000 2,700 40K 176
XC2S150 150,000 3,888 48K 260
XC2S200 200,000 5,292 56K 284

XC2S200-6FGG498C Electrical Characteristics

Power Supply Requirements

Supply Voltage Description
VCCINT 2.5V Core logic power
VCCO 1.5V/2.5V/3.3V I/O bank power (standard dependent)

Operating Conditions

Parameter Commercial Range
Junction Temperature 0°C to +85°C
Storage Temperature -65°C to +150°C

Ordering the XC2S200-6FGG498C

Availability and Lead Times

The XC2S200-6FGG498C is available through authorized AMD/Xilinx distributors worldwide. When ordering, verify:

  • Current stock availability
  • Lead time estimates
  • Volume pricing options
  • Technical support access

Quality and Compliance

  • RoHS Compliant – Lead-free construction
  • Moisture Sensitivity Level – Check packaging requirements
  • Quality Certifications – ISO/automotive grade options available

Technical Support for XC2S200-6FGG498C

Documentation Resources

Comprehensive technical documentation includes:

  • Complete device datasheet (DS001)
  • Pinout tables and package drawings
  • Application notes and design guides
  • Reference designs and evaluation boards

Design Assistance

Engineers can access technical support through:

  • Online documentation portal
  • Technical forums and communities
  • Application engineering support
  • Training and certification programs

Conclusion

The AMD XC2S200-6FGG498C represents an excellent choice for engineers requiring a high-performance, cost-effective FPGA solution. With 200,000 system gates, extensive memory resources, and comprehensive I/O support in a lead-free BGA package, this Spartan-II device delivers the flexibility and reliability needed for modern digital design applications.

Whether developing telecommunications infrastructure, industrial control systems, or consumer electronics, the XC2S200-6FGG498C provides the performance and features to bring innovative designs to market quickly and efficiently.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.