Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

IPC-6903: Complete Glossary of Additive Circuitry & Flexible Hybrid Electronics Terms

Every industry has its own language, and printed electronics is no exception. When your supplier talks about “sintering” and you’re thinking “curing,” or when “functional ink” means something different to your design team than your materials vendor, miscommunication costs time and money. IPC-6903 solves this problem by establishing standardized terminology for the printed electronics industry.

After spending years translating between traditional PCB vocabulary and printed electronics terminology, I’ve learned to appreciate having a common reference point. This guide covers the essential terms defined in IPC-6903 and explains how this standard creates a shared language for everyone working in printed electronics.

What is IPC-6903?

IPC-6903, officially titled “Terms and Definitions for the Design and Manufacture of Printed Electronics (Additive Circuitry),” provides 62 standardized terms and definitions specific to printed electronics manufacturing. Published in October 2015 by the Printed Electronics Terms and Definitions Task Group (D-64a), IPC-6903 creates a common vocabulary for the worldwide printed electronics community.

Document AttributeIPC-6903 Details
Full TitleTerms and Definitions for the Design and Manufacture of Printed Electronics (Additive Circuitry)
Document NumberIPC-6903
Current RevisionIPC-6903A
Original ReleaseOctober 2015
Developed ByD-64a Printed Electronics Terms and Definitions Task Group
Number of Terms62 terms and definitions
Primary PurposeCommon language for PE community

The standard specifically addresses terminology for additive circuitry—processes where conductive materials are deposited onto substrates rather than etched away from copper-clad laminates. This fundamental difference from traditional subtractive PCB manufacturing requires its own vocabulary.

IPC-6903 vs IPC-T-50: Understanding the Difference

Engineers familiar with traditional electronics manufacturing know IPC-T-50, the comprehensive terminology document covering interconnecting and packaging electronic circuits. Understanding how IPC-6903 relates to IPC-T-50 helps clarify when each standard applies.

AspectIPC-T-50IPC-6903
ScopeGeneral electronics industryPrinted electronics specific
Number of TermsThousands62
Manufacturing FocusSubtractive (etching) processesAdditive (printing) processes
Materials CoveredTraditional PCB materialsFunctional inks, novel substrates
Process CoverageConventional PCB/assemblyPrinting, sintering, R2R
Target UsersAll electronics professionalsPrinted electronics specialists

Why Printed Electronics Needs Separate Terminology

Traditional PCB terminology often doesn’t translate directly to printed electronics. Consider these examples:

“Conductor” in traditional PCB: Typically means etched copper trace with well-defined properties.

“Conductor” in printed electronics: Could be silver nanoparticle ink, carbon paste, copper nanowire film, or conductive polymer—each with vastly different properties and processing requirements.

IPC-6903 addresses this gap by defining terms that capture the unique characteristics of additive manufacturing processes and materials.

Key Term Categories in IPC-6903

IPC-6903 organizes printed electronics terminology into several functional categories that reflect the printed electronics value chain.

Manufacturing Process Terms

These terms describe how printed electronics are made, covering everything from initial printing through final processing.

TermDefinition Summary
Additive CircuitryCircuits created by depositing material onto substrate
Front-End AssemblyPrinting and deposition processes
Back-End AssemblyComponent attachment and integration
Post-ProcessingTreatment after printing (sintering, curing)
Roll-to-Roll (R2R)Continuous processing using web-fed substrates

Materials and Components Terms

These terms define the materials used in printed electronics, from substrates to functional inks.

TermDefinition Summary
Functional InkInk formulated for electrical/electronic function
Functional MaterialMaterial providing specific electronic property
Conductive InkInk providing electrical conductivity
Dielectric InkInk providing electrical insulation
SubstrateBase material receiving printed deposits

Assembly and Product Terms

These terms describe integrated printed electronics assemblies and finished products.

TermDefinition Summary
Flexible Hybrid Electronics (FHE)Combination of printed and conventional components
Printed Electronics AssemblyAssembled PE product with components
Stretchable ElectronicsCircuits accommodating mechanical stretching
Wearable ElectronicsElectronics designed for body-worn use
In-Mold Electronics (IME)PE integrated into molded plastic parts

Essential Printed Electronics Terms Defined

The following terms represent the core vocabulary every printed electronics engineer should know. These definitions align with IPC-6903 while providing practical context for daily use.

Additive Circuitry

Circuitry created by depositing conductive and functional materials onto a substrate, as opposed to subtractive processes that remove material from metal-clad laminates. Additive circuitry encompasses screen printing, inkjet printing, aerosol jet, gravure, flexographic, and other deposition methods.

Practical significance: Understanding this fundamental distinction helps engineers recognize why printed electronics requires different design rules, materials specifications, and process controls than traditional PCB manufacturing.

Flexible Hybrid Electronics (FHE)

Electronic systems combining printed electronics elements with conventional electronic components on flexible substrates. FHE leverages the advantages of both technologies—the form factor and manufacturing benefits of printed electronics with the performance of conventional silicon-based components.

Practical significance: Most commercial printed electronics products are actually FHE, combining printed sensors, antennas, or interconnects with conventional ICs for signal processing.

Sintering

The process of fusing printed conductive particles into a continuous conductive film through application of energy. IPC-6903 recognizes multiple sintering methods, each with different characteristics.

Sintering TypeEnergy SourceTypical Applications
Thermal SinteringConventional heatingGeneral purpose, batch
Photonic SinteringIntense pulsed lightHeat-sensitive substrates
Laser SinteringFocused laser beamSelective area processing
Microwave SinteringMicrowave radiationVolumetric heating
Chemical SinteringChemical reactionRoom temperature processing

Practical significance: Sintering method selection directly impacts substrate compatibility, processing speed, and final conductor properties.

Functional Ink

An ink formulated to provide a specific electrical, electronic, or other functional property when deposited and processed. Functional inks differ from conventional printing inks in that their purpose is electronic function rather than visual appearance.

Categories of functional inks:

  • Conductive inks (silver, copper, carbon)
  • Dielectric inks (insulating layers)
  • Semiconducting inks (active devices)
  • Resistive inks (printed resistors)
  • Sensing inks (chemical, biological detection)

Stretchable Electronics

Electronic circuits designed and manufactured to accommodate mechanical stretching while maintaining electrical functionality. Stretchable electronics enable applications where conventional rigid or even flexible circuits would fail, such as electronic skin and conformable sensors.

Key design approaches:

  • Serpentine conductor patterns
  • Stretchable substrate materials
  • Island-bridge architectures
  • Intrinsically stretchable materials

Wearable Electronics

Electronic devices designed for extended wear on the human body, typically incorporating flexible or stretchable substrates to conform to body contours and accommodate movement.

Practical significance: Wearable electronics impose unique requirements including skin compatibility, washability, comfort, and reliability under repeated deformation.

Front-End Assembly

The processes involved in creating the printed circuit pattern on the substrate, including printing, drying, and curing or sintering of deposited materials. Front-end assembly creates the functional circuitry before component attachment.

Back-End Assembly

The processes involved in attaching components to printed circuits and completing the electronic assembly. Back-end assembly for printed electronics may include conventional pick-and-place, conductive adhesive bonding, or other attachment methods compatible with printed substrates.

Post-Processing

Treatment applied to printed deposits after initial printing to achieve final material properties. Post-processing may include sintering, curing, annealing, or other treatments required to develop electrical functionality or mechanical properties.

Roll-to-Roll Processing

Continuous manufacturing process using flexible substrate supplied from a roll, processed through printing and other operations, and collected on another roll. Roll-to-roll processing enables high-volume, low-cost printed electronics manufacturing.

R2R AdvantageDescription
ThroughputContinuous vs. batch processing
CostLower per-unit manufacturing cost
ScalabilityEasier transition to high volume
IntegrationMultiple process steps in line

Process-Related Terminology

IPC-6903 defines numerous terms related to printed electronics manufacturing processes.

Printing Process Terms

TermDescription
Screen PrintingStencil-based deposition through mesh screen
Inkjet PrintingDrop-on-demand digital deposition
Aerosol JetFocused aerosol stream deposition
Gravure PrintingEngraved cylinder-based deposition
Flexographic PrintingRelief plate-based rotary printing
Slot-Die CoatingContinuous coating from precision slot

Curing and Processing Terms

TermDescription
Thermal CuringHeat-induced polymerization or sintering
UV CuringUltraviolet light-induced curing
IR DryingInfrared-based solvent removal
Flash SinteringRapid photonic energy sintering
Plasma TreatmentSurface modification using plasma

Materials Terminology

IPC-6903 provides terminology for the diverse materials used in printed electronics.

Conductive Materials Terms

TermDescription
Nanoparticle InkInk containing nanoscale conductive particles
Flake InkInk containing microscale flake particles
Nanowire InkInk containing one-dimensional nanostructures
Reactive InkInk forming conductors through chemical reaction
Conductive PolymerOrganic polymer with electrical conductivity

Substrate Terms

TermDescription
Flexible SubstrateSubstrate capable of bending without damage
Rigid SubstrateNon-flexible substrate material
Stretchable SubstrateSubstrate accommodating elastic deformation
Coated SubstrateSubstrate with surface treatment or coating

How IPC-6903 Supports Other Printed Electronics Standards

IPC-6903 serves as the terminology foundation for the entire printed electronics standards ecosystem. Understanding how terms defined in IPC-6903 appear throughout other standards helps engineers navigate the complete framework.

Terminology Usage Across PE Standards

StandardHow IPC-6903 Terms Apply
IPC-2291Design guidelines use standardized terminology
IPC-2292Flexible substrate design terms defined
IPC-4591Conductive materials terminology aligned
IPC-4921Substrate terminology consistent
IPC-6901Application category terms defined
IPC-6902Qualification terms standardized

When IPC-2292 references “front-end assembly” or IPC-4591 discusses “functional inks,” these terms carry the precise meanings established in IPC-6903. This consistency eliminates ambiguity across the standards ecosystem.

Using IPC-6903 Terminology in Practice

Standardized terminology provides practical benefits throughout the printed electronics product lifecycle.

Procurement Documentation

Using IPC-6903 terms in procurement documents ensures suppliers understand exactly what you need.

Before standardization: “We need conductive ink that can be baked onto plastic film.”

With IPC-6903 terminology: “We require a silver nanoparticle conductive ink compatible with thermal sintering at temperatures below the glass transition of PEN substrate per IPC-4921.”

Supplier Communication

Common vocabulary reduces miscommunication between buyers and suppliers across different regions and technical backgrounds.

Communication AreaBenefit of Standardized Terms
Material specificationsPrecise property requirements
Process requirementsClear processing expectations
Quality criteriaConsistent acceptance standards
Technical discussionsReduced translation errors

Design Specifications

Using standardized terminology in design documentation ensures manufacturing teams understand design intent and requirements.

Quality Documentation

IPC-6903 terminology enables clear, consistent quality documentation that supports audits, certifications, and continuous improvement programs.

IPC-6903 and Global Printed Electronics Development

As printed electronics manufacturing spans multiple continents and cultures, standardized terminology becomes increasingly critical. IPC-6903 provides the common language that enables global collaboration.

Benefits for International Teams

ChallengeHow IPC-6903 Helps
Language barriersEnglish definitions provide reference
Technical translationStandardized terms reduce errors
Supplier qualificationCommon requirements language
Documentation consistencyAligned vocabulary across regions

The standard’s development involved input from both IPC and JPCA (Japan Electronics Packaging and Circuits Association), ensuring terminology works across major electronics manufacturing regions.

Useful Resources for IPC-6903 Implementation

Official IPC Resources

ResourceURLDescription
IPC-6903A Standardhttps://shop.ipc.org/ipc-6903Official standard purchase
IPC-T-50N Standardhttps://shop.ipc.org/ipc-t-50General electronics terminology
IPC Standards Treehttps://www.ipc.orgStandards relationship overview

Related Printed Electronics Standards

StandardTitleRelationship
IPC-2291Design Guideline for Printed ElectronicsUses IPC-6903 terminology
IPC-2292Design Standard for PE on Flexible SubstratesUses IPC-6903 terminology
IPC-4591Requirements for Functional Conductive MaterialsMaterials terminology aligned
IPC-4921Requirements for PE Base MaterialsSubstrate terminology aligned
IPC-6901Application Categories for Printed ElectronicsCategory terminology defined

Industry Organizations

OrganizationURLFocus
NextFlexhttps://www.nextflex.usUS FHE manufacturing institute
OE-Ahttps://www.oe-a.orgEuropean organic/printed electronics
SEMI FlexTechhttps://www.semi.org/en/communities/flextechFHE standards development
JPCAhttps://www.jpca.orgJapanese circuits association

Frequently Asked Questions About IPC-6903

What is the difference between IPC-6903 and IPC-T-50?

IPC-T-50 provides general terminology for the entire electronics industry, covering thousands of terms related to traditional PCB manufacturing and assembly. IPC-6903 specifically addresses the 62 additional terms needed for printed electronics that aren’t adequately covered by IPC-T-50. Think of IPC-6903 as a supplement to IPC-T-50 that fills the terminology gap created by additive manufacturing processes, functional inks, and flexible hybrid electronics. You need both standards for complete terminology coverage when working with printed electronics.

How often is IPC-6903 updated?

IPC-6903 follows IPC’s standard revision process, with updates driven by industry needs and technology evolution. The current revision is IPC-6903A, which added additional terms beyond the original 2015 release. As printed electronics technology continues developing rapidly, expect ongoing revisions to capture new terminology. IPC encourages industry participation in the revision process through the D-64a task group.

Is IPC-6903 required for printed electronics manufacturing?

IPC-6903 is a voluntary consensus standard, not a regulatory requirement. However, using standardized terminology provides significant practical benefits in supplier communication, documentation clarity, and quality management. Many organizations reference IPC-6903 in their quality systems and supplier requirements to ensure consistent terminology usage. While not legally required, adoption simplifies communication throughout the supply chain.

Does IPC-6903 define test methods or acceptance criteria?

No, IPC-6903 is strictly a terminology standard. It defines what terms mean but does not specify test methods, acceptance criteria, or performance requirements. For test methods, reference IPC-TM-650 and related test method documents. For performance requirements, reference IPC-6901 (application categories) and IPC-6902 (qualification specifications). IPC-6903 ensures everyone uses the same vocabulary when discussing these requirements.

How does IPC-6903 handle emerging technologies?

IPC-6903 includes provisions for terminology updates as new technologies emerge. The standard is maintained by an active task group that monitors industry developments and proposes new terms as needed. For technologies not yet covered, the standard provides a framework for consistent terminology that organizations can extend for internal use until official updates are published. Industry participants are encouraged to submit new terminology suggestions to IPC for consideration in future revisions.

Implementing IPC-6903 in Your Organization

Successful implementation of standardized terminology requires organizational commitment beyond simply purchasing the standard.

Implementation Steps

Step 1: Acquire the Standard Purchase IPC-6903A from IPC to ensure access to complete, current definitions.

Step 2: Train Key Personnel Ensure engineers, quality staff, and procurement teams understand key terminology.

Step 3: Update Documentation Revise specifications, procedures, and templates to use standardized terms.

Step 4: Communicate with Suppliers Inform suppliers of your terminology expectations and provide references.

Step 5: Monitor Consistency Review documentation periodically to ensure consistent terminology usage.

Common Implementation Challenges

ChallengeSolution
Legacy documentationPhased update during normal revision cycles
Supplier alignmentInclude terminology requirements in contracts
Internal resistanceDemonstrate communication benefits
Term conflictsReference IPC-6903 as authoritative source

Conclusion

IPC-6903 provides the essential vocabulary foundation for the printed electronics industry. By establishing standardized terminology for additive circuitry, flexible hybrid electronics, and related technologies, the standard enables clear communication between designers, manufacturers, suppliers, and customers worldwide.

For engineers working in printed electronics, familiarity with IPC-6903 terminology is fundamental to effective collaboration. Whether you’re specifying materials, documenting processes, or communicating with suppliers, using standardized vocabulary eliminates ambiguity and reduces errors.

Combined with other printed electronics standards like IPC-2291 for design, IPC-4591 for conductive materials, IPC-4921 for substrates, and IPC-6901 for application categories, IPC-6903 completes the framework needed for successful printed electronics development. Start speaking the same language as the rest of the industry by incorporating IPC-6903 terminology into your printed electronics work.

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Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.