The AMD XC2S200-6FGG496C is a high-performance Field-Programmable Gate Array (FPGA) from the renowned Spartan-II family, offering exceptional value for digital design applications. This 200,000-system-gate FPGA delivers powerful programmable logic capabilities in a compact 456-pin Fine-pitch Ball Grid Array (FBGA) package, making it an ideal choice for embedded systems, telecommunications, industrial automation, and consumer electronics.

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Key Features of AMD XC2S200-6FGG496C FPGA

The XC2S200-6FGG496C combines industry-leading programmable logic technology with robust on-chip memory resources. Designed using advanced 0.18μm six-layer metal process technology, this device operates at a core voltage of 2.5V while supporting multiple I/O voltage standards for seamless system integration.

High-Capacity Logic Resources

The XC2S200-6FGG496C offers substantial logic capacity for implementing complex digital designs:

• 5,292 Logic Cells for flexible design implementation
• 200,000 System Gates combining logic and RAM resources
• 1,176 Configurable Logic Blocks (CLBs) arranged in a 28×42 array
• 75,264 bits of Distributed RAM for high-speed local storage
• Four 4-input Look-Up Tables (LUTs) per CLB

Dedicated Block RAM Memory

One standout feature of the XC2S200-6FGG496C is its generous on-chip block RAM configuration:

• 56 Kilobits (56K) Total Block RAM
• 14 Dual-Port Block RAM modules organized in two columns
• Fully synchronous dual-ported architecture with independent control signals
• Configurable port widths: 1, 2, 4, 8, or 16 bits
• Flexible depth options: 4096×1 to 256×16 aspect ratios

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XC2S200-6FGG496C Technical Specifications

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Advanced Clock Management with DLL Technology

The XC2S200-6FGG496C features four on-chip Delay-Locked Loops (DLLs), one positioned at each corner of the die. These DLLs provide essential clock management capabilities:

DLL Key Benefits

• Clock Deskew: Eliminates clock distribution delays for precise timing
• Frequency Synthesis: Generate clocks at 1.5×, 2×, 2.5×, 3×, 4×, 5×, or 8× input frequency
• Clock Mirroring: Enables board-level clock synchronization across multiple FPGAs
• Duty Cycle Correction: Maintains optimal clock signal integrity
• Low Jitter Performance: Ensures reliable high-speed operation

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Flexible I/O Architecture

Comprehensive I/O Standard Support

The XC2S200-6FGG496C’s Input/Output Blocks (IOBs) provide versatile connectivity options:

• 284 Maximum User I/O pins (plus 4 global clock inputs)
• LVTTL and LVCMOS compatibility at multiple voltage levels
• GTL and GTL+ support for processor bus interfaces
• SSTL3 (Class I and II) for high-performance memory interfaces
• HSTL (Class I, III, and IV) for advanced bus standards
• PCI compliant at 3.3V for standard bus connectivity

I/O Bank Configuration

The device organizes I/O pins into independently configurable banks, allowing designers to implement multiple I/O standards within a single design. This flexibility simplifies interfacing with diverse system components operating at different voltage levels.

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Spartan-II FPGA Architecture Overview

Configurable Logic Block Structure

Each CLB in the XC2S200-6FGG496C contains four Logic Cells (LCs), where each LC includes:

• 4-input function generator (LUT)
• Programmable storage element (flip-flop or latch)
• Dedicated carry logic for arithmetic operations
• Direct feedthrough paths for additional routing flexibility

Programmable Routing Matrix

The Spartan-II architecture employs a sophisticated routing hierarchy optimized for both speed and utilization:

• Local Routing: Fast connections within CLBs and to adjacent blocks
• General Routing Matrix (GRM): Provides flexible interconnects
• VersaRing Routing: Additional routing between CLB array and IOBs for pin-locking
• 96 Buffered Hex Lines: Route signals across six CLB rows/columns
• Long Lines: Span the entire chip for low-skew distribution

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Configuration Options for XC2S200-6FGG496C

The XC2S200-6FGG496C supports multiple configuration modes for design flexibility:

Available Configuration Modes

Configuration Memory Requirements

The XC2S200-6FGG496C requires 1,335,840 bits of configuration data, which can be stored in compatible PROMs or loaded from external sources including flash memory, microcontrollers, or host systems.

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Typical Applications for AMD XC2S200-6FGG496C

The XC2S200-6FGG496C FPGA excels in various applications requiring high-density programmable logic:

Industrial and Commercial Applications

• Digital Signal Processing (DSP) implementations
• Communication interfaces and protocol bridges
• Video and image processing pipelines
• Industrial control systems and PLCs
• Test and measurement equipment
• Medical instrumentation

Embedded System Integration

• ASIC prototyping and verification
• Glue logic replacement for complex systems
• Co-processor implementations alongside microcontrollers
• Custom peripheral development

For more Xilinx FPGA products and related components, explore our comprehensive catalog of programmable logic devices.

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Advantages Over Mask-Programmed ASICs

The XC2S200-6FGG496C offers significant benefits compared to traditional ASIC solutions:

Cost and Time Efficiency

• Zero NRE (Non-Recurring Engineering) costs
• Rapid prototyping with immediate availability
• Shorter time-to-market without mask fabrication delays
• Lower minimum order quantities for small to medium volumes

Design Flexibility

• In-system reprogrammability allows field updates
• Design iteration without hardware replacement
• Risk mitigation through verified designs before production
• Future-proof architecture supporting design modifications

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Package Information: FGG456 Pb-Free FBGA

The XC2S200-6FGG496C utilizes a 456-pin Fine-pitch Ball Grid Array package with Pb-free (lead-free) RoHS-compliant solder balls:

Package Specifications

• Package Code: FGG456
• Body Size: 23mm × 23mm
• Ball Pitch: 1.0mm
• Ball Count: 456
• Mounting Type: Surface mount (SMT)
• RoHS Status: Compliant (Pb-Free)

Thermal Considerations

Proper thermal management ensures reliable operation. The FGG456 package provides efficient heat dissipation through its ball grid array structure when properly mounted with adequate PCB copper area for thermal spreading.

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Development Tools and Software Support

ISE Design Suite Compatibility

The XC2S200-6FGG496C is fully supported by the Xilinx ISE Design Suite, offering:

• Schematic capture and HDL entry (VHDL/Verilog)
• Synthesis and implementation tools
• Timing analysis and verification
• JTAG programming and debugging capabilities
• IP core libraries for rapid development

Configuration Solutions

Designers can utilize various configuration methods including platform flash PROMs, serial configuration memories, and processor-based configuration for maximum flexibility.

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Ordering Information and Part Number Breakdown

XC2S200-6FGG496C part number decoding:

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Conclusion

The AMD XC2S200-6FGG496C Spartan-II FPGA represents an excellent choice for designers requiring substantial logic capacity, integrated block RAM, and flexible I/O capabilities in a cost-effective package. With 200,000 system gates, 56K of block RAM, and support for multiple I/O standards, this device delivers the performance and versatility needed for demanding embedded applications.

Its -6 speed grade ensures optimal performance for timing-critical designs, while the Pb-free FGG456 package meets modern environmental compliance requirements. Whether used for ASIC replacement, digital signal processing, or complex system integration, the XC2S200-6FGG496C provides a reliable and flexible programmable logic platform.