The AMD XC2S200-6FGG490C is a high-performance Field Programmable Gate Array (FPGA) from the renowned Spartan-II family, offering exceptional value for cost-sensitive, high-volume electronic applications. This powerful programmable logic device delivers 200,000 system gates, making it an ideal ASIC replacement solution for engineers and designers seeking flexibility without compromising performance.

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XC2S200-6FGG490C Overview and Key Features

The XC2S200-6FGG490C represents AMD’s commitment to delivering powerful programmable logic solutions. As a member of the Xilinx FPGA family portfolio (now under AMD), this device combines abundant logic resources with advanced architectural features that support system clock rates up to 200 MHz.

Core Specifications at a Glance

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XC2S200-6FGG490C Architecture and Design

Configurable Logic Block (CLB) Structure

The XC2S200-6FGG490C features an advanced CLB architecture organized in a 28 x 42 array, providing 1,176 total CLBs. Each CLB contains four logic cells (LCs) organized into two identical slices. Key CLB features include:

• 4-input Look-Up Tables (LUTs): Function generators implemented as LUTs support any Boolean function of four inputs
• Dedicated Carry Logic: Enables high-speed arithmetic operations and efficient multiplier implementations
• Storage Elements: Edge-triggered D-type flip-flops or level-sensitive latches with independent clock enable signals
• Cascade Chain: Supports wide-input function implementation

Input/Output Block (IOB) Capabilities

The XC2S200-6FGG490C IOBs provide versatile interfacing options supporting 16 high-performance I/O standards:

• LVTTL (2-24 mA drive strength)
• LVCMOS2
• PCI (3V/5V, 33 MHz/66 MHz compliant)
• GTL and GTL+
• HSTL Class I, III, and IV
• SSTL2 and SSTL3 Class I and II
• CTT
• AGP-2X

Each IOB includes three registers for input, output, and 3-state control, enabling efficient synchronous I/O operations.

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XC2S200-6FGG490C Memory Resources

Block RAM Configuration

The XC2S200-6FGG490C incorporates 14 dedicated block RAM modules, providing 56K bits of total block RAM capacity. Each 4,096-bit block RAM features:

• Fully synchronous dual-port operation
• Independent control signals for each port
• Configurable aspect ratios (4096×1, 2048×2, 1024×4, 512×8, 256×16)
• Built-in bus-width conversion capabilities

Distributed RAM Implementation

With 75,264 bits of distributed RAM, the XC2S200-6FGG490C offers flexible memory options directly within the CLB fabric. Distributed RAM configurations include:

• 16 x 1-bit synchronous RAM per LUT
• 16 x 2-bit or 32 x 1-bit synchronous RAM (dual-LUT configuration)
• 16 x 1-bit dual-port synchronous RAM
• 16-bit shift register mode for DSP applications

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Clock Management and Delay-Locked Loop (DLL)

Four Dedicated DLL Units

The XC2S200-6FGG490C includes four fully digital Delay-Locked Loops (DLLs) positioned at each corner of the die. These DLLs provide:

• Zero Clock Propagation Delay: Eliminates internal clock distribution delays
• Low Clock Skew: Ensures synchronized clock edges across all flip-flops
• Clock Multiplication: 2X clock frequency doubling capability
• Clock Division: Divide-by factors of 1.5, 2, 2.5, 3, 4, 5, 8, or 16
• Quadrature Phase Generation: 0°, 90°, 180°, and 270° phase outputs
• Clock Mirroring: Board-level clock deskewing for multi-FPGA systems

Global Clock Distribution Network

Four dedicated primary global clock networks provide:

• Low-skew clock distribution to all CLB, IOB, and block RAM clock pins
• Dedicated global clock input pins (GCLK0-GCLK3)
• Secondary backbone routing with 24 lines for additional clock flexibility

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XC2S200-6FGG490C Configuration Options

Supported Configuration Modes

The XC2S200-6FGG490C supports multiple configuration interfaces for maximum design flexibility:

Configuration File Size

The XC2S200-6FGG490C requires 1,335,840 bits (approximately 167 KB) of configuration data, enabling storage in cost-effective serial PROMs or system memory.

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XC2S200-6FGG490C Performance Characteristics

Speed Grade -6 Advantages

The -6 speed grade designation indicates the higher performance tier of the Spartan-II family, offering:

• Enhanced timing margins for demanding applications
• Optimized path delays for critical signal routing
• Support for system clock frequencies up to 263 MHz
• Commercial temperature range operation (0°C to +85°C)

Switching Characteristics

The XC2S200-6FGG490C delivers predictable timing performance with:

• Fast carry logic propagation for arithmetic circuits
• Optimized IOB switching for high-speed interfaces
• Consistent CLB switching characteristics across temperature range

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Application Areas for XC2S200-6FGG490C

Industrial and Commercial Applications

The XC2S200-6FGG490C excels in numerous application domains:

• Digital Signal Processing (DSP): Efficient multiplier support and cascade chains
• Communications Systems: PCI compliance and multiple I/O standard support
• Industrial Control: Abundant logic resources for complex state machines
• Consumer Electronics: Cost-effective high-volume production solution
• Prototyping: Unlimited reprogramming capability for rapid development
• ASIC Replacement: Eliminates NRE costs and reduces development cycles

Design Tool Support

The XC2S200-6FGG490C is fully supported by AMD ISE Design Suite, providing:

• Automatic mapping, placement, and routing
• Timing-driven optimization
• Over 400 library primitives and macros
• EDIF netlist compatibility
• In-circuit debugging capabilities

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XC2S200-6FGG490C Package Information

456-Pin Fine Pitch BGA (FBGA) Details

The FBGA package offers:

• Compact Form Factor: Space-efficient ball grid array design
• Reliable Connections: Robust solder joint integrity
• Thermal Performance: Efficient heat dissipation characteristics
• Pb-Free Options: RoHS compliant variants available (FGG designation)

Pin Banking Structure

The XC2S200-6FGG490C organizes I/O pins into eight banks, enabling:

• Independent VCCO voltage per bank (1.5V, 2.5V, or 3.3V)
• Mixed I/O standard implementations
• Flexible VREF distribution for referenced input standards

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XC2S200-6FGG490C Ordering Information

Part Number Decoding

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Why Choose the XC2S200-6FGG490C FPGA

Cost-Effective ASIC Alternative

The XC2S200-6FGG490C eliminates the significant upfront investment associated with traditional ASICs:

• No Mask Charges: Zero NRE (Non-Recurring Engineering) costs
• Reduced Risk: Prototype and production use identical devices
• Field Upgradability: In-system reprogramming for design updates
• Faster Time-to-Market: Immediate production following design completion

Proven Reliability

Built on mature 0.18μm CMOS technology, the XC2S200-6FGG490C delivers:

• Established manufacturing processes
• Comprehensive qualification testing
• Long-term availability for legacy applications
• Extensive documentation and application notes

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Technical Documentation and Support Resources

For comprehensive XC2S200-6FGG490C design resources, engineers can access:

• Complete DS001 Spartan-II Family Data Sheet
• Application notes for configuration, readback, and DLL usage
• BSDL files for boundary scan testing
• ISE Design Suite user guides and tutorials

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Conclusion

The AMD XC2S200-6FGG490C Spartan-II FPGA delivers an exceptional combination of performance, flexibility, and value for high-volume programmable logic applications. With 200,000 system gates, 5,292 logic cells, comprehensive memory resources, and advanced clock management features, this FPGA provides engineers with a powerful platform for implementing complex digital designs while maintaining cost efficiency and design flexibility.

Whether developing industrial control systems, communication interfaces, DSP applications, or prototyping next-generation products, the XC2S200-6FGG490C offers the programmable logic resources and performance characteristics needed to succeed in today’s competitive electronics market