The AMD XC2S200-6FGG487C is a high-performance Field Programmable Gate Array (FPGA) from the renowned Spartan-II family. This versatile programmable logic device delivers exceptional value for engineers requiring robust digital design capabilities with cost-effective implementation. Whether you’re developing telecommunications equipment, industrial control systems, or consumer electronics, this FPGA provides the flexibility and performance your projects demand.
Key Features of the XC2S200-6FGG487C FPGA
The XC2S200-6FGG487C combines advanced architecture with practical design features that make it ideal for a wide range of applications. This device represents AMD’s commitment to delivering programmable solutions that eliminate the limitations of traditional ASICs.
High-Density Logic Resources
The XC2S200-6FGG487C offers impressive logic capacity with 200,000 system gates and 5,292 logic cells. The device architecture includes a 28 x 42 CLB array containing 1,176 Configurable Logic Blocks (CLBs). Each CLB contains four logic cells organized in two slices, providing the building blocks for implementing complex digital designs.
The 4-input Look-Up Tables (LUTs) serve as flexible function generators that can also operate as 16×1-bit synchronous RAM. This dual functionality allows designers to optimize resource utilization based on specific application requirements.
Advanced Memory Configuration
Memory resources in the XC2S200-6FGG487C include both distributed and block RAM options:
- 75,264 bits of distributed RAM integrated within the CLB structure
- 56K bits of dedicated block RAM organized in 14 memory blocks
- Configurable 4K bit block RAM supporting single-port and dual-port configurations
- Flexible aspect ratios from 4096×1 to 256×16 bit configurations
This hierarchical memory architecture enables efficient data storage and high-speed buffering essential for signal processing applications.
Speed Grade -6 Performance
The -6 speed grade designation indicates this device operates at the highest performance tier within the Spartan-II family. Engineers benefit from:
- System clock rates up to 200 MHz
- Maximum operating frequency of 263 MHz for internal operations
- Fast dedicated carry logic for high-speed arithmetic functions
- Low-skew global clock distribution through four dedicated DLL circuits
The -6 speed grade is exclusively available in the Commercial temperature range (0°C to +85°C), optimized for applications requiring maximum performance.
XC2S200-6FGG487C Package Specifications
FGG487 Fine-Pitch Ball Grid Array Package
The FGG487 package utilizes Fine-Pitch Ball Grid Array (FBGA) technology with the following characteristics:
| Parameter |
Specification |
| Package Type |
Fine-Pitch BGA (FBGA) |
| Total Pins |
487 |
| Ball Pitch |
1.0 mm |
| Package Dimensions |
23 x 23 mm |
| Maximum User I/O |
284 |
| Pb-Free Option |
Yes (indicated by “G” suffix) |
The “G” in FGG487 indicates this package complies with RoHS (Restriction of Hazardous Substances) requirements, featuring lead-free solder ball composition for environmentally conscious manufacturing.
I/O Capabilities and Interface Standards
The XC2S200-6FGG487C supports 16 high-performance I/O standards, making it compatible with virtually any system interface:
- LVTTL (2-24 mA drive strength)
- LVCMOS2
- PCI (3.3V/5V, 33 MHz/66 MHz compliant)
- GTL and GTL+
- HSTL Class I, III, and IV
- SSTL2 and SSTL3 Class I and II
- CTT
- AGP-2X
The flexible I/O banking architecture organizes pins into eight independent banks, allowing different voltage standards to coexist within a single design.
Technical Architecture of the Spartan-II XC2S200
Configurable Logic Block Structure
Each CLB in the XC2S200-6FGG487C contains sophisticated logic resources:
- Four Logic Cells (LCs) organized in two identical slices
- 4-input function generators implemented as LUTs
- Dedicated carry logic for arithmetic operations
- F5 and F6 multiplexers for implementing 5-input and 6-input functions
- Storage elements configurable as edge-triggered flip-flops or level-sensitive latches
- Two 3-state drivers (BUFTs) per CLB for on-chip bus implementation
Input/Output Block Features
The IOB architecture provides comprehensive interface flexibility:
- Three registers per IOB (input, output, and 3-state control)
- Programmable pull-up and pull-down resistors
- Optional weak-keeper circuits for maintaining bus states
- Programmable slew rate control for EMI reduction
- Hot-swap capability compatible with Compact PCI requirements
Clock Management with Delay-Locked Loops
Four dedicated Delay-Locked Loop (DLL) circuits provide advanced clock control:
- Zero propagation delay clock distribution
- Clock multiplication (2X) capability
- Clock division by factors of 1.5, 2, 2.5, 3, 4, 5, 8, or 16
- Four quadrature phase outputs (0°, 90°, 180°, 270°)
- Board-level clock deskewing through clock mirroring
Applications for the XC2S200-6FGG487C FPGA
Industrial Control Systems
The robust architecture makes this FPGA ideal for industrial automation, motor control, and process monitoring applications. The high I/O count supports complex sensor interfaces while the speed grade -6 performance handles real-time control algorithms.
Telecommunications Equipment
Network infrastructure equipment benefits from the XC2S200-6FGG487C’s packet processing capabilities, protocol conversion features, and high-speed serial interface support.
Consumer Electronics
Cost-sensitive consumer products leverage the value proposition of Spartan-II devices for implementing custom logic, display controllers, and audio/video processing functions.
Prototyping and Development
The infinite reprogrammability of this FPGA makes it perfect for rapid prototyping, allowing design iterations without hardware changes. Engineers can verify complex designs before committing to production.
Development Tools and Software Support
The XC2S200-6FGG487C is fully supported by Xilinx ISE Design Suite, providing:
- Automatic mapping, placement, and routing
- Timing-driven implementation
- Comprehensive simulation capabilities
- In-circuit debugging through configuration readback
- EDIF interface for third-party design tool integration
The unified library contains over 400 primitives and macros, accelerating development with pre-verified building blocks for common functions.
Configuration Options for the XC2S200-6FGG487C
Supported Configuration Modes
The device supports multiple configuration approaches:
- Master Serial Mode: FPGA controls configuration from external PROM
- Slave Serial Mode: External controller provides configuration data
- Slave Parallel Mode: Fastest configuration using byte-wide data
- Boundary-Scan Mode: Configuration through IEEE 1149.1 JTAG interface
Configuration File Size
The XC2S200 requires 1,335,840 bits of configuration data, which can be stored in compatible serial PROMs or loaded from system memory.
Ordering Information and Part Number Breakdown
Understanding the XC2S200-6FGG487C part number:
- XC2S200: Spartan-II device with 200K system gates
- -6: Speed grade (highest performance)
- FGG: Fine-pitch BGA, Pb-free (RoHS compliant)
- 487: Pin count
- C: Commercial temperature range (0°C to +85°C)
Why Choose the AMD XC2S200-6FGG487C?
Superior ASIC Alternative
This FPGA eliminates the initial NRE costs, lengthy development cycles, and risk associated with mask-programmed ASICs. Field upgradability allows design improvements without hardware replacement.
Cost-Effective Solution
The 0.18-micron CMOS process technology delivers high performance at competitive pricing, making Spartan-II devices ideal for volume production.
Proven Reliability
Based on the proven Virtex FPGA architecture with streamlined features optimized for cost-sensitive applications, the Spartan-II family has established a track record of reliable performance across diverse industries.
For comprehensive FPGA solutions including the XC2S200-6FGG487C and other programmable logic devices, explore our complete Xilinx FPGA product catalog.
Technical Specifications Summary
| Parameter |
Value |
| Device Family |
Spartan-II |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| CLB Array |
28 x 42 (1,176 CLBs) |
| Distributed RAM |
75,264 bits |
| Block RAM |
56K bits (14 blocks) |
| Maximum User I/O |
284 |
| DLLs |
4 |
| Speed Grade |
-6 (Highest Performance) |
| Package |
FGG487 (Fine-Pitch BGA) |
| Pin Count |
487 |
| Core Voltage |
2.5V |
| I/O Voltage |
1.5V, 2.5V, or 3.3V |
| Temperature Range |
Commercial (0°C to +85°C) |
| Process Technology |
0.18 µm CMOS |
| RoHS Compliance |
Yes |
Frequently Asked Questions
What is the difference between -5 and -6 speed grades?
The -6 speed grade offers higher performance than the -5 variant, supporting faster clock frequencies and reduced propagation delays. The -6 grade is exclusively available in the Commercial temperature range.
Is the XC2S200-6FGG487C compatible with 5V systems?
Yes, the I/O structure supports 5V tolerance when configured appropriately. The input buffers using LVTTL, LVCMOS2, and PCI standards are 5V tolerant.
What configuration PROM is recommended?
Xilinx XC18V series PROMs or compatible serial flash devices can store the 1.3 Mbit configuration file. Multiple FPGAs can be daisy-chained for configuration from a single PROM.
Can this FPGA be used for automotive applications?
While the Commercial grade operates from 0°C to +85°C, the -5 speed grade offers Industrial temperature range (-40°C to +100°C) options for demanding environments.
The AMD XC2S200-6FGG487C represents an excellent choice for engineers seeking a balance of performance, flexibility, and value in their FPGA designs. Its comprehensive feature set and proven architecture make it suitable for applications ranging from simple glue logic to complex digital signal processing systems.
