Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

AMD XC2S200-6FGG485C: High-Performance Spartan-II FPGA for Industrial Applications

Product Details

The AMD XC2S200-6FGG485C is a powerful field-programmable gate array (FPGA) from the renowned Spartan-II family, engineered to deliver exceptional performance and reliability for demanding industrial and commercial applications. This versatile programmable logic device combines advanced digital design capabilities with cost-effective implementation, making it the ideal choice for engineers seeking robust signal processing and embedded control solutions.

Key Features of AMD XC2S200-6FGG485C FPGA

The AMD XC2S200-6FGG485C offers an impressive array of features that make it suitable for a wide range of high-performance applications:

Logic Resources and System Gates

  • 200,000 System Gates: Provides substantial capacity for complex digital designs
  • 5,292 Logic Cells: Enables flexible implementation of custom logic functions
  • 1,176 Configurable Logic Blocks (CLBs): Arranged in a 28 x 42 array for maximum design flexibility
  • Four Logic Cells per CLB: Each containing a 4-input function generator, storage element, and carry logic

Memory Architecture

The XC2S200-6FGG485C features a hierarchical memory system optimized for performance:

  • 56K Bits of Block RAM: Organized as 14 dedicated RAM blocks for high-speed data storage
  • 75,264 Bits of Distributed RAM: Implemented using CLB look-up tables for shallow memory structures
  • Dual-Port Block RAM: Each 4,096-bit block supports independent read/write operations
  • Configurable Data Widths: Support for 1, 2, 4, 8, or 16-bit port configurations

Package and Pin Configuration

Specification Value
Package Type 485-Pin Fine-Pitch BGA (FBGA)
Maximum User I/O 284 pins
Global Clock Pins 4 dedicated + user I/O capable
Pb-Free Option Available (indicated by “G” in part number)

Technical Specifications for XC2S200-6FGG485C

Electrical Characteristics

The AMD XC2S200-6FGG485C operates with the following electrical parameters:

  • Core Voltage (VCCINT): 2.5V nominal
  • I/O Voltage (VCCO): Configurable per I/O bank
  • Process Technology: 0.18µm CMOS
  • Speed Grade: -6 (highest performance tier)
  • Operating Frequency: Up to 263MHz system clock

Supported I/O Standards

The Spartan-II architecture supports 16 different I/O signaling standards, including:

  • LVTTL and LVCMOS (3.3V, 2.5V)
  • GTL and GTL+
  • HSTL Class I, II, III, and IV
  • SSTL2 and SSTL3 (Class I and II)
  • PCI (33MHz and 66MHz)
  • AGP-2X

Clock Management Features

  • Four Delay-Locked Loops (DLLs): One at each corner of the die
  • Clock Deskewing: Eliminates clock distribution delay
  • Frequency Synthesis: 1.5x, 2x, and 4x multiplication
  • Phase Shifting: Fine-grained clock phase adjustment

Applications for AMD XC2S200-6FGG485C FPGA

The versatility of the XC2S200-6FGG485C makes it ideal for numerous applications:

Industrial Control Systems

  • Programmable logic controllers (PLC)
  • Motor drive control
  • Factory automation equipment
  • Process control instrumentation

Telecommunications Equipment

  • Channel interface cards
  • Protocol converters
  • Network switches and routers
  • Base station equipment

Digital Signal Processing

  • Audio and video processing
  • Image processing pipelines
  • Filter implementations
  • Data acquisition systems

Consumer Electronics

  • Set-top boxes
  • Gaming peripherals
  • Display controllers
  • Multimedia devices

Architecture Overview of Spartan-II XC2S200-6FGG485C

Configurable Logic Block Structure

Each CLB in the XC2S200-6FGG485C contains four Logic Cells (LCs) organized as two slices. The architecture provides:

  • Four 4-Input Look-Up Tables (LUTs): Implementing any 4-input Boolean function
  • Four Flip-Flops/Latches: Edge-triggered or level-sensitive storage
  • Fast Carry Logic: Dedicated carry chain for arithmetic operations
  • Direct Feedthrough Paths: Bypass routes for additional flexibility

Input/Output Block Features

The programmable IOBs support:

  • Three registers per IOB (input, output, and tri-state)
  • Individually programmable slew rate control
  • Optional weak pull-up/pull-down resistors
  • DDR support through register configuration
  • Boundary scan (JTAG) compliance

Block RAM Specifications

Parameter Specification
Total Blocks 14
Bits per Block 4,096
Total Capacity 56K bits
Port Configuration True dual-port
Synchronous Operation Fully synchronous reads/writes

Why Choose AMD XC2S200-6FGG485C for Your Design?

Superior Alternative to ASICs

The XC2S200-6FGG485C offers significant advantages over traditional ASIC implementations:

  • No NRE Costs: Eliminate expensive mask and tooling charges
  • Rapid Development: Reduce design cycles from months to weeks
  • Field Upgradability: Update functionality without hardware changes
  • Risk Mitigation: Make design corrections quickly and cost-effectively

Design Tool Ecosystem

Comprehensive development support includes:

  • ISE Design Suite: Complete synthesis, implementation, and verification
  • ChipScope Pro: Real-time on-chip debugging
  • IP Core Library: Pre-verified functional blocks
  • Reference Designs: Proven design templates for common applications

For more information about programmable logic solutions and FPGA products, explore our comprehensive Xilinx FPGA resource center.

Ordering Information for XC2S200-6FGG485C

Part Number Decode

XC2S200-6FGG485C follows the standard Xilinx naming convention:

  • XC2S: Spartan-II FPGA family
  • 200: 200,000 system gates
  • 6: Speed grade (-6 is fastest)
  • FGG: Fine-pitch BGA package, Pb-free
  • 485: Pin count
  • C: Commercial temperature range (0°C to +85°C)

Temperature Grade Options

Suffix Temperature Range Applications
C 0°C to +85°C Commercial/office equipment
I -40°C to +100°C Industrial/outdoor applications

Quality and Compliance

  • RoHS Compliant: Pb-free packaging available
  • MSL Rating: Moisture sensitivity level specified
  • Quality Tested: 100% production testing
  • Reliability Data: Available upon request

Configuration and Programming Options

The XC2S200-6FGG485C supports multiple configuration modes:

Configuration Mode Summary

Mode Data Width Clock Direction Description
Master Serial 1-bit Output Self-configuring from serial PROM
Slave Serial 1-bit Input Configuration from external controller
Slave Parallel 8-bit Input High-speed byte-wide configuration
Boundary Scan 1-bit N/A JTAG-based configuration

Configuration Data

  • Bitstream Size: 1,335,840 bits
  • Configuration PROMs: Compatible with XC18V series
  • Configuration Time: Dependent on clock frequency and mode

Design Considerations for XC2S200-6FGG485C

Power Supply Requirements

Proper power sequencing and decoupling are essential:

  • VCCINT (2.5V core) should power up before or simultaneously with VCCO
  • Multiple decoupling capacitors recommended per power pin
  • Separate analog and digital ground planes suggested

PCB Layout Guidelines

  • Minimum 4-layer PCB recommended
  • Controlled impedance traces for high-speed I/O
  • Adequate thermal relief for BGA package
  • Follow Xilinx PCB design guidelines for signal integrity

Thermal Management

  • Calculate power dissipation based on design utilization
  • Provide adequate airflow or heatsinking as needed
  • Monitor junction temperature during operation

Conclusion

The AMD XC2S200-6FGG485C Spartan-II FPGA represents an excellent balance of performance, features, and cost-effectiveness for programmable logic applications. With its generous gate count, flexible memory architecture, comprehensive I/O support, and proven reliability, this device is well-suited for telecommunications, industrial control, digital signal processing, and consumer electronics applications.

Whether you’re prototyping a new design or moving to production, the XC2S200-6FGG485C provides the programmable logic resources and development ecosystem needed to bring your product to market quickly and successfully.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.