Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC2S200-6FGG482C: High-Performance AMD Spartan-II FPGA for Industrial Applications

Product Details

The XC2S200-6FGG482C is a powerful field-programmable gate array from AMD’s proven Spartan-II FPGA family. This versatile programmable logic device delivers exceptional performance for digital design applications, offering engineers a cost-effective alternative to mask-programmed ASICs with superior flexibility and faster time-to-market.

XC2S200-6FGG482C Key Features and Benefits

The XC2S200-6FGG482C combines advanced programmable logic architecture with robust industrial-grade reliability. Engineers choose this Xilinx FPGA for its outstanding balance of performance, power efficiency, and design flexibility.

Core Logic Architecture

The XC2S200-6FGG482C features a sophisticated configurable logic block (CLB) architecture arranged in a 28×42 array, providing 1,176 CLBs for implementing complex digital designs. Each CLB contains four logic cells (LCs), delivering a total of 5,292 logic cells capable of implementing virtually any digital function.

System Gate Capacity

With 200,000 system gates, the XC2S200-6FGG482C provides ample logic resources for medium to large-scale digital designs. This gate density enables implementation of complex state machines, data path controllers, and multi-function digital systems within a single programmable device.

XC2S200-6FGG482C Technical Specifications

Parameter Specification
Device Family Spartan-II
System Gates 200,000
Logic Cells 5,292
CLB Array 28 × 42 (1,176 CLBs)
Maximum Frequency 263 MHz
Process Technology 0.18µm CMOS
Core Voltage 2.5V
Package Type Fine-pitch BGA (FBGA)
Pin Count 482 Pins
Speed Grade -6 (High Performance)
Temperature Range Commercial (0°C to +85°C)

Block RAM Memory Resources

The XC2S200-6FGG482C integrates 56 Kbits of dedicated block RAM organized in 14 synchronous dual-port memory blocks. Each block RAM provides 4,096 bits of fully synchronous storage with independent read and write ports, enabling efficient data buffering and FIFO implementation.

Block RAM Configuration Options

Configuration Depth × Width
4K × 1 Deep narrow memory
2K × 2 Balanced configuration
1K × 4 Standard width
512 × 8 Byte-wide storage
256 × 16 Wide data path

XC2S200-6FGG482C Clock Management

The XC2S200-6FGG482C incorporates four Delay Locked Loops (DLLs) for advanced clock management. These DLLs provide clock deskew, frequency synthesis, and phase shifting capabilities essential for high-speed synchronous designs.

DLL Capabilities

The integrated DLLs eliminate clock distribution delays and provide precise clock phase control. Engineers can implement clock multiplication (2×) and division (1.5×, 2×, 2.5×, 3×, 4×, 5×, 8×, 16×) for flexible system clocking architectures.

Input/Output Capabilities

Maximum User I/O

The XC2S200-6FGG482C provides up to 284 user-configurable I/O pins, supporting multiple I/O voltage standards for seamless interfacing with various logic families and peripherals.

Supported I/O Standards

Standard Description
LVTTL Low-voltage TTL (3.3V)
LVCMOS2 Low-voltage CMOS (2.5V)
PCI33_3 PCI 33MHz (3.3V)
PCI66_3 PCI 66MHz (3.3V)
GTL Gunning Transceiver Logic
GTL+ Enhanced GTL
HSTL I High-speed Transceiver Logic Class I
HSTL III High-speed Transceiver Logic Class III
HSTL IV High-speed Transceiver Logic Class IV
SSTL2 I Stub Series Terminated Logic (2.5V)
SSTL3 I Stub Series Terminated Logic (3.3V)

XC2S200-6FGG482C Configuration Modes

The XC2S200-6FGG482C supports multiple configuration modes for flexible system integration.

Available Configuration Options

Mode Data Width Clock Direction
Master Serial 1-bit Output
Slave Parallel 8-bit Input
Slave Serial 1-bit Input
Boundary Scan (JTAG) 1-bit N/A

The device stores approximately 1.34 Mbit of configuration data, enabling in-system reconfiguration for field-upgradable designs.

Speed Grade Performance

The “-6” speed grade designation indicates the XC2S200-6FGG482C operates at the highest performance tier within the Spartan-II family. This speed grade delivers faster propagation delays and higher maximum operating frequencies compared to -5 grade variants, making it ideal for timing-critical applications.

XC2S200-6FGG482C Application Areas

The XC2S200-6FGG482C excels in diverse industrial and commercial applications.

Industrial Control Systems

The robust architecture handles complex control algorithms, motion control, and real-time signal processing for industrial automation equipment.

Communications Equipment

High-speed I/O standards and substantial logic resources enable implementation of protocol converters, interface bridges, and data communication systems.

Consumer Electronics

Cost-effective programmability makes the XC2S200-6FGG482C suitable for video processing, display controllers, and multimedia applications.

Prototyping and Development

Engineers leverage the XC2S200-6FGG482C for ASIC prototyping and system validation, significantly reducing development risk and time.

Development Tool Support

The XC2S200-6FGG482C is supported by comprehensive development tools including ISE Design Suite for synthesis, implementation, and programming. Engineers can utilize VHDL and Verilog HDL for design entry, with integrated simulation and timing analysis capabilities.

Package Information

The FGG482 package utilizes fine-pitch ball grid array technology with 1.0mm ball pitch. This compact packaging enables high pin density while maintaining excellent thermal and electrical performance characteristics for demanding applications.

Package Dimensions

Parameter Value
Ball Pitch 1.0 mm
Package Style Fine-pitch BGA
Total Balls 482
RoHS Compliance Pb-free option available

Ordering Information

The XC2S200-6FGG482C part number decoding:

  • XC2S200: Spartan-II 200K gate device
  • -6: High-performance speed grade
  • FGG: Fine-pitch BGA package (Pb-free)
  • 482: 482-pin package
  • C: Commercial temperature range (0°C to +85°C)

Why Choose XC2S200-6FGG482C

The XC2S200-6FGG482C provides significant advantages over traditional ASIC solutions. In-system programmability eliminates lengthy ASIC development cycles and enables field upgrades without hardware replacement. The proven Spartan-II architecture ensures reliable operation across commercial temperature ranges while maintaining competitive pricing for volume production.

Summary

The XC2S200-6FGG482C delivers 200,000 system gates, 5,292 logic cells, and 56Kbit block RAM in a compact 482-pin BGA package. With maximum operating frequency of 263MHz, four integrated DLLs, and comprehensive I/O standard support, this AMD Spartan-II FPGA provides the performance and flexibility required for demanding digital design applications.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.