Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC2S200-6FGG480C: Xilinx Spartan-II FPGA Complete Specifications and Features

Product Details

The XC2S200-6FGG480C is a high-performance Xilinx Spartan-II FPGA featuring 200,000 system gates, 5,292 logic cells, and a 480-pin fine-pitch BGA package. This field-programmable gate array delivers exceptional cost-effective programmable logic solutions for telecommunications, industrial automation, and embedded systems applications.

XC2S200-6FGG480C Key Features and Benefits

The XC2S200-6FGG480C belongs to the renowned Spartan-II FPGA family, manufactured using advanced 0.18μm process technology. Engineers choose this device for its optimal balance between performance, power consumption, and cost-effectiveness in volume production environments.

High Logic Density Architecture

This Xilinx FPGA implements a sophisticated architecture consisting of Configurable Logic Blocks (CLBs), Input/Output Blocks (IOBs), and dedicated Block RAM. The 28 × 42 CLB array provides 1,176 total CLBs, enabling complex digital designs without external logic components.

Four Integrated Delay-Locked Loops

The XC2S200-6FGG480C incorporates four Delay-Locked Loops (DLLs) positioned at each corner of the die. These DLLs deliver precise clock management, clock multiplication, division, and phase shifting capabilities essential for high-speed synchronous designs.

XC2S200-6FGG480C Technical Specifications

Core Device Parameters

Parameter Specification
Part Number XC2S200-6FGG480C
Device Family Spartan-II
System Gates 200,000
Logic Cells 5,292
CLB Array 28 × 42
Total CLBs 1,176
Maximum User I/O 284
Speed Grade -6 (Fastest Commercial)
Package Type FGG480 (Fine Pitch BGA, Pb-Free)
Pin Count 480

Memory Resources

Memory Type Capacity
Distributed RAM 75,264 bits
Block RAM 56 Kbits
Total On-Chip Memory 131,264 bits

Electrical Characteristics

Parameter Value
Core Voltage (VCCINT) 2.5V ± 5%
I/O Voltage (VCCO) 1.5V to 3.3V
Operating Frequency Up to 263 MHz
Process Technology 0.18 μm
Temperature Range Commercial (0°C to +85°C)

XC2S200-6FGG480C Package Information

FGG480 Fine Pitch BGA Package Details

The FGG480 package designation indicates a Fine-pitch Ball Grid Array with 480 solder balls arranged in a grid pattern. The “G” suffix confirms RoHS-compliant lead-free (Pb-free) ball composition, meeting modern environmental standards.

Package Physical Dimensions

Attribute Specification
Package Style Fine Pitch BGA
Ball Count 480
Ball Pitch 1.0 mm
RoHS Compliance Yes (Pb-Free)
Moisture Sensitivity Level MSL-3

Part Number Decoder

Understanding the XC2S200-6FGG480C nomenclature:

  • XC2S200: Xilinx Spartan-II device with 200K system gates
  • -6: Speed grade 6 (fastest commercial grade)
  • FG: Fine-pitch Ball Grid Array
  • G: Lead-free (Pb-free) packaging
  • 480: Total ball count
  • C: Commercial temperature range (0°C to +85°C)

XC2S200-6FGG480C Architecture Overview

Configurable Logic Blocks

Each CLB contains four logic cells (LC), with every logic cell featuring a 4-input function generator (LUT), carry logic, and storage elements. The CLBs connect through a hierarchical routing architecture, enabling efficient signal propagation across the device.

Input/Output Block Capabilities

The IOBs support multiple I/O standards, providing flexibility for interfacing with various external components:

  • LVTTL and LVCMOS (3.3V, 2.5V, 1.8V, 1.5V)
  • PCI compliant outputs
  • GTL and GTL+ inputs
  • SSTL2 and SSTL3
  • HSTL Class I, II, III, and IV
  • CTT

Block RAM Organization

The XC2S200-6FGG480C includes dual-port Block RAM organized in columns on opposite sides of the CLB array. Each Block RAM module provides 4,096 bits configurable in various aspect ratios:

  • 4K × 1
  • 2K × 2
  • 1K × 4
  • 512 × 8
  • 256 × 16

XC2S200-6FGG480C Applications

Industrial Automation Systems

The XC2S200-6FGG480C excels in programmable logic controllers (PLCs), motor control systems, and industrial networking equipment. Its reconfigurable architecture allows field updates without hardware replacement.

Telecommunications Equipment

Network switches, routers, and protocol converters benefit from the device’s high I/O count and flexible logic resources. The integrated DLLs ensure precise timing for serial communication interfaces.

Embedded Computing Platforms

System designers implement custom peripherals, hardware accelerators, and specialized processing units using the XC2S200-6FGG480C. The FPGA serves as an excellent ASIC prototyping platform.

Consumer Electronics

Cost-sensitive consumer products leverage the Spartan-II family’s competitive pricing while maintaining sufficient logic density for video processing, audio applications, and display controllers.

Design Development Tools

Software Support

The XC2S200-6FGG480C is supported by Xilinx ISE Design Suite (up to version 14.7), providing:

  • Schematic and HDL entry
  • Synthesis and implementation
  • Timing analysis and simulation
  • JTAG programming and debugging

Configuration Options

Multiple configuration modes accommodate different system requirements:

  • Master Serial Mode
  • Slave Serial Mode
  • Master SelectMAP Mode
  • Slave SelectMAP Mode
  • Boundary Scan (JTAG) Mode

XC2S200-6FGG480C vs Alternative Devices

Comparison Within Spartan-II Family

Device System Gates Logic Cells Max I/O Block RAM
XC2S100 100,000 2,700 176 40 Kbits
XC2S150 150,000 3,888 260 48 Kbits
XC2S200 200,000 5,292 284 56 Kbits

The XC2S200 provides the highest logic density within the Spartan-II lineup, making the XC2S200-6FGG480C ideal for designs requiring maximum resources.

Ordering and Availability Information

Manufacturer Details

Attribute Information
Manufacturer AMD (formerly Xilinx)
Product Status Legacy / Mature Product
Lead Time Varies by distributor
Export Classification Check current ECCN status

Quality and Reliability

The XC2S200-6FGG480C undergoes comprehensive testing to ensure reliability:

  • 100% functional testing
  • Parametric verification
  • Burn-in qualification
  • Moisture sensitivity testing

Frequently Asked Questions

What is the maximum operating frequency of the XC2S200-6FGG480C?

The -6 speed grade XC2S200-6FGG480C achieves system clock frequencies up to 263 MHz for internal operations, with actual performance depending on design complexity and implementation.

Is the XC2S200-6FGG480C RoHS compliant?

Yes, the “G” in the part number indicates lead-free (Pb-free) packaging, confirming RoHS compliance for environmental regulations.

What programming interface does the XC2S200-6FGG480C support?

The device supports JTAG (IEEE 1149.1) boundary scan programming and configuration via serial or parallel PROM interfaces.

Can the XC2S200-6FGG480C be reprogrammed in-system?

Yes, Spartan-II FPGAs support in-system reconfiguration, allowing design updates without physical hardware changes—a significant advantage over mask-programmed ASICs.

Conclusion

The XC2S200-6FGG480C delivers robust programmable logic capabilities in a compact BGA package. With 200,000 system gates, comprehensive I/O support, and proven Spartan-II architecture, this FPGA remains a reliable choice for industrial, telecommunications, and embedded applications requiring cost-effective programmable solutions.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.