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Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XCZU9EG-1FFVB1156E: AMD Xilinx Zynq UltraScale+ MPSoC FPGA

Product Details

The XCZU9EG-1FFVB1156E is a high-performance System-on-Chip (SoC) FPGA from the AMD Xilinx Zynq UltraScale+ MPSoC family. This advanced programmable logic device combines a powerful 64-bit quad-core ARM Cortex-A53 application processor with flexible programmable logic, making it ideal for demanding applications in artificial intelligence, 5G wireless infrastructure, automotive ADAS systems, and embedded vision processing.

Built on 16nm FinFET+ process technology, the XCZU9EG-1FFVB1156E delivers exceptional performance, power efficiency, and integration capabilities for next-generation embedded systems. Explore our complete range of Xilinx FPGA solutions for your design requirements.

Key Features of XCZU9EG-1FFVB1156E Zynq UltraScale+ FPGA

Processing System (PS) Architecture

The XCZU9EG-1FFVB1156E features a heterogeneous multiprocessing architecture with both application and real-time processing capabilities. The Application Processing Unit (APU) includes a quad-core ARM Cortex-A53 MPCore running at up to 1.5 GHz with NEON SIMD engine and single/double precision floating-point support. The Real-Time Processing Unit (RPU) features dual ARM Cortex-R5F cores at up to 600 MHz for deterministic, low-latency control applications.

Programmable Logic (PL) Resources

The programmable logic section delivers exceptional flexibility with approximately 600,000 system logic cells, 274,080 configurable logic block (CLB) look-up tables (LUTs), and 548,160 CLB flip-flops. With 2,520 DSP48E2 slices featuring 27×18 multipliers and 48-bit accumulators, the XCZU9EG-1FFVB1156E excels in signal processing, machine learning inference, and high-performance computing applications.

XCZU9EG-1FFVB1156E Technical Specifications

General Device Specifications

Parameter Value
Manufacturer Part Number XCZU9EG-1FFVB1156E
Manufacturer AMD (formerly Xilinx)
Product Family Zynq UltraScale+ MPSoC
Device Type EG (with GPU)
Package Type 1156-Ball FCBGA (35mm x 35mm)
Ball Pitch 1.0mm
Process Technology 16nm FinFET+
Speed Grade -1 (Standard Performance)
Temperature Grade E (Extended: 0°C to +100°C Tj)
Core Voltage 0.85V
RoHS Status Lead Free / RoHS Compliant

Processing System Specifications

Component Specification
Application Processing Unit (APU) Quad-core ARM Cortex-A53 @ up to 1.5 GHz
Real-Time Processing Unit (RPU) Dual-core ARM Cortex-R5F @ up to 600 MHz
Graphics Processing Unit (GPU) ARM Mali-400 MP2 @ 667 MHz
L1 Cache (APU) 32KB I-Cache + 32KB D-Cache per core
L2 Cache (APU) 1MB Shared
On-Chip Memory (OCM) 256KB with ECC
External Memory Support DDR4, LPDDR4, DDR3, DDR3L, LPDDR3

Programmable Logic Resources

Resource Quantity
System Logic Cells 599,550 (~600K)
CLB Look-Up Tables (LUTs) 274,080
CLB Flip-Flops 548,160
DSP48E2 Slices 2,520
Block RAM (36Kb each) 32.1 Mb (912 blocks)
Distributed RAM 8.8 Mb Maximum
Total User I/O 328 (Package Dependent)
High-Performance (HP) I/O 96 (1.0V – 1.8V support)
High-Density (HD) I/O 66 (1.2V – 3.3V support)
GTH Transceivers 16 @ up to 16.3 Gb/s
PS-GTR Transceivers 4 @ up to 6.0 Gb/s

XCZU9EG-1FFVB1156E Connectivity and Interfaces

High-Speed Peripheral Interfaces

Interface Specification
PCIe Gen2 x4 (PS-GTR)
USB USB 3.0 (x2) + USB 2.0 (x2)
SATA SATA 3.1 (x2)
DisplayPort DisplayPort 1.2a (x2 lanes)
Ethernet Tri-mode Gigabit Ethernet (x4)

General Purpose Interfaces

Interface Quantity/Specification
UART 2x UART
CAN 2x CAN 2.0B
I2C 2x I2C
SPI 2x SPI
GPIO 4x 32-bit GPIO banks
SD/SDIO 2x SD/SDIO 3.0
MIO Pins 78 Multiplexed I/O

Target Applications for XCZU9EG-1FFVB1156E SoC FPGA

The XCZU9EG-1FFVB1156E Zynq UltraScale+ MPSoC is optimized for a wide range of high-performance embedded applications requiring heterogeneous processing capabilities:

Artificial Intelligence and Machine Learning Acceleration

The combination of ARM processors and extensive DSP resources makes the XCZU9EG ideal for edge AI inference, neural network acceleration, and real-time machine learning applications. The 2,520 DSP slices enable efficient implementation of convolutional neural networks (CNNs), recurrent neural networks (RNNs), and other deep learning algorithms.

5G Wireless and Communications Infrastructure

With high-speed serial transceivers and extensive signal processing capabilities, the XCZU9EG-1FFVB1156E supports 5G NR baseband processing, massive MIMO beamforming, radio unit implementations, and software-defined radio (SDR) platforms.

Automotive Advanced Driver Assistance Systems (ADAS)

The integrated GPU and real-time processing capabilities support sensor fusion, computer vision, LiDAR processing, and autonomous driving algorithms. The heterogeneous architecture enables simultaneous execution of safety-critical real-time tasks and complex perception algorithms.

Industrial Automation and Medical Imaging

Industrial applications benefit from the XCZU9EG’s real-time control capabilities for robotics, motor control, and industrial vision systems. Medical imaging applications leverage the DSP resources for ultrasound processing, CT reconstruction, and MRI signal processing.

Development Tools and Software Support

AMD Vivado Design Suite

The XCZU9EG-1FFVB1156E is fully supported by AMD Vivado Design Suite, providing advanced synthesis, implementation, and debugging capabilities for programmable logic development.

AMD Vitis Unified Software Platform

Vitis enables software-centric development with C/C++ and Python programming for heterogeneous applications, including AI/ML acceleration using Vitis AI libraries.

PetaLinux Tools and Operating System Support

PetaLinux provides embedded Linux development tools optimized for Zynq UltraScale+ devices. The XCZU9EG also supports FreeRTOS, VxWorks, and other real-time operating systems for the Cortex-R5 RPU.

XCZU9EG-1FFVB1156E Part Number Breakdown

Segment Value Meaning
Family XCZU Zynq UltraScale+
Device 9EG Device 9, EG variant (with GPU)
Speed Grade -1 Standard speed (-1, -2, -3 available)
Package FFVB1156 1156-ball FCBGA, 1.0mm pitch
Temp Grade E Extended (0°C to +100°C Tj)

Related XCZU9EG Part Numbers and Alternatives

When selecting the appropriate Zynq UltraScale+ device for your application, consider these related part numbers:

Part Number Speed Temperature
XCZU9EG-2FFVB1156E -2 (High) Extended (0°C to +100°C)
XCZU9EG-1FFVB1156I -1 (Standard) Industrial (-40°C to +100°C)
XCZU9EG-2FFVB1156I -2 (High) Industrial (-40°C to +100°C)
XCZU9EG-1FFVC900E -1 (Standard) 900-ball FCBGA Package

Why Choose XCZU9EG-1FFVB1156E for Your Design?

The XCZU9EG-1FFVB1156E represents the ideal balance of processing power, programmable logic resources, and integration for demanding embedded applications. With its quad-core ARM Cortex-A53 application processor, dual ARM Cortex-R5F real-time processor, Mali-400 MP2 GPU, and extensive programmable logic with 600K logic cells and 2,520 DSP slices, this Zynq UltraScale+ MPSoC delivers the heterogeneous computing platform needed for next-generation AI, 5G, automotive, and industrial applications.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.