Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XCZU7CG-1FFVF1517E AMD Zynq UltraScale+ MPSoC FPGA: Complete Technical Guide

Product Details

The XCZU7CG-1FFVF1517E is a high-performance System on Chip (SoC) from AMD’s Zynq UltraScale+ MPSoC CG family. This advanced programmable logic device combines powerful ARM Cortex processors with 504K+ logic cells, delivering exceptional processing power for industrial, automotive, and embedded applications. Built on 20nm technology with a 1517-FCBGA package, this FPGA offers superior integration and energy efficiency for next-generation designs.


XCZU7CG-1FFVF1517E Key Specifications Overview

Parameter Specification
Manufacturer AMD (Xilinx)
Part Number XCZU7CG-1FFVF1517E
Product Family Zynq UltraScale+ MPSoC CG
Architecture MCU + FPGA Hybrid
Process Technology 20nm FinFET+
Logic Cells 504,000+
Package Type 1517-FCBGA (40×40mm)
Operating Voltage (VCCINT) 0.85V
Speed Grade -1
Temperature Range Extended (0°C to +100°C TJ)

Dual ARM Cortex Processor Architecture

The XCZU7CG-1FFVF1517E integrates a sophisticated dual-processor architecture designed for demanding computational workloads.

Application Processing Unit (APU)

Feature Details
Processor Core Dual ARM Cortex-A53 MPCore
Maximum Frequency 1.2 GHz
Debug Support ARM CoreSight Technology
Architecture 64-bit ARMv8-A

Real-Time Processing Unit (RPU)

Feature Details
Processor Core Dual ARM Cortex-R5
Maximum Frequency 500 MHz
Debug Support ARM CoreSight Technology
Application Real-Time Processing & Safety-Critical Tasks

Programmable Logic Resources

The FPGA fabric in the XCZU7CG-1FFVF1517E provides extensive programmable logic resources for custom hardware acceleration and signal processing applications.

Resource Type Capacity
System Logic Cells 504,000+
On-Chip RAM 256 KB
Package Pin Count 1517 Pins
I/O Banks Multiple HD & HP Banks
Supplier Device Package 1517-FCBGA (40×40)

Comprehensive Connectivity Interfaces

The XCZU7CG-1FFVF1517E supports a wide range of industry-standard communication protocols, making it ideal for complex embedded system designs.

Supported Communication Protocols

Interface Type Protocol
Automotive CAN Bus
Networking Gigabit Ethernet
Serial Communication UART/USART, SPI, I²C
USB USB OTG
Memory Interface EBI/EMI
Storage MMC/SD/SDIO

Integrated Peripherals

Peripheral Function
DMA Controller High-Speed Data Transfer
Watchdog Timer (WDT) System Reliability & Safety

Speed Grade and Power Specifications

Operating Parameters

Parameter Value
Speed Grade -1 (Standard Performance)
Core Voltage (VCCINT) 0.85V
Low Power Option 0.72V Available (-1LI variants)
Temperature Grade Extended (E): 0°C to +100°C

The XCZU7CG series is available in -3, -2, and -1 speed grades, with -3E devices delivering the highest performance. The -1 speed grade in this part number provides an optimal balance between performance and power consumption for most industrial applications.


Package Information and Mounting

Physical Specifications

Attribute Specification
Package Type FCBGA (Flip-Chip Ball Grid Array)
Package Designation FFVF1517
Ball Count 1517
Package Dimensions 40mm × 40mm
Ball Pitch 1.0mm
Mounting Type Surface Mount (SMD/SMT)

Ideal Applications for XCZU7CG-1FFVF1517E

This Zynq UltraScale+ MPSoC FPGA excels in applications requiring both software programmability and hardware acceleration:

  • Industrial Automation: Motor control, machine vision, robotics
  • Automotive Systems: ADAS, infotainment, gateway modules
  • Telecommunications: 5G infrastructure, network acceleration
  • Medical Equipment: Imaging systems, diagnostic devices
  • Aerospace & Defense: Radar processing, secure communications
  • Video Processing: 4K/8K encoding/decoding, broadcast equipment
  • Edge Computing: AI inference, real-time analytics

Development Tools and Software Support

Design with the XCZU7CG-1FFVF1517E using AMD’s comprehensive development ecosystem:

Tool Purpose
Vivado Design Suite RTL Design, Synthesis, Implementation
Vitis Unified Platform Software Development, AI Acceleration
PetaLinux Embedded Linux Development
SDK Bare-Metal & RTOS Application Development

Why Choose the XCZU7CG-1FFVF1517E for Your Design?

The XCZU7CG-1FFVF1517E offers several compelling advantages for system designers:

  1. Heterogeneous Computing: Combines ARM processing cores with FPGA fabric for flexible partitioning between software and hardware
  2. Extended Temperature Operation: Qualified for industrial environments with 0°C to +100°C junction temperature range
  3. Power Efficiency: 20nm FinFET+ technology delivers superior performance per watt
  4. Rich Connectivity: Comprehensive peripheral set reduces external component count
  5. Scalability: Part of the broader Zynq UltraScale+ family enabling easy migration

Order the XCZU7CG-1FFVF1517E Today

Looking for reliable Xilinx FPGA solutions for your next embedded project? The XCZU7CG-1FFVF1517E AMD Zynq UltraScale+ MPSoC delivers the processing power, programmable logic, and connectivity you need. Contact us for competitive pricing, technical support, and fast worldwide shipping.


Related Part Numbers

Part Number Variant Description
XCZU7CG-1FFVF1517I Industrial Temperature (-40°C to +100°C)
XCZU7CG-2FFVF1517E -2 Speed Grade, Extended Temp
XCZU7CG-1FFVC1156E 1156-FCBGA Package Option
XCZU7CG-1FBVB900E 900-FCBGA Smaller Package
XCZU7EG-1FFVF1517E EG Variant with Enhanced Graphics
XCZU7EV-1FFVF1517E EV Variant with Video Codec

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.