Meta Description: Buy XCZU29DR-1FFVF1760E AMD Xilinx Zynq UltraScale+ RFSoC FPGA with 930K logic cells, 16-channel RF-ADC/DAC, quad-core ARM Cortex-A53. Ideal for 5G, radar, and SDR applications.
The XCZU29DR-1FFVF1760E is a high-performance Xilinx FPGA from AMD’s Zynq UltraScale+ RFSoC family. This advanced system-on-chip integrates multiband RF data converters, programmable logic, and a powerful processing system into a single device. Engineers choose this component for demanding wireless infrastructure, 5G base stations, and software-defined radio applications.
XCZU29DR-1FFVF1760E Product Overview
The XCZU29DR-1FFVF1760E belongs to the first generation of Zynq UltraScale+ RFSoC devices. AMD (formerly Xilinx) designed this chip to consolidate entire radio frequency signal chains into one integrated circuit. As a result, designers can reduce board space, lower power consumption, and simplify system architecture.
This RFSoC combines several critical subsystems. First, it includes 930,300 programmable logic cells for custom digital signal processing. Second, it features a complete heterogeneous multiprocessing system with ARM processors. Third, it integrates direct RF sampling data converters that eliminate the need for external mixer stages.
XCZU29DR-1FFVF1760E Key Specifications
| Parameter |
Specification |
| Manufacturer |
AMD (Xilinx) |
| Part Number |
XCZU29DR-1FFVF1760E |
| Family |
Zynq UltraScale+ RFSoC |
| Generation |
Gen 1 |
| Technology Node |
16nm FinFET+ |
| Logic Cells |
930,300 |
| Speed Grade |
-1 (Standard Performance) |
| Temperature Grade |
E (Commercial: 0°C to 100°C) |
| Package Type |
FFVF1760 (1760-pin FCBGA) |
| Core Voltage |
0.85V |
| Lead-Free Status |
Lead-Free / RoHS Compliant |
Processing System (PS) Architecture
The XCZU29DR-1FFVF1760E incorporates a sophisticated dual-cluster processing system. This architecture enables real-time control alongside high-performance application processing.
Application Processing Unit (APU)
| Feature |
Specification |
| Processor Cores |
Quad-core ARM Cortex-A53 |
| Architecture |
64-bit ARMv8-A |
| Features |
NEON SIMD, Single/Double Precision FPU |
| L1 Cache |
32KB Instruction + 32KB Data per core |
| L2 Cache |
1MB Shared |
| CoreSight Debug |
Yes |
Real-Time Processing Unit (RPU)
| Feature |
Specification |
| Processor Cores |
Dual-core ARM Cortex-R5F |
| Architecture |
32-bit ARMv7-R |
| Features |
Single/Double Precision FPU |
| L1 Cache |
32KB Instruction + 32KB Data per core |
| TCM Memory |
128KB per core |
| Lock-Step Mode |
Supported |
RF Data Converter Specifications
One of the most significant advantages of the XCZU29DR-1FFVF1760E is its integrated RF data converters. These converters enable direct RF sampling, which eliminates intermediate frequency stages in many applications.
RF Analog-to-Digital Converters (RF-ADC)
| Parameter |
Specification |
| Number of Channels |
16 |
| Resolution |
12-bit |
| Maximum Sample Rate |
2.058 GSPS |
| Input Frequency Range |
DC to 4 GHz |
| Digital Down Converter |
Integrated (DDC) |
| Decimation Rates |
Programmable 1x to 40x |
| NCO Resolution |
48-bit |
RF Digital-to-Analog Converters (RF-DAC)
| Parameter |
Specification |
| Number of Channels |
16 |
| Resolution |
14-bit |
| Maximum Sample Rate |
6.554 GSPS |
| Output Frequency Range |
DC to 4 GHz |
| Digital Up Converter |
Integrated (DUC) |
| Interpolation Rates |
Programmable 1x to 40x |
| NCO Resolution |
48-bit |
Programmable Logic (PL) Resources
The XCZU29DR-1FFVF1760E provides extensive programmable logic resources for implementing custom digital designs. These resources enable engineers to create optimized signal processing pipelines and control logic.
Logic and DSP Resources
| Resource |
Quantity |
| System Logic Cells |
930,300 |
| CLB Flip-Flops |
850,560 |
| CLB LUTs |
425,280 |
| DSP Slices |
4,272 |
| DSP Performance |
Up to 8.5 TMACS |
Memory Resources
| Memory Type |
Capacity |
| Block RAM |
38 Mb |
| UltraRAM |
22.5 Mb |
| Distributed RAM |
12.4 Mb |
| Total Internal Memory |
~60 Mb |
| On-Chip Memory (OCM) |
256 KB with ECC |
High-Speed Connectivity
The XCZU29DR-1FFVF1760E offers multiple high-speed serial transceivers for various communication protocols. These interfaces support modern networking and data streaming requirements.
Transceiver Summary
| Transceiver Type |
Quantity |
Maximum Data Rate |
| GTY Transceivers |
16 |
32.75 Gb/s |
| PS-GTR Transceivers |
4 |
6 Gb/s |
Supported Protocols
| Interface |
Support |
| PCIe |
Gen3 x16 / Gen4 x8 |
| 100G Ethernet |
Yes |
| 150G Interlaken |
Yes |
| SATA |
3.1 |
| USB |
3.0 |
| DisplayPort |
1.2a |
Soft-Decision Forward Error Correction (SD-FEC)
The XCZU29DR-1FFVF1760E includes dedicated SD-FEC blocks for wireless and wireline communication applications.
| Feature |
Specification |
| SD-FEC Blocks |
8 |
| LDPC Decode |
Yes |
| LDPC Encode |
Yes |
| Turbo Decode |
Yes (LTE) |
| 5G NR Support |
Yes |
| DOCSIS Support |
Yes |
Package and Ordering Information
Package Details
| Parameter |
Specification |
| Package Code |
FFVF1760 |
| Package Type |
Flip-Chip BGA |
| Pin Count |
1760 |
| Ball Pitch |
1.0 mm |
| Package Dimensions |
42.5mm x 42.5mm |
Part Number Breakdown
XCZU29DR-1FFVF1760E decodes as follows:
| Segment |
Meaning |
| XC |
Commercial Grade |
| ZU29DR |
Zynq UltraScale+ RFSoC, 29DR variant |
| -1 |
Speed Grade (Standard) |
| FF |
Flip-Chip Ball Grid Array |
| VF1760 |
1760-ball FCBGA package |
| E |
Commercial Temperature (0°C to 100°C) |
Related Part Numbers
| Part Number |
Difference |
| XCZU29DR-1FFVF1760I |
Industrial Temperature (-40°C to 100°C) |
| XCZU29DR-2FFVF1760E |
Faster Speed Grade (-2) |
| XCZU29DR-1FSVF1760E |
Alternative Package (FSVF) |
Target Applications for XCZU29DR-1FFVF1760E
This AMD Xilinx RFSoC FPGA targets several high-growth markets. The integration of RF converters with programmable logic creates unique value for these applications.
Wireless Infrastructure
- 5G NR Massive MIMO base stations
- 4G LTE macro and small cells
- Wireless backhaul systems
- O-RAN radio units
Aerospace and Defense
- Phased array radar systems
- Electronic warfare platforms
- SIGINT receivers
- Satellite communications
Test and Measurement
- RF signal generators
- Spectrum analyzers
- Protocol analyzers
- Software-defined instrumentation
Cable Infrastructure
- DOCSIS 3.1 cable modem termination systems
- Remote PHY devices
- Distributed access architectures
Development Tools and Software Support
AMD provides comprehensive tools for XCZU29DR-1FFVF1760E development.
| Tool |
Purpose |
| Vivado Design Suite |
FPGA design, synthesis, implementation |
| Vitis Platform |
Embedded software development |
| Vitis AI |
Machine learning inference acceleration |
| PetaLinux |
Embedded Linux distribution |
| MATLAB/Simulink |
Model-based design integration |
XCZU29DR-1FFVF1760E vs XCZU49DR-1FFVF1760E Comparison
Engineers often compare the XCZU29DR with larger family members. Here is a quick comparison with the XCZU49DR.
| Feature |
XCZU29DR |
XCZU49DR |
| Logic Cells |
930,300 |
930,300 |
| DSP Slices |
4,272 |
4,272 |
| Block RAM |
38 Mb |
38 Mb |
| UltraRAM |
22.5 Mb |
36 Mb |
| RF-ADC Channels |
16 |
16 |
| RF-DAC Channels |
16 |
16 |
| Generation |
Gen 1 |
Gen 3 |
| Max ADC Rate |
2.058 GSPS |
5 GSPS |
| Max DAC Rate |
6.554 GSPS |
10 GSPS |
Technical Documentation
For complete specifications, consult these AMD resources:
| Document |
Description |
| DS889 |
Zynq UltraScale+ RFSoC Data Sheet: Overview |
| DS926 |
Zynq UltraScale+ RFSoC Data Sheet: DC and AC Switching Characteristics |
| UG1085 |
Zynq UltraScale+ Device Technical Reference Manual |
| UG583 |
UltraScale Architecture PCB Design Guide |
Why Choose XCZU29DR-1FFVF1760E
The XCZU29DR-1FFVF1760E delivers several compelling benefits for system designers:
- Reduced Component Count: Integrated RF converters eliminate external ADCs, DACs, and mixers
- Lower Power Consumption: Single-chip integration reduces total system power
- Smaller Board Area: Consolidation enables more compact designs
- Improved Signal Integrity: Shorter signal paths between digital and analog domains
- Flexible Architecture: Programmable logic adapts to evolving standards
- Future-Proof Design: Software-defined approach supports field upgrades
Conclusion
The XCZU29DR-1FFVF1760E represents a breakthrough in RF system integration. By combining 16 RF-ADC channels, 16 RF-DAC channels, extensive programmable logic, and a heterogeneous processing system, this device enables next-generation wireless and radar systems. Engineers looking to simplify their RF designs while maximizing performance should consider this AMD Xilinx Zynq UltraScale+ RFSoC FPGA.
