Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XCZU28DR-2FFVG1517I: AMD Xilinx Zynq UltraScale+ RFSoC – Complete Specifications & Features

Product Details

The XCZU28DR-2FFVG1517I is a high-performance RF System-on-Chip (RFSoC) from the AMD Xilinx Zynq UltraScale+ family. This industrial-grade device integrates direct RF-sampling data converters with a powerful processing system and programmable logic, making it ideal for 5G wireless infrastructure, radar systems, and test & measurement applications. Explore our complete range of Xilinx FPGA solutions.


XCZU28DR-2FFVG1517I Key Features Overview

The XCZU28DR-2FFVG1517I belongs to the Gen 1 Zynq UltraScale+ RFSoC product line. This device delivers exceptional performance through its unique combination of high-speed RF data converters, hardened processing cores, and flexible programmable logic.

Why Choose the XCZU28DR-2FFVG1517I?

  • Integrated RF Sampling: Eliminates external ADC/DAC components
  • Industrial Temperature Rating: Operates from -40°C to +100°C
  • Highest Speed Grade (-2): Maximum performance for demanding applications
  • Single-Chip Solution: Reduces board complexity and power consumption
  • 5G-Ready Architecture: Supports all sub-6GHz frequency bands

XCZU28DR-2FFVG1517I Technical Specifications

General Device Information

Parameter Specification
Part Number XCZU28DR-2FFVG1517I
Manufacturer AMD (Xilinx)
Product Family Zynq UltraScale+ RFSoC Gen 1
Device Type System-on-Chip (SoC) FPGA
Process Technology 16nm FinFET+
Speed Grade -2 (Highest Performance)
Temperature Grade Industrial (-40°C to +100°C)
Core Voltage (VCCINT) 0.85V

Package Information

Parameter Specification
Package Type FFVG (Flip-Chip Fine-Pitch BGA)
Ball Count 1517 Balls
Package Dimensions 40mm × 40mm
Ball Pitch 1.0mm
Mounting Type Surface Mount (SMD/SMT)
Lead-Free Status RoHS Compliant

XCZU28DR-2FFVG1517I RF Data Converter Specifications

The RF analog-to-digital and digital-to-analog converters are the defining features of the XCZU28DR-2FFVG1517I. These integrated converters enable direct RF sampling, eliminating traditional RF front-end components.

RF-ADC (Analog-to-Digital Converter) Specifications

Parameter Specification
Number of ADC Channels 8
Resolution 12-bit
Maximum Sample Rate 4.096 GSPS
Analog Bandwidth Up to 6 GHz
Input Frequency Range DC to 6 GHz
Noise Spectral Density Excellent

RF-DAC (Digital-to-Analog Converter) Specifications

Parameter Specification
Number of DAC Channels 8
Resolution 14-bit
Maximum Sample Rate 6.554 GSPS
Analog Bandwidth Up to 6 GHz
Output Frequency Range DC to 6 GHz
Interpolation Modes 1×, 2×, 4×, 8×

Digital Signal Processing Features

Feature Description
DDC (Digital Down Converter) Programmable decimation, NCO, complex mixer
DUC (Digital Up Converter) Programmable interpolation, NCO, complex mixer
Dual-Band Support DDC and DUC support dual-band operation
SD-FEC Cores 8 Soft-Decision Forward Error Correction engines

XCZU28DR-2FFVG1517I Processing System Specifications

The XCZU28DR-2FFVG1517I features a heterogeneous processing system combining application processors and real-time processors for maximum flexibility.

ARM Processor Configuration

Processor Type Specification
Application Processor Quad-core ARM Cortex-A53 MPCore
APU Clock Speed Up to 1.33 GHz
Real-Time Processor Dual-core ARM Cortex-R5 MPCore
RPU Clock Speed Up to 533 MHz
Architecture 64-bit ARMv8
Cache L1 + L2 Cache hierarchy

Processing System Features

Feature Specification
Memory Interface DDR4-2666
MIO Pins Up to 78 dedicated multiplexed I/O
Security AES-256, SHA-3/384, RSA-4096
Boot Options QSPI, SD/eMMC, NAND, JTAG

XCZU28DR-2FFVG1517I Programmable Logic Resources

The programmable logic fabric provides flexible acceleration and signal processing capabilities for custom application requirements.

Logic Resources

Resource Quantity
System Logic Cells 930,300
CLB Flip-Flops 850,560
CLB LUTs 425,280
Distributed RAM (Kb) 7,875
Block RAM (Kb) 38,880
UltraRAM (Kb) 22,500

DSP and Transceiver Resources

Resource Specification
DSP48E2 Slices 4,272
GTY Transceivers 16 (33 Gbps each)
PS-GTR Transceivers 4
PCIe Support Gen3 ×16
100G Ethernet Supported

XCZU28DR-2FFVG1517I High-Speed Connectivity

GTY Transceiver Features

Parameter Specification
Number of Transceivers 16 GTY + 4 PS-GTR
Line Rate (GTY) Up to 33 Gbps
Line Rate (PS-GTR) Up to 6 Gbps
Supported Protocols PCIe, 100G Ethernet, JESD204B/C
Pre-emphasis/Equalization Advanced TX/RX equalization

Memory Interface Specifications

Interface Specification
DDR4 SDRAM Up to 2666 Mbps
DDR Interface Width 64-bit with ECC
LPDDR4 Supported
QSPI Flash Supported

XCZU28DR-2FFVG1517I Applications

The XCZU28DR-2FFVG1517I is engineered for demanding applications requiring high-performance RF signal processing.

Primary Application Areas

5G Wireless Infrastructure

  • Massive MIMO base stations
  • Small cells and remote radio heads
  • Multiband, multi-mode cellular radios
  • Beamforming systems

Aerospace and Defense

  • Phased array radar systems
  • Electronic warfare (EW) systems
  • Signals intelligence (SIGINT)
  • Software-defined radio (SDR)

Test and Measurement

  • RF signal generators
  • Spectrum analyzers
  • Vector network analyzers
  • High-speed data acquisition

Cable Infrastructure

  • DOCSIS 3.1 remote PHY devices
  • Cable access network equipment
  • Distributed access architectures

XCZU28DR-2FFVG1517I vs. XCZU43DR-2FFVG1517I Comparison

Feature XCZU28DR-2FFVG1517I XCZU43DR-2FFVG1517I
Generation Gen 1 Gen 3
ADC Channels 8 × 12-bit 8 × 14-bit
ADC Sample Rate 4.096 GSPS 5.0 GSPS
DAC Channels 8 × 14-bit 8 × 14-bit
DAC Sample Rate 6.554 GSPS 10.0 GSPS
Logic Cells 930,300 930,300
Package FFVG1517 FFVG1517

Part Number Decoder: XCZU28DR-2FFVG1517I

Understanding the AMD Xilinx part number structure helps identify device specifications:

Code Meaning
XC Commercial device
ZU28 Zynq UltraScale+ device model 28
DR RFSoC (Direct RF) variant
-2 Speed grade 2 (highest performance)
FF Flip-chip package
VG Fine-pitch BGA
1517 1517 ball count
I Industrial temperature (-40°C to +100°C)

XCZU28DR-2FFVG1517I Development Tools

Software Support

Tool Description
Vivado Design Suite FPGA development environment
Vitis Unified Platform Software and AI development
PetaLinux Embedded Linux development
MATLAB/Simulink Model-based design integration

Evaluation Boards

Board Description
ZCU111 Primary evaluation kit featuring XCZU28DR
ZCU1275 Characterization kit for RF data converters

Ordering Information for XCZU28DR-2FFVG1517I

Parameter Details
Full Part Number XCZU28DR-2FFVG1517I
Package Type Tray
Moisture Sensitivity Level MSL-3
Export Control May require End Use Statement
Lifecycle Status Active

XCZU28DR-2FFVG1517I Technical Documentation

For comprehensive technical information, refer to the following AMD Xilinx documentation:

  • DS889: Zynq UltraScale+ RFSoC Data Sheet: Overview
  • DS926: Zynq UltraScale+ RFSoC DC and AC Switching Characteristics
  • UG1271: ZCU111 Evaluation Board User Guide
  • PG269: RF Data Converter LogiCORE IP Product Guide

Frequently Asked Questions About XCZU28DR-2FFVG1517I

What is the difference between -2 and -1 speed grades?

The -2 speed grade offers the highest performance with faster clock speeds and timing specifications. The -1 speed grade provides slightly lower performance at reduced power consumption.

Is the XCZU28DR-2FFVG1517I suitable for 5G applications?

Yes, the XCZU28DR-2FFVG1517I fully supports sub-6GHz 5G applications with its direct RF sampling architecture, SD-FEC cores for LDPC encoding/decoding, and high-bandwidth data converters.

What development environment does the XCZU28DR-2FFVG1517I require?

AMD Xilinx Vivado Design Suite version 2018.2 or later is required for development. Vitis Unified Platform provides additional software development capabilities.

Does the XCZU28DR-2FFVG1517I support JESD204B/C interfaces?

While the device has integrated RF data converters that eliminate traditional JESD204 interfaces, the GTY transceivers can implement JESD204B/C for external connectivity if required.


Summary

The XCZU28DR-2FFVG1517I represents a significant advancement in RF system integration. By combining 8 high-speed ADCs, 8 high-speed DACs, powerful ARM processors, and extensive programmable logic in a single device, it enables next-generation wireless infrastructure, radar systems, and test equipment designs with reduced size, weight, and power consumption.

This industrial-grade RFSoC delivers the reliability and performance required for mission-critical applications while providing the flexibility to adapt to evolving standards and requirements.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.