If you are engineering a cost-effective, low-power programmable logic solution, the XC7S6-2CPGA196C offers an optimal balance of processing capability and energy efficiency. As a premium component from the renowned AMD Spartan-7 series, this versatile device is designed to deliver exceptional performance per watt, making it an excellent foundation for modern digital hardware designs
Unlocking Potential with the XC7S6-2CPGA196C
The XC7S6-2CPGA196C represents the pinnacle of cost-optimized logic architecture. Built on an advanced 28nm process, it is specifically tailored to meet the demanding requirements of industrial, automotive, and consumer electronics. The chip houses a robust 6,000 logic cells and 100 flexible user I/O pins within an ultra-compact 196-CSPBGA (8×8 mm) package. This extremely small footprint allows hardware developers to maximize PCB real estate without sacrificing connectivity, making this Xilinx FPGA the ultimate choice for high-density surface mount technology (SMT) layouts.
Superior Speed and Power Efficiency
One of the defining characteristics of this specific model is its -2 speed grade, which guarantees the highest processing performance available within the Spartan-7 family. It operates reliably on a tightly regulated core supply voltage of 0.95V to 1.05V, drastically minimizing both dynamic and static power consumption. This efficiency ensures stable performance in thermally constrained or battery-operated embedded systems. Furthermore, its native integration with MicroBlaze™ soft processors allows engineers to rapidly deploy customizable microcontroller subsystems right on the chip.
Advanced On-Chip Resources
Beyond its primary logic capacity, this IC is packed with high-value embedded features. It incorporates 180 Kbit of total RAM, including 36KB dual-port block RAM with built-in FIFO logic for rapid, efficient data buffering. To ensure system reliability and security, it includes a dual 12-bit XADC with internal thermal and supply sensors, alongside robust 256-bit AES encryption with HMAC/SHA-256 authentication to protect critical intellectual property against unauthorized access or tampering.
Technical Specifications
To streamline your electronic design and component sourcing process, the core electrical and physical parameters are summarized in the table below:
| Feature |
Specification |
| Manufacturer |
AMD / Xilinx |
| Series |
Spartan®-7 |
| Part Number |
XC7S6-2CPGA196C |
| Logic Cells / Elements |
6,000 |
| Total RAM Bits |
184,320 (180 Kbit) |
| Number of I/O Pins |
100 |
| Core Supply Voltage |
0.95V ~ 1.05V |
| Speed Grade |
-2 (Highest Performance) |
| Operating Temperature |
0°C to +85°C (Commercial) |
| Package / Case |
196-CSPBGA (8×8 mm) |
| Mounting Type |
Surface Mount (SMT) |
Seamless PCBA Integration
Integrating highly advanced 196-ball grid array components requires meticulous electronic manufacturing services. Whether you are scaling up industrial motor controls, developing next-generation gaming controller PCBAs, or building embedded vision sensors, securing reliable SMT assembly is critical. Because BGA soldering joints are hidden beneath the chip, employing rigorous X-ray inspection protocols during the assembly phase guarantees that the component’s intricate I/O connections perform flawlessly in the field.
