Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC7A200T-2FBG676I | AMD Xilinx Artix-7 FPGA, 215K Logic Cells, 676-FCBGA

Product Details

XC7A200T-2FBG676I: High-Performance Artix-7 FPGA for Cost-Sensitive Designs

The XC7A200T-2FBG676I is the largest device in the AMD (formerly Xilinx FPGA) Artix-7 family. Built on a 28 nm high-K metal gate (HKMG) process, this industrial-grade FPGA delivers the best performance-per-watt in its class. Moreover, it packs 215,360 logic cells, 740 DSP slices, and 13.1 Mb of block RAM into a compact 676-ball FCBGA package. As a result, designers get high logic density, low power consumption, and rich connectivity at an attractive price point.

Key Features and Benefits

The XC7A200T-2FBG676I targets cost- and power-sensitive applications that still demand serious processing power. Therefore, it is widely used in software-defined radio, machine vision, medical imaging, industrial Ethernet, and low-end wireless backhaul. In addition, it supports the MicroBlaze™ 32-bit soft processor and 1,066 Mb/s DDR3 memory interfaces, which simplifies embedded system design.

Notable features include:

  • 6-input LUT fabric with distributed memory and SRL support
  • Eight GTP transceivers running up to 6.6 Gb/s
  • Integrated PCIe® Gen2 x4 hard block
  • Dual 12-bit 1 MSPS XADC analog interface
  • 256-bit AES encryption with HMAC/SHA-256 authentication
  • DDR3 SelectIO™ support up to 1,866 Mb/s

Technical Specifications

Logic and Memory Resources
Parameter Value
Family Artix-7
Logic Cells 215,360
CLB Slices 33,650
Max Distributed RAM 2,888 Kb
Block RAM (36 Kb blocks) 365 / 13,140 Kb total
DSP48E1 Slices 740
CMTs (MMCM + PLL) 10
I/O, Transceivers and Package
Parameter Value
Maximum User I/Os 400
GTP Transceivers 8 (up to 6.6 Gb/s)
PCIe Hard IP 1 × Gen2 ×4
XADC 1 (dual 12-bit, 1 MSPS)
Package FCBGA-676 (FBG676)
Body Size / Pitch 27 × 27 mm / 1.0 mm
Electrical and Operating Conditions
Parameter Value
Speed Grade –2
Core Voltage (V<sub>CCINT</sub>) 0.95 V – 1.05 V (1.0 V nominal)
Operating Temperature (T<sub>J</sub>) –40 °C to +100 °C (Industrial)
Configuration JTAG, Master/Slave SPI, BPI, SelectMAP
Process Technology 28 nm HKMG, HPL

Design Tools and Support

Engineers program the XC7A200T-2FBG676I using the AMD Vivado® Design Suite, which streamlines synthesis, place-and-route, and bitstream generation. Furthermore, the device is pin-compatible with smaller Artix-7 parts in the same FBG676 footprint, so you can scale designs up or down without redesigning the PCB.

Order the XC7A200T-2FBG676I

Whether you are building a high-throughput vision system or a flexible communications platform, the XC7A200T-2FBG676I offers a proven, long-lifecycle solution backed by AMD’s commitment to support 7 Series devices through 2040.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.