The Taconic HT 1.5 PCB thermoplastic bonding film delivers exceptional electrical and thermal stability during complex multilayer lamination processes. Specially engineered as a low-loss bonding medium, this advanced thermoplastic material is critical for fusing high-frequency fluoropolymer (PTFE) laminates without compromising signal integrity. It allows engineers and product developers to build high-density, multi-layer circuit configurations that demand uniform thickness and precise dielectric control.

• Optimised Low Loss: Features a low dielectric constant ($D_k$) of 2.35 and a dissipation factor ($D_f$) of 0.0025 at 10 GHz for minimal RF signal attenuation.

• Thermal Reliability: High temperature resistance with a melting point exceeding 280°C, ensuring robust performance during lead-free reflow soldering cycles.

• Uniform Lamination: Consistent thickness profile ensures precise impedance control across the entire surface of complex multilayers.

• Excellent Adhesion: Provides superior bond strength to copper foil and PTFE-based substrates, preventing delamination under harsh environmental conditions.

• Chemical Resistance: Inert to standard PCB fabrication chemistry, including post-lamination etching and plating processes.

• Aerospace and Defence: Used in radar systems, satellite communication equipment, and guidance modules.

• Telecommunications: Critical for 5G/6G base station antennas, power amplifiers, and high-speed data transmission networks.

• Automotive Radar: Integrated into advanced driver-assistance systems (ADAS) operating at 77 GHz to 79 GHz frequencies.

• Medical Equipment: Suitable for high-frequency imaging devices and diagnostic instrumentation requiring reliable dielectric properties.

Partner with our engineering team to integrate Taconic HT 1.5 PCB lamination technology into your next high-frequency build. Submit your Gerber files through our secure portal to receive a detailed fabrication quotation.