The Taconic FastRise-28 Prepreg PCB is a premium thermoset prepreg material designed specifically for complex RF stackup lamination in high-frequency multi-layer boards. Engineered for demanding microwave, millimeter-wave (mmWave), and high-speed digital designs, this material provides structural stability and minimal signal attenuation. It serves as the ideal bonding medium for laminating diverse PTFE and thermoset substrates into high-performance hybrid radar and antenna assemblies.
Key Features of Taconic FastRise-28 Prepreg PCB
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Low Dissipation Factor ($D_f$): Features a dissipation factor of 0.0017 at 10 GHz to minimize dielectric loss in high-frequency circuits.
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Stable Dielectric Constant ($D_k$): Delivers a nominal $D_k$ of 2.80, maintaining high uniformity across broad temperature ranges.
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Enhanced Thermal Conductivity: Provides a rating of 0.45 W/mK to improve heat dissipation in power amplifiers and dense RF stackups.
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Low-Temperature Processing: Enables low curing temperatures (under 215°C), preventing registration errors and protecting sensitive embedded components during sequential lamination cycles.
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Excellent Adhesion: Offers robust peel strength on standard, low-profile, and very low-profile (VLP) copper foils.
High-Frequency Applications
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Defense & Aerospace: Phased array radar systems, electronic warfare modules, and satellite communication (SATCOM) transceivers.
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Telecommunications: 5G/6G base station antennas, millimeter-wave backhaul links, and high-speed digital routers.
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Automotive Tech: Advanced Driver Assistance Systems (ADAS) and 77 GHz vehicular radar sensors.
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Commercial RF: Test and measurement instrumentation, power amplifiers, and multi-layer microwave combiners.
Why Choose PCBSYNC
PCBSYNC is a professional PCB fabrication, PCBA, and EMS manufacturer delivering precision-built electronics for aerospace, medical, automotive, industrial, and smart energy applications. We handle everything from rapid prototyping to mass production — including rigid, flexible, and rigid-flex PCBs, full turnkey assembly, component sourcing, AOI and X-ray inspection, and OEM/ODM support. Reliable boards. Consistent quality. From prototype to production — PCBSYNC.
Elevate Your High-Frequency Designs
Accelerate your next-generation RF project with precision-manufactured multi-layer stacks. Contact our engineering team today to review your stackup specifications or request a custom manufacturing quote.
