The RO4700 0.6mm 1/2oz ENIG 4-Layer 5G Antenna Tuning Module PCB is a high-performance solution for next-generation wireless infrastructure. Built on Rogers RO4700 series thermoset laminates, this board is specifically engineered to meet the stringent mechanical and electrical requirements of 5G antenna arrays and base station components. Its low-loss characteristics ensure maximum signal clarity in high-frequency environments.
Key Features
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Base Material: Rogers RO4700 High-Frequency Laminate for superior dielectric constant (Dk) control.
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Layer Count: 4-layer precision stackup for optimised RF shielding and grounding.
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Board Thickness: 0.6mm ultra-slim profile for compact module integration.
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Copper Weight: 1/2oz (18µm) finished copper for fine-line circuit precision.
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Surface Finish: Electroless Nickel Immersion Gold (ENIG) for excellent solderability and oxidation resistance.
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Thermal Stability: Low Coefficient of Thermal Expansion (CTE) across a wide temperature range.
Applications
This 5G Antenna Tuning Module is designed for critical RF and microwave applications, including:
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5G Massive MIMO antenna systems and small cell base stations.
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Satellite communication (SATCOM) ground equipment.
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Advanced radar sensing and automotive telemetry.
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Point-to-point microwave backhaul links.
Why Choose PCBSYNC
PCBSYNC is a professional PCB fabrication, PCBA, and EMS manufacturer delivering precision-built electronics for aerospace, medical, automotive, industrial, and smart energy applications. We handle everything from rapid prototyping to mass production — including rigid, flexible, and rigid-flex PCBs, full turnkey assembly, component sourcing, AOI and X-ray inspection, and OEM/ODM support. Reliable boards. Consistent quality. From prototype to production — PCBSYNC.
For detailed technical specifications or to discuss your custom RF stackup requirements, please contact our engineering team or request a formal quote today.
