The RO3003G2 0.8mm 4-Layer 5G Radio Board is engineered to meet the rigorous demands of next-generation wireless communication. Utilising Rogers RO3003G2 ceramic-filled PTFE laminates, this board provides superior dielectric constant stability over temperature and frequency. It is an essential component for engineers developing 5G femtocells, small cells, and high-speed telecommunications hardware where signal loss must be kept to an absolute minimum.
Key Features
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Material: Rogers RO3003G2 high-frequency laminate for low insertion loss.
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Stack-up: 4-layer precision construction for optimized EMI shielding.
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Thickness: 0.8mm profile, ideal for compact radio housing.
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Copper Weight: 1/2oz (18µm) base copper for fine-line circuit definition.
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Surface Finish: ENIG (Electroless Nickel Immersion Gold) for superior solderability and oxidation resistance.
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RF Performance: Optimized for 5G mmWave frequencies with minimal Df (Dissipation Factor).
Applications
This 5G radio board is designed for high-frequency environments, including:
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5G Femtocells and Small Cells: Providing localized high-speed network coverage.
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RF Power Amplifiers: Managing high-frequency signals with thermal efficiency.
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Automotive Radar: ADAS systems requiring stable dielectric constants.
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Satellite Communications: Ground station equipment and transceiver modules.
Why Choose PCBSYNC
PCBSYNC is a professional PCB fabrication, PCBA, and EMS manufacturer delivering precision-built electronics for aerospace, medical, automotive, industrial, and smart energy applications. We handle everything from rapid prototyping to mass production — including rigid, flexible, and rigid-flex PCBs, full turnkey assembly, component sourcing, AOI and X-ray inspection, and OEM/ODM support. Reliable boards. Consistent quality. From prototype to production — PCBSYNC.
To discuss your specific RF requirements or to receive a detailed technical assessment, please contact our engineering team or request a quote today.
