Engineered for the uncompromising demands of the aerospace and defense sectors, the RT/duroid® 6002 6-Layer Communication Board represents the pinnacle of high-frequency PCB engineering. Utilizing Rogers Corporation’s industry-leading low-loss PTFE composite, this board is designed to maintain exceptional signal integrity and mechanical reliability in the most hostile environments—from high-altitude avionics to deep-space satellite systems.
Precision Engineering for High-Frequency Performance
The RT/duroid 6002 laminate is specifically formulated to provide an extremely low thermal coefficient of dielectric constant (Dk). For RF engineers, this means unrivaled electrical stability across a temperature range of -55°C to +150°C. With a Dk of 2.94 ± .04, this 6-layer stackup allows for the design of complex, multi-layered microwave structures where phase stability and tight impedance control are non-negotiable.
Key Technical Specifications
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Material: Rogers RT/duroid 6002 (Ceramic-filled PTFE composite)
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Layer Count: 6-Layer high-density interconnect (HDI)
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Board Thickness: 1.0mm (Nominal)
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Copper Weight: 2oz Finished Copper (Ideal for power handling and thermal dissipation)
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Surface Finish: Hard Gold (Electrolytic Gold) for superior wear resistance and conductivity.
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Reliability: Low Z-axis CTE (24 ppm/°C) for stable plated through-holes (PTH).
Why Choose RT/duroid 6002 for Aerospace Applications?
1. Unmatched Dimensional Stability
One of the primary challenges in aerospace PCB manufacturing is managing thermal expansion. The RT/duroid 6002 material features an in-plane expansion coefficient matched to copper. This eliminates the stress typically found in multi-layer lamination, preventing delamination and ensuring the longevity of surface-mounted assemblies even under extreme thermal cycling.
2. Advanced Hard Gold Surface Finish
Unlike standard ENIG, our Hard Gold finish is designed for durability. It provides a robust, low-resistance interface for edge connectors and mission-critical contact points. This makes the board ideal for modular aerospace systems that require repeated mating cycles without degradation of signal quality.
3. Low Outgassing for Space Missions
Meeting the strict requirements for vacuum environments, the RT/duroid 6002 exhibits low outgassing properties. Whether it’s for a Low Earth Orbit (LEO) satellite or a deep-space probe, this board ensures that sensitive optical or electronic equipment remains uncontaminated by material vapors.
4. Optimized for Complex RF Circuits
The 6-layer configuration, combined with 2oz copper, offers the perfect balance between high-speed signal routing and power distribution. It is the preferred substrate for:
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Phased Array Antennas
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Ground-Based and Airborne Radar Systems
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Global Positioning System (GPS) Antennas
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Automated Collision Avoidance Systems (ACAS)
Why Partner with PCBSync?
At PCBSync, we understand that in aerospace, there is no room for error. We specialize in processing high-performance Rogers materials, maintaining the tight tolerances required for IPC Class 3 standards. Every board undergoes rigorous electrical testing and DFM (Design for Manufacturing) review to ensure your project transitions seamlessly from prototype to mission-critical deployment.
Elevate your communication hardware with the reliability of RT/duroid 6002. Contact PCBSync today for a technical consultation or a custom quote.
